NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision M (September 2015) to Revision N
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Page
Changed update typical application drawing and change pin names from Vin, Vout to IN and OUT ...................................
1
Changes from Revision L (June 2015) to Revision M
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Changed split out ESD values by specific pins .....................................................................................................................
4
Changed correct junction-to-case and junction-to-board values (typo from last format update) ..........................................
5
Changes from Revision K (April 2013) to Revision L
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Changed "Nine" to "Assorted" ................................................................................................................................................
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Added
Pin Configuration and Functions
section,
ESD Ratings
table,
Feature Description
section,
Device Functional
Modes, Application and Implementation
section,
Power Supply Recommendations
section,
Layout
section,
Device
and Documentation Support
section, and
Mechanical, Packaging, and Orderable Information
section ..............................
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Changed text of NC pin description .......................................................................................................................................
3
Changed thermal value in footnote 3 ....................................................................................................................................
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Changed thermal values to TI measure ................................................................................................................................
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Changes from Revision J (January 2009) to Revision K
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Changed layout of National Data Sheet to TI format ...........................................................................................................
1. Selection of board materials The substrates of printed circuit boards include organic and inorganic types. The most important properties of the substrate are the dielectric constant εr, dissipation...
In response to the call for disassembly on the forum, I disassembled the CCB U-Shield. Some readers may ask, "Don't you want money? Why disassemble the U-Shield?" Don't worry, I'm not that stupid. Thi...
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PCB Design
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