Qualification Test
501-57197
Report
24-MAR-2006 Rev C
AMPMODU, 2.0mm PITCH BOARD-TO-BOARD
CONNECTOR
1.
INTRODUCTION
1.1. Purpose
Testing was performed on the
AMPMODU, 2.0mm PITCH BOARD-TO-BOARD
CONNECTOR
to determine its conformance to the requirements of Product
Specification 108-57197 Rev B.
1.2. Scope
This report covers the electrical, mechanical, and environmental performance of
AMPMODU, 2.0mm PITCH BOARD-TO-BOARD CONNECTOR
type
manufactured by the Global Personal Computer Division.
1.3. Conclusion
AMPMODU, 2.0mm PITCH BOARD-TO-BOARD CONNECTOR
Connector type
connector meets the electrical, mechanical, and environmental performance
requirements of Product Specification 108-57197 Rev B.
1.4. Product Description
AMPMODU, 2.0mm PITCH BOARD-TO-BOARD CONNECTOR
Connector type
connector is designed for printed circuit board applications. The contacts are
copper alloy, gold plated on the contact interface and Gold or Tin plating on the
soldertail, all over nickel under-plated. The housing material is glass filled
insulating polymer, UL94V-0.
1.5. Test Samples
The test samples were randomly selected from normal current production lots,
and the following part numbers were used for test:
Test Group
A, B, C, D, E, F, G, H, I, J
Quantity
5ea.
Description
AMPMODU, 2.0mm PITCH
BOARD-TO-BOARD CONNECTOR
DR
Oblic Hu
DATE
24-Mar-2006
CHK
Wei-Jer Ke
DATE
24-Mar-2006
TYCO Holdings (Bermuda) VII LTD.
Taiwan Branch
3F, No. 45, Dongsing Road,
Taipei,11070, Taiwan. ROC.
TEL : 886-2-8768-2788
. This specification is a controlled document.
1 of 4
LOC DW
501-57197
1.6. Qualification Test Sequence
Test Group
Para Ref
3.5.1
3.5.2.1
3.5.2.2
3.5.2.3
3.5.3.1
3.5.3.1
3.5.3.2
3.5.3.3
3.5.3.4
3.5.4.1
3.5.4.2
3.5.4.3
3.5.4.4
3.5.4.5
3.5.4.6
3.5.4.7
3.5.4.8
Test of Examination
Examination of Product
Termination Resistance
Insulation Resistance
Dielectric Withstanding Voltage
Individual Insert Force
Individual Extraction Force
Receptacle Contact Retention Force
Post Retention Force
Solderability
Vibration
Temperature Life
Humidity, Steady State
Thermal Shock
Resistance to Soldering Heat
Durability
Salt Spray
Resistance to Soldering Heat
A
1,5
2,4
B
1,9
8
C
1,6
2,5
3
D
1,5
2,4
E
1,5
2,4
F
1,4
G
1,3
H
1,3
I
1,5
2,4
J
1,3
Test Sequence (a)
2,5
3,6
2
2
2
3
3
4
3
3
4,7
3
2
Figure 1.
NOTE: (a) The numbers indicate sequence in which tests were performed.
Rev
C
2 of 4
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