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1-1640294-1

Description
BGA SOCKET,196 CONTACTS,14X14,SURFACE MOUNT TERMINAL
CategoryThe connector    socket   
File Size4MB,5 Pages
ManufacturerTE Connectivity
Websitehttp://www.te.com
Environmental Compliance  
Download Datasheet Parametric View All

1-1640294-1 Overview

BGA SOCKET,196 CONTACTS,14X14,SURFACE MOUNT TERMINAL

1-1640294-1 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid303468189
Reach Compliance Codecompliant
ECCN codeEAR99
YTEOL0
body width0.768 inch
subject depth0.116 inch
body length0.768 inch
Contact structure14X14
Contact to complete cooperationAU
Contact styleRND PIN-SKT
current rating4 A
Device slot typeIC SOCKET
Type of equipment usedBGA196
Shell materialKAPTON
Insulation resistance1000000000 Ω
Plug contact pitch0.031 inch
Installation methodSTRAIGHT
Number of contacts196
Maximum operating temperature90 °C
Minimum operating temperature
PCB contact patternRECTANGULAR
Termination typeSURFACE MOUNT
Matrix Series BGA Sockets
Featuring HXC Material System
DESCRIPTION
Tyco Electronics is pleased to announce
HXC 125 polymer. The sockets are fully
The unique design of the BGA socket uses
an anti-overstress feature which protects
ball to rest in. This well acts as an
the contact and also provides a well for the
alignment feature which centers the BGA
Corner frames provide for gross alignment
of the package to the socket.
KEY FEATURES
• No tooling or set up charges
the Matrix Series of BGA Sockets utilizing
arrayed matrixes of contacts available on
• Full array stops provide anti-overstress
protection and fine alignment
• Compact design minimizes real
estate required
0.80mm, 1.00mm, and 1.27mm pitch. The
solderless, compression mount HXC 125
contact system allows you to test a BGA
device without attaching it directly to the
board. The HXC 125 polymer provides
electrically transparent signal transfer.
ball to the HXC 125 polymer material.
• Multiple cycles
APPLICATIONS
The HXC 125 polymer system provides
temperature polymer compound that has
proprietary material consists of a high
a highly conductive interconnect. This
• Fully arrayed patterns available in
1.27mm, 1.00mm and 0.80mm.
•Allows socketing of BGA devices during
prototyping and development
• Sockets designed to accept JEDEC
standard BGA’s
• Complete hardware kits available
• Bolster plate provides support,
eliminating board bow
been embedded with metalized
micro-contacts just 0.635mm in diameter
are held in a grid pattern by a thin
characteristics are optimized.
and less than 1mm high. The contacts
polyimide substrate. When mechanically
compressed, the contacts electrical
particles. The material is formed into
• Accommodates multiple ball sizes
• Unique corner frame design allows
for gross alignment of the package
to the socket
• Array sizes up to 40 x 40 (1.27mm), 50 x
50 (1.00mm) and 60 x 60 (0.80mm).
• Spring plate provides even force
distribution of compression load
• Single screw spring plate allows
for easy actuation
FOR MORE INFORMATION
Technical Support
• Developed for use in test, development
and production environments
• Solderless, compression mount
HXC 125 polymer allows for easy
socket replacement
Internet:
http://www.tycoelectronics.com
USA: 1-800-522-6752
UK: 44-1908-574289
Canada: 1-905-470-4425
Japan: 81-44-844-8013

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