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228-AG30DC

Description
IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder
CategoryThe connector    socket   
File Size42KB,2 Pages
ManufacturerThomas & Betts Corporation
Websitehttp://www.tnb.com/
Download Datasheet Parametric View All

228-AG30DC Overview

IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder

228-AG30DC Parametric

Parameter NameAttribute value
Reach Compliance Codeunknow
ECCN codeEAR99
Other featuresSTAMPED CONTACT
body width0.4 inch
subject depth0.196 inch
body length1.4 inch
Contact to complete cooperationNOT SPECIFIED
Contact materialNOT SPECIFIED
Contact styleSQ PIN-SKT
current rating2 A
Device slot typeIC SOCKET
Type of equipment usedDIP28
Dielectric withstand voltage1000VAC V
Shell materialPOLYESTER
Insulation resistance2000000000000 Ω
Manufacturer's serial number200C
Plug contact pitch0.1 inch
Installation methodSTRAIGHT
Number of contacts28
Maximum operating temperature105 °C
Minimum operating temperature-55 °C
PCB contact patternRECTANGULAR
PCB contact row spacing0.3 mm
Terminal pitch2.54 mm
Termination typeSOLDER
Base Number Matches1
200C Series
A
Stamped Single Beam Contact Closed Bottom DIP Sockets
216-AG19DC
FEATURES:
The Augat 200C Series single beam side wipe contact provides maximum
normal force and consistent mechanical performance in Augat's lowest
cost socket.
• Non-wicking, closed bottom design gives protection against flux and
solder contamination
• Protected open entry for easy insertion of IC's by hand or
by automatic insertion
• Anti-overstress design protects contacts, helps eliminate damage from
oversize leads and maintains consistent normal force
• High normal force results in gas tight connections
Recognized under the Component Program of Underwriters
®
Laboratories, Inc. File No. E111362
PERFORMANCE SPECIFICATIONS:
MECHANICAL
Vibration ........................ Passed MIL-STD-1344, Method 2005.1,
Condition III, 15 G’s
Shock .............................. Passed MIL-STD-1344, Method 2004.1,
Condition G, 100 G’s
Durability ...................... Passed MIL-STD-1344, Method 2016, 50 cycles
Normal Force ................ 170 Grams (6.0 oz.) with .009" x .015"
(0,23 x 0,38) IC lead typ.
Contact Retention .......... 340 Grams (12.0 oz.) minimum
Solderability .................. Passed MIL-STD-202, Method 208
Insertion Force .............. 169 Grams (6.0 oz.) average with a .013" x .020"
(0,33 x 0,51) dia. polished steel pin
Withdrawal Force .......... 43 Grams (1.5 oz.) average with a .009" x .015"
(0,23 x 0,38) dia. polished steel pin
ELECTRICAL
Contact Resistance ........ 10 Milliohms
Contact Rating .............. 2 Amps
Capacitance .................... .5 pF per MIL-STD-202, Method 305
(Adjacent contacts max.)
Insulation Resistance .... 2 x 10
6
Megohms per MIL-STD-1344,
Method 3003.1
Dielectric Withstanding
Voltage ...................... 1,000 Volts RMS per MIL-STD-1344,
Method 3001
ENVIRONMENTAL
Humidity ........................ Passed MIL-STD-1344, Method 1002.2
Thermal Shock .............. Passed MIL-STD-1344, Method 1003.1
Temperature Cycling .... Passed MIL-STD-1344, Method 1003.1
Operation Temperature .. Gold -55°C to +125°C
Tin -55°C to +105°C
Salt Spray ...................... Passed MIL-STD-1344, Method 1001.1
APPLICATION DIMENSIONS:
• PWB Thickness Range: Standard .062" and .092" (1,57 and 2,34)
• PWB Hole Size Range: .055"
±
.002" (1,40
±
0,05)
• IC Pin Dimension Range: .008" x .015" ( 0,20 x 0,38) through
.015" x .023" (0,38 x 0,58), .115" (2,92) min. length
MATERIAL SPECIFICATIONS:
Insulator ........................ Thermoplastic polyester, UL rated 94V-0
Contacts .......................... Phosphor bronze or beryllium copper
Plating ............................ Tin/lead
Quality & Innovation From The
Product Group
A4
Thomas & Betts
1555 Lynnfield Road
Memphis, TN 38119
(901) 682-8221 FAX (901) 537-8805
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