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MT8VDDT3264AY-40BXX

Description
DDR DRAM Module, 32MX64, 0.7ns, CMOS, LEAD FREE, UDIMM-184
Categorystorage    storage   
File Size350KB,15 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Environmental Compliance
Download Datasheet Parametric View All

MT8VDDT3264AY-40BXX Overview

DDR DRAM Module, 32MX64, 0.7ns, CMOS, LEAD FREE, UDIMM-184

MT8VDDT3264AY-40BXX Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicron Technology
Parts packaging codeDIMM
package instructionDIMM,
Contacts184
Reach Compliance Codeunknown
ECCN codeEAR99
access modeSINGLE BANK PAGE BURST
Maximum access time0.7 ns
Other featuresAUTO/SELF REFRESH
JESD-30 codeR-XDMA-N184
JESD-609 codee4
memory density2147483648 bit
Memory IC TypeDDR DRAM MODULE
memory width64
Number of functions1
Number of ports1
Number of terminals184
word count33554432 words
character code32000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32MX64
Package body materialUNSPECIFIED
encapsulated codeDIMM
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
self refreshYES
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)2.5 V
Nominal supply voltage (Vsup)2.6 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceGold (Au)
Terminal formNO LEAD
Terminal locationDUAL
Maximum time at peak reflow temperature30
256MB, 512MB (x64, SR) 184-Pin DDR SDRAM UDIMM
Features
DDR SDRAM UDIMM
MT8VDDT3264A – 256MB
MT8VDDT6464A – 512MB
For component data sheets, refer to Micron’s Web site:
www.micron.com
Features
• 184-pin, unbuffered dual in-line memory module
(UDIMM)
• Fast data transfer rates: PC2100, PC2700, or PC3200
• 256MB (32 Meg x 64), and 512MB (64 Meg x 64)
• V
DD
= V
DD
Q = +2.5V (-40B: V
DD
= V
DD
Q)
• V
DDSPD
= +2.3V to +3.6V
• 2.5V I/O (SSTL_2-compatible)
• Internal pipelined double data rate (DDR)
2n-prefetch architecture
• Bidirectional data strobe (DQS) transmitted/
received with data—that is, source-synchronous
data capture
• Differential clock inputs (CK and CK#)
• Multiple internal device banks for concurrent
operation
• Single rank
• Selectable burst lengths (BL): 2, 4, or 8
• Auto precharge option
• Auto refresh and self refresh modes: 7.8125µs
maximum average periodic refresh interval
• Serial presence-detect (SPD) with EEPROM
• Selectable CAS latency (CL) for maximum
compatibility
• Gold edge contacts
Figure 2:
Alternative Layout
PCB height: 31.75mm (1.25in)
Figure 3:
Reduced-Height Layout
PCB height: 28.58mm (1.125in)
Options
• Operating temperature
Commercial (0°C
T
A
+70°C)
Industrial (–40°C
T
A
+85°C)
• Package
184-pin DIMM (standard)
184-pin DIMM (Pb-free)
• Memory clock, speed, CAS latency
5.0ns (200 MHz), 400 MT/s, CL = 3
6.0ns (167 MHz), 333 MT/s, CL = 2.5
7.5ns (133 MHz), 266 MT/s, CL = 2
2
7.5ns (133 MHz), 266 MT/s, CL = 2
2
7.5ns (133 MHz), 266 MT/s, CL = 2.5
2
1
Marking
None
I
G
Y
-40B
-335
-262
-26A
-265
184-Pin UDIMM (MO-206) Figures
Figure 1:
Standard Layout
PCB height: 31.75mm (1.25in)
Notes: 1. Contact Micron for industrial temperature
module offerings.
2. Not recommended for new designs.
PDF: 09005aef80867ab3/Source: 09005aef80867a99
DD8C32_64x64A.fm - Rev. J 8/08 EN
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
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