UPDS3100
3 Amp High Voltage Schottky Barrier
Rectifier PowerDI™ 5
SCOTTSDALE DIVISION
DESCRIPTION
The UPDS3100 offers a small and powerful surface mount package for a
high voltage 100 Volt, 3 Amp rated Schottky with low forward voltage and
low leakage current. For critical applications requiring very fast switching,
these higher voltage Schottkys with their “hot carrier” features provide
extremely fast switching to replace conventional ultrafast rectifiers. The
very low thermal resistance of the PowerDI™5 package design also
permits cooler operating junction temperatures for minimal reverse leakage
currents and lower power loss.
APPEARANCE
WWW .
Microsemi
.C
OM
PowerDI™5
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
FEATURES
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Guard ring die construction for transient protection
Low power loss, high efficiency
Low forward voltage drop
Low reverse leakage current
High junction temperature capability
High forward surge current capability
Environmentally friendly molding compound (no Br, Sb)
Low inductive parasitics for minimal Ldi/dt effects
Lead-Free Finish & RoHS Compliant per EU Directive Rev
13.2.2003 (glass and high temperature solder
exemptions per Annex Notes 5 and 7 therein)
APPLICATIONS / BENEFITS
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Silicon Schottky (hot carrier) rectifier for minimal
t
rr
and elimination of reverse-recovery oscillations
to reduce need for EMI filtering
•
High reverse voltage rating of 100 V (70 V rms)
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For use in high-frequency switching power
supplies, inverters, free wheeling, polarity
protection, and “O-Ring” applications
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Low power loss and high efficiency
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Low profile package
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Robust package configuration for pick-and-place
handling
MAXIMUM RATINGS
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Junction & Storage Temperature (T
J
, T
STG
): -65 to +150
o
C
Average Rectified Output Current (I
O
): 3 Amps for Single
phase, half wave, 60 Hz, resistive or inductive load (also
see Figure 5). For capacitive load, derate current by
20%.
Peak Repetitive Reverse Voltage (V
RRM
): 100 V Working
Peak Reverse Voltage (V
RWM
): 100 V
DC Blocking Voltage (V
R
): 100 V
RMS Reverse Voltage (V
R(RMS)
): 70 V
Non-Repetitive Peak Forward Surge Current @ 8.3 ms
Single half sine-wave Superimposed on Rated Load
(I
FSM
): 90A
Thermal Resistance Junction to bottom of case (R
θJC
) or
o
Junction to Soldering Point (R
θJS
): 6.0 C/W
Thermal Resistance (R
θJA
): 100
o
C/W (Note 1), 75
o
C/W
(Note 2), 50
o
C/W (Note 3).
•
MECHANICAL AND PACKAGING
Case Material: Molded Plastic, Environmentally
Friendly “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture sensitivity: Level 1 per J-STD-020C.
Terminals: Finish – Matte Tin annealed over
Copper lead frame
(
per JESD97)
Solderable per MIL-STD-202, Method 208
Marking: See marking information on page 3
Polarity: See Diagram
Weight: 0.093 grams (approx.)
Tape & Reel Option: 5000/reel (13”)
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UPDS3100
Notes: 1. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout (pg 4)
2. Polyimide PCB, 2 oz. Copper, minimum recommended pad layout (pg 4)
3. Polyimide PCB, 2 oz. Copper with larger Cathode pad dimensions
9.4 mm x 7.2 mm and Anode pad dimensions 2.7 mm x 1.6 mm
Copyright
©
2005
2-3-2005 REV 0
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
MCU
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