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210818-5

Description
DIP32, IC SOCKET
CategoryThe connector    socket   
File Size103KB,1 Pages
ManufacturerTE Connectivity
Websitehttp://www.te.com
Download Datasheet Parametric View All

210818-5 Overview

DIP32, IC SOCKET

210818-5 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Objectid2055190479
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresVERTICAL MOUNT DIP SOCKET
Contact to complete cooperationTIN LEAD
Contact completed and terminatedTIN LEAD OVER NICKEL
Contact materialBERYLLIUM COPPER
Device slot typeIC SOCKET
Type of equipment usedDIP32
Shell materialTHERMOPLASTIC POLYESTER
JESD-609 codee0
Manufacturer's serial number210818
Number of contacts32
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210818-5 Product Details
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DIP Sockets
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210818-5
T E I nternal N umber: 2 1 0 8 1 8 - 5
Product Highlights:
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DIP Socket
l
Number of Positions = 32
l
Row-to-Row Spacing = 15.24 mm
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Through Hole C ontact Termination Type
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Mount Style = Vertical
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Documentation & Additional Information
Product Drawings:
l
None Available
Catalog Pages/Data Sheets:
l
None Available
Product Specifications:
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None Available
Application Specifications:
l
None Available
Instruction Sheets:
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None Available
CAD Files:
l
None Available
Additional Information:
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Product Line Information
Related Products:
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Tooling
Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
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Product Type
= DIP Socket
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Number of Positions
= 32
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Profile = Standard
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Frame Style
= C losed
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Leg Style
= Straight
Electrical Characteristics:
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Insulation Resistance (M?) = 10,000
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C ontact Resistance (m?) = 30
Termination Related Features:
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Termination Post Length (mm [in])
= 2.84 [0.112]
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Solder Tail C ontact Plating = Tin-Lead over Nickel
Body Related Features:
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Row-to-Row Spacing (mm [in])
= 15.24 [0.600]
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Mount Style
= Vertical
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C enterline (mm [in])
= 2.54 [0.100]
Contact Related Features:
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C ontact Termination Type
= Through Hole
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C ontact Base Material
= Beryllium C opper
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C ontact Mating Area Plating Material
= Tin-Lead
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C ontact Style
= Screw Machine
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Mating C ontact Type
= Inner Spring
Housing Related Features:
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Housing Material = Thermoplastic Polyester
Configuration Related Features:
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Height Above PC Board (mm [in])
= 2.80 [0.110]
Industry Standards:
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RoHS/ELV C ompliance
= Not ELV/RoHS compliant
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Lead Free Solder Processes
= Not reviewed for lead free solder
process
Conditions for Usage:
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Temperature Range (?C ) = 105
Packaging Related Features:
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Packaging Method
= Tube
Other:
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Brand = AMP
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2009 Tyco Electronics C orporation All Rights Reserved
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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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