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5962-01-069-5669

Description
IC,PROM,512X8,TTL,DIP,24PIN,CERAMIC
Categorystorage    storage   
File Size170KB,3 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric View All

5962-01-069-5669 Overview

IC,PROM,512X8,TTL,DIP,24PIN,CERAMIC

5962-01-069-5669 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRenesas Electronics Corporation
package instructionDIP, DIP24,.6
Reach Compliance Codenot_compliant
Is SamacsysN
Maximum access time70 ns
JESD-30 codeR-XDIP-T24
memory density4096 bit
Memory IC TypeOTP ROM
memory width8
Number of terminals24
word count512 words
character code512
Maximum operating temperature70 °C
Minimum operating temperature
organize512X8
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.6
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Maximum slew rate0.17 mA
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
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