EEWORLDEEWORLDEEWORLD

Part Number

Search

501R18N181JSE-ROHS

Description
Ceramic Capacitor, Multilayer, Ceramic, 500V, 5% +Tol, 5% -Tol, NP0, -/+30ppm/Cel TC, 0.00018uF, 1206,
CategoryPassive components    capacitor   
File Size390KB,11 Pages
ManufacturerEXXELIA Group
Environmental Compliance
Download Datasheet Parametric View All

501R18N181JSE-ROHS Overview

Ceramic Capacitor, Multilayer, Ceramic, 500V, 5% +Tol, 5% -Tol, NP0, -/+30ppm/Cel TC, 0.00018uF, 1206,

501R18N181JSE-ROHS Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid843922974
package instruction, 1206
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance0.00018 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high1.8 mm
JESD-609 codee3
length3.2 mm
multi-layerYes
negative tolerance5%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package formSMT
method of packingTR
positive tolerance5%
Rated (DC) voltage (URdc)500 V
seriesHI-VOLTAGE(SMD)
size code1206
Temperature characteristic codeNP0
Temperature Coefficient30ppm/Cel ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
width1.6 mm
HIGH VOLTAGE MULTILAYER
CERAMIC CAPACITORS
D
ESCRIPTION
:
RoHS compliant
(*)
Case sizes: 0805 to 7565
Rated voltage: 200V to 10KV
Dielectric Type I and II
SMD and leaded versions
* Non-RoHS version still maintained for current applications.
The High voltage series is intended for such typical application as high voltage power supplies
and high voltage multiplier circuits. Available in bare chips, they can be used in surface mounting
or hybrid circuit applications. Their multilayer construction offers significant size and space
saving advantage. Combination of standard case sizes may be obtained for special applications.
They are suited for use in commercial, industrial and High-Rel military circuits.
II. Description
The capacitors here mentioned concern the voltage equal or higher than 1KV, in bare chips or
leaded devices. The dielectrics used are from 2 types: ultra stable NP0 and X7R dielectrics.
Bare chips:
Radial leaded devices:
The standard wires are straight but on special request they can be
bended to meet customer specification. Ask us for specific demand!
28/03/2011
1/11
High_Voltage_ML_Capacitors-Ed11
TEMEX CERAMICS reserves the right to modify herein specifications and information at any time when necessary to provide optimum performance and cost.
I. Foreword
After CC2541 is in master mode and searches for slaves to connect, the host can receive the data sent by the slave, but the slave cannot receive the data sent by the master?
After CC2541 master mode (1) searches for slave (2) and connects, the host (1) can receive the data sent by the serial port of the slave (2), but the slave (2) cannot receive the data sent by the seri...
1021256354 Wireless Connectivity
Review summary: Beetle ESP32-C3 free review
Event details: [Beetle ESP32-C3 free review]Updated to 2022-09-19Evaluation report summary:@sonicfirr【Beetle ESP32-C3】10. MQTT access to OneNET【Beetle ESP32-C3】IX. OLED clock and weather assistant log...
EEWORLD社区 Special Edition for Assessment Centres
OrCAD Library Builder is not available
[i=s]This post was last edited by Rareyee on 2018-6-13 10:40[/i] After installing Library Builde using the method from Wu Chuanbin's blog, it pops up a message saying it cannot connect to the network[...
Rareyee PCB Design
Changes in the camera's standard interface
Keyword: [b]Camera[/b] When we discuss the advantages and disadvantages of a [url=http://www.yucoo.com/][color=#0000ff]camera[/color][/url], in addition to conventional items such as the size of the p...
gzycxfj Industrial Control Electronics
Small software to convert bin to hex format
I have a small software that can convert bin to hex format. Anyone want it? [[i] This post was last edited by Simon on 2009-5-12 20:20 [/i]]...
西门 FPGA/CPLD
【Project Outsourcing】Embedded development based on Feiling 6410 core board
Embedded development based on Feiling 6410 core boardProject budget:¥ 19,999~20,001 Development cycle: 30 days Project Category: Embedded Bidding requirements:Project Tags:S3C6410 Bootload SD 2.0 Port...
CSTO项目交易 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1721  2606  332  2530  926  35  53  7  51  19 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号