1% Thick Film Chip Resistors
FEATURES
•
•
•
•
•
•
Temperature Range: -55°C ~ +125°C
High purity alumina substrate
Wave or flow solderable
Excellent high frequency characteristics
Wrap around termination
Inner electrode protection
CR1 Series
DERATING CURVE
Rated Load (%)
REEL DIMENSIONS (mm)
¿13 –0.5
50
min.
178
2.0
10 –1
Ambient Temperature (¡C)
PART NUMBERING SYSTEM
2
9
Series
0
1
0
Ohms
K
SERIES, SIZE, WATTAGE, VOLTAGE, AND DIMENSIONS
L
W
D
C
t
Series
290
292
302
304
Case Size
1206
0805
0603
0402
Power
Rating
1/8
1/10
1/10
1/16
Voltage (max.)
W.V.
O.V.
200
400
150
300
50
25
100
50
L
3.1 ± 0.15
2.0 ± 0.15
1.6 ± 0.10
1.00 ± 0.1
Dimensions (mm)
W
C
D
1.55 ± 0.15
0.45 ± 0.2
0.45 ± 0.2
1.25 ± 0.15
0.40 ± 0.2
0.40 ± 0.2
0.8 ± 0.15
0.5 ± 0.05
0.30 ± 0.2
0.2 ± 0.1
0.30 ± 0.2
0.25 ± 0.1
t
0.55 ± 0.10
0.55 ± 0.10
0.45± 0.10
0.35 ± 0.05
XICON PASSIVE COMPONENTS • (800) 628-0544
XC-600036
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
Date Revised: 9/28/05
1% Thick Film Chip Resistors
STANDARD STOCKED VALUES (Ω)
10
10.2
10.5
10.7
11
11.3
11.5
11.8
12.1
12.4
12.7
13
13.3
13.7
14
14.3
14.7
15
15.4
15.8
16.2
16.5
16.9
17.4
17.8
18.2
18.7
19.1
19.6
20
20.5
21
21.5
22.1
22.6
23.2
23.7
24.3
24.9
25.5
26.1
26.7
27.4
28
28.7
29.4
30.1
30.9
31.6
32.4
33.2
34
34.8
35.7
36.5
37.4
38.3
39.2
40.2
41.2
42.2
43.2
44.2
45.3
46.4
47.5
48.7
49.9
51.1
52.3
53.6
54.9
56.2
57.6
59
60.4
61.9
63.4
64.9
66.5
68.1
69.8
71.5
73.2
75
76.8
78.7
80.6
82.5
84.5
86.6
88.7
90.9
93.1
95.3
97.6
100
102
105
107
110
113
115
118
121
124
127
130
133
137
140
143
147
150
154
158
162
165
169
174
178
182
187
191
196
200
205
210
215
221
226
232
237
243
249
255
261
267
274
280
287
294
300
301
309
316
324
332
340
348
357
365
374
383
392
402
412
422
432
442
453
464
475
487
499
511
523
536
549
562
CR1 Series
665 1.13K 1.91K 3.16K 5.36K 9.09K 15.4K 26.1K 43.2K 73.2K 124K 210K 348K 590K
681 1.15K 1.96K 3.24K 5.49K 9.31K 15.8K 26.7K 44.2K 75K 127K 215K 357K 604K
698 1.18K 2.0K 3.32K 5.62K 9.53K 16.2K 27.4K 45.3K 76.8K 130K 221K 365K 619K
715 1.21K 2.05K 3.4K 5.76K
732 1.24K 2.1K 3.48K 5.9K
750 1.27K 2.15K 3.57K 6.04K
768 1.3K 2.21K 3.65K 6.19K
9.76K
10K
10.2K
10.5K
16.5K
16.9K
17.4K
17.8K
28K
28.7K
29.4K
30K
46.4K
47.5K
48.7K
49.9K
78.7K
80.6K
82.5K
84.5K
133K
137K
140K
143K
226K
232K
237K
243K
374K
383K
392K
402K
634K
649K
665K
681K
787 1.33K 2.26K 3.74K 6.34K 10.7K 18.2K 30.1K 51.1K 86.6K 147K 249K 412K 698K
806 1.37K 2.32K 3.83K 6.49K 11.K 18.7K 30.9K 52.3K 88.7K 150K 255K 422K 715K
825 1.40K 2.37K 3.92K 6.65K 11.3K 19.1K 31.6K 53.6K 90.9K 154K 261K 432K 732K
845 1.43K 2.43K 4.02K 6.81K 11.5K 19.6K 32.4K 54.9K 93.1K 158K 267K 442K 750K
866 1.47K 2.49K 4.12K 6.98K 11.8K 20K 33.2K 56.2K 95.3K 162K 274K 453K 768K
887 1.5K 2.55K 4.22K 7.15K 12.1K 20.5K 34.K 57.6K 97.6K 165K 280K 464K 787K
909 1.54K 2.61K 4.32K 7.32K 12.4K 21.K 34.8K 59.0K 100K 169K 287K 475K 806K
931 1.58K 2.67K 4.42K 7.5K 12.7K 21.5K 35.7K 60.4K 102K 174K 294K 487K 825K
953 1.62K 2.74K 4.53K 7.68K 13K 22.1K 36.5K 61.9K 105K 178K 300K 499K 845K
576 976 1.65K 2.8K 4.64K 7.87K 13.3K 22.6K 37.4K 63.4K 107K 182K 301K 511K 866K
590 1.0K 1.69K 2.87K 4.75K 8.06K 13.7K 23.2K 38.3K 64.9K 110K 187K 309K 523K 887K
604 1.02K 1.74K 2.94K 4.87K 8.25K 14.K 23.7K 39.2K 66.5K 113K 191K 316K 536K 909K
619 1.05K 1.78K 3.0K 4.99K 8.45K 14.3K 24.3K 40.2K 68.1K 115K 196K 324K 549K 931K
634 1.07K 1.82K 3.01K 5.11K 8.66K 14.7K 24.9K 41.2K 69.8K 118K 200K 332K 562K 953K
649 1.1K 1.87K 3.09K 5.23K 8.87K 15K 25.5K 42.2K 71.5K 121K 205K 340K 576K 976K
1M
1
CONSTRUCTION
No.
1
2
3
4
5
6
Part Name
Protective coating: Epoxy
Al
2
O
3
high purity alumina substrate: Al 96fi
Resistive element: metal film
Termination (Inner): Ag/Pd
Termination (Between): Ni plating film
Termination (Outer): Sn plating film
4
2
3
4
5
CHARACTERISTICS
Characteristics
Limits
Test Methods
( JIS C 5201-1 )
5.2 Natural resistance change per temp.
degree centigrade.
R
2
-R
1
x10
6
(PPM/°C)
R
1
(t
2
-t
1
)
R
1
: Resistance value at room temperature (t
1
)
R
2
: Resistance value at room temp.plus 100°C (t
2
)
5.5 Permanent resistance change after the
application of a potential of 2.5 times RCWV
for 5 seconds.
5.6 Apply 500V DC between protective coating
and termination for 1 minute
5.7 Apply 500V AC between protective coating
and termination for 1 minute
Temperature
coefficient
1Ω ~ 10Ω
≤
±400 PPM / °C
11Ω ~ 10MΩ
≤
±200 PPM / °C
Short time
overload
Resistance change rate is
± (2.0 % + 0.1Ω) Max.
Insulation
resistance
Dielectric
withstanding
voltage
Terminal bending
1,000M
Ω
or more
No evidence of flashover
mechanical damage,arcing or
insulation break down.
±(1.0% +0.05Ω) Max.
6.1.4 Twist of Test Board:
Y/X=5/90mm for 10 seconds
XICON PASSIVE COMPONENTS • (800) 628-0544
XC-600036
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
Date Revised: 9/28/05
1% Thick Film Chip Resistors
CHARACTERISTICS
(Cont.)
Characteristics
Limits
Test Methods
( JIS C 5201-1 )
7.4 Resistance change after continuous
5 cycles for duty shown below:
Step
Temperature
1
-55°C ±3°C
2
Room temp.
3
+155°C ±2°C
4
Room temp.
CR1 Series
Temperature
cycling
± (1.0% + 0.05Ω) Max.
Time
30 mins
10~15 mins
30 mins
10~15 mins
Load life in
humidity
Resistance change rate is
± (3.0% + 0.1Ω) Max.
7.9 Resistance change after 1,000 hours
(1.5 hours "on", 0.5 hour "off") at RCWV
in a humidity chamber controlled at
40°C ± 2°C and 90 to 95 % relative humidity
7.10 Permanent resistance change after 1,000 hours
operating at RCWV, with duty cycle of
( 1.5 hours "on", 0.5 hour "off" ) at 70°C ± 2°C ambient
Solder bath method
Pre-Heat: 100 ro 105°C, 30 ±5 sec.
Temperature: 265 ± 3°C, 5 +1/-0 sec
Reflow soldering method
Peak: 250 +5/-0°C
230°C or higher, 30 ±10Sec.
Solder iron method
Bit temperature: 350° ±10°C
Application time of soldering iron: 3 +1/-0 seconds
Load life
Resistance change rate is
± (3.0% + 0.1Ω) Max.
Soldering Heat
Electrical characteristics shall be satisfied.
Without distinct deformation in
appearance.
Solderability
95% Coverage min.
6.5 Test temperature of solder: 245° ±3°C
Dipping them solder: 2~3 seconds
XICON PASSIVE COMPONENTS • (800) 628-0544
XC-600036
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
Date Revised: 9/28/05
Microcontroller MCU
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