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FCB61C251-20P

Description
Standard SRAM, 256KX1, 20ns, CMOS, PDIP24
Categorystorage    storage   
File Size155KB,4 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric View All

FCB61C251-20P Overview

Standard SRAM, 256KX1, 20ns, CMOS, PDIP24

FCB61C251-20P Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid101181785
package instructionDIP, DIP24,.3
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time20 ns
I/O typeSEPARATE
JESD-30 codeR-PDIP-T24
JESD-609 codee0
memory density262144 bit
Memory IC TypeSTANDARD SRAM
memory width1
Number of terminals24
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX1
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Maximum standby current0.01 A
Minimum standby current4.5 V
Maximum slew rate0.12 mA
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
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