EEPROM, 64X16, Serial, CMOS, PDSO8, SOP-8
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Parts packaging code | SOIC |
| package instruction | LSOP, SOP8,.25 |
| Contacts | 8 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Data retention time - minimum | 10 |
| Durability | 100000 Write/Erase Cycles |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e0 |
| length | 5.2 mm |
| memory density | 1024 bi |
| Memory IC Type | EEPROM |
| memory width | 16 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 64 words |
| character code | 64 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 64X16 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LSOP |
| Encapsulate equivalent code | SOP8,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, LOW PROFILE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 2/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.7 mm |
| Serial bus type | MICROWIRE |
| Maximum standby current | 4e-7 A |
| Maximum slew rate | 0.002 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 1.8 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN LEAD |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 4.4 mm |
| write protect | HARDWARE/SOFTWARE |
| Base Number Matches | 1 |
| S-29L131ADFE-TB | S-29L131ADFE-TBG | S-29L221ADFE-TBG | S-29L221ADFE-TB | S-29L331ADFE-TB | S-29L331ADFE-TBG | |
|---|---|---|---|---|---|---|
| Description | EEPROM, 64X16, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 64X16, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 128X16, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 128X16, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 256X16, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 256X16, Serial, CMOS, PDSO8, SOP-8 |
| Is it lead-free? | Contains lead | Lead free | Lead free | Contains lead | Contains lead | Lead free |
| Is it Rohs certified? | incompatible | conform to | conform to | incompatible | incompatible | conform to |
| Parts packaging code | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
| package instruction | LSOP, SOP8,.25 | LSOP, | LSOP, | LSOP, SOP8,.25 | LSOP, SOP8,.25 | LSOP, |
| Contacts | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compli | compli | compli | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-30 code | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609 code | e0 | e6/e2 | e6/e2 | e0 | e0 | e6/e2 |
| length | 5.2 mm | 5.2 mm | 5.2 mm | 5.2 mm | 5.2 mm | 5.2 mm |
| memory density | 1024 bi | 1024 bi | 2048 bi | 2048 bi | 4096 bit | 4096 bit |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 16 | 16 | 16 | 16 | 16 | 16 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 |
| word count | 64 words | 64 words | 128 words | 128 words | 256 words | 256 words |
| character code | 64 | 64 | 128 | 128 | 256 | 256 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | 64X16 | 64X16 | 128X16 | 128X16 | 256X16 | 256X16 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | LSOP | LSOP | LSOP | LSOP | LSOP | LSOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE, LOW PROFILE |
| Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED | 260 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.7 mm | 1.7 mm | 1.7 mm | 1.7 mm | 1.7 mm | 1.7 mm |
| Serial bus type | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | TIN LEAD | TIN BISMUTH/TIN SILVER | TIN BISMUTH/TIN SILVER | TIN LEAD | TIN LEAD | TIN BISMUTH/TIN SILVER |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | 10 | 10 | NOT SPECIFIED | NOT SPECIFIED | 10 |
| width | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| Maker | - | - | ABLIC | ABLIC | ABLIC | ABLIC |
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