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210818-1

Description
DIP32, IC SOCKET
CategoryThe connector    socket   
File Size125KB,1 Pages
ManufacturerTE Connectivity
Websitehttp://www.te.com
Download Datasheet Parametric View All

210818-1 Overview

DIP32, IC SOCKET

210818-1 Parametric

Parameter NameAttribute value
Objectid1666982629
Reach Compliance Codeunknown
ECCN codeEAR99
Contact to complete cooperationGOLD (10)
Contact completed and terminatedTIN LEAD OVER NICKEL
Device slot typeIC SOCKET
Type of equipment usedDIP32
Shell materialPOLYETHYLENE
JESD-609 codee0
Manufacturer's serial number210818
Number of contacts32
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210818-1 Product Details
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DIP Sockets
Always ELV C om pliant
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210818-1
T E I nternal N umber: 2 1 0 8 1 8 - 1
Product Highlights:
l
Socket Style = Standard
l
Through Hole C ontact Termination Type
l
2.54 mm C enterline
l
Row-to-Row Spacing = 15.24 mm
l
32 Positions
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Documentation & Additional Information
Product Drawings:
l
None Available
Catalog Pages/Data Sheets:
l
None Available
Product Specifications:
l
None Available
Application Specifications:
l
None Available
Instruction Sheets:
l
None Available
CAD Files:
l
None Available
Additional Information:
l
Product Line Information
Related Products:
l
Tooling
Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
l
Socket Style
= Standard
l
Number of Positions
= 32
l
Profile = Standard
l
Frame Style
= C losed
l
Leg Style
= Straight
Electrical Characteristics:
l
Insulation Resistance (M?) = 10,000
l
C ontact Resistance (m?) = 30
Termination Related Features:
l
Termination Post Length (mm [in])
= 2.84 [0.112]
l
Solder Tail C ontact Plating = Tin-Lead over Nickel
Body Related Features:
l
C enterline (mm [in])
= 2.54 [0.100]
l
Row-to-Row Spacing (mm [in])
= 15.24 [0.600]
l
Mount Style
= Vertical
Contact Related Features:
l
C ontact Termination Type
= Through Hole
l
C ontact Base Material
= Beryllium C opper
l
C ontact Plating, Mating Area, Material
= Gold (10)
l
C ontact Style
= Screw Machine
l
Mating C ontact Type
= Inner Spring
Housing Related Features:
l
Housing Material = Thermoplastic - GF
Configuration Related Features:
l
Height Above PC Board (mm [in])
= 2.80 [0.110]
Industry Standards:
l
RoHS/ELV C ompliance
= ELV compliant
l
Lead Free Solder Processes
= Not reviewed for lead free solder
process
l
RoHS/ELV C ompliance History = Always was ELV compliant
Conditions for Usage:
l
Temperature Range (?C ) = 105
Packaging Related Features:
l
Packaging Method
= Tube
Other:
l
Brand = AMP
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