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54ACTQ10LMQB

Description
IC ACT SERIES, TRIPLE 3-INPUT NAND GATE, CQCC20, Gate
Categorylogic    logic   
File Size155KB,8 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Stay tuned Parametric Compare

54ACTQ10LMQB Overview

IC ACT SERIES, TRIPLE 3-INPUT NAND GATE, CQCC20, Gate

54ACTQ10LMQB Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
Reach Compliance Codeunknown
seriesACT
JESD-30 codeS-CQCC-N20
JESD-609 codee0
length8.89 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeNAND GATE
MaximumI(ol)0.024 A
Number of functions3
Number of entries3
Number of terminals20
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQCCN
Encapsulate equivalent codeLCC20,.35SQ
Package shapeSQUARE
Package formCHIP CARRIER
method of packingTUBE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Prop。Delay @ Nom-Sup9.5 ns
propagation delay (tpd)9.5 ns
Certification statusNot Qualified
Schmitt triggerNO
Filter levelMIL-STD-883 Class B
Maximum seat height1.905 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width8.89 mm
Base Number Matches1

54ACTQ10LMQB Related Products

54ACTQ10LMQB 54ACTQ10FMQB 54ACTQ10DMQB
Description IC ACT SERIES, TRIPLE 3-INPUT NAND GATE, CQCC20, Gate IC ACT SERIES, TRIPLE 3-INPUT NAND GATE, CDFP14, CERAMIC, FP-14, Gate IC ACT SERIES, TRIPLE 3-INPUT NAND GATE, CDIP14, Gate
Is it Rohs certified? incompatible incompatible incompatible
Reach Compliance Code unknown unknown unknown
series ACT ACT ACT
JESD-30 code S-CQCC-N20 R-GDFP-F14 R-GDIP-T14
JESD-609 code e0 e0 e0
Load capacitance (CL) 50 pF 50 pF 50 pF
Logic integrated circuit type NAND GATE NAND GATE NAND GATE
MaximumI(ol) 0.024 A 0.024 A 0.024 A
Number of functions 3 3 3
Number of entries 3 3 3
Number of terminals 20 14 14
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
encapsulated code QCCN DFP DIP
Encapsulate equivalent code LCC20,.35SQ FL14,.3 DIP14,.3
Package shape SQUARE RECTANGULAR RECTANGULAR
Package form CHIP CARRIER FLATPACK IN-LINE
method of packing TUBE TUBE TUBE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V
Prop。Delay @ Nom-Sup 9.5 ns 9.5 ns 9.5 ns
propagation delay (tpd) 9.5 ns 9.5 ns 9.5 ns
Certification status Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO
Filter level MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B
Maximum seat height 1.905 mm 2.032 mm 5.08 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount YES YES NO
technology CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form NO LEAD FLAT THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 2.54 mm
Terminal location QUAD DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 8.89 mm 6.35 mm 7.62 mm
Base Number Matches 1 1 1
Maker National Semiconductor(TI ) National Semiconductor(TI ) -
length 8.89 mm - 19.43 mm
package instruction - CERAMIC, FP-14 DIP, DIP14,.3
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