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K4H560838F-TLB0

Description
DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66
Categorystorage    storage   
File Size366KB,24 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric View All

K4H560838F-TLB0 Overview

DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66

K4H560838F-TLB0 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Objectid1122314824
package instructionTSSOP, TSSOP66,.46
Reach Compliance Codecompliant
ECCN codeEAR99
YTEOL2
Maximum access time0.75 ns
Maximum clock frequency (fCLK)133 MHz
I/O typeCOMMON
interleaved burst length2,4,8
JESD-30 codeR-PDSO-G66
JESD-609 codee0
memory density268435456 bit
Memory IC TypeDDR1 DRAM
memory width8
Number of terminals66
word count33554432 words
character code32000000
Maximum operating temperature70 °C
Minimum operating temperature
organize32MX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP66,.46
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
power supply2.5 V
Certification statusNot Qualified
refresh cycle8192
Continuous burst length2,4,8
Maximum standby current0.003 A
Maximum slew rate0.25 mA
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationDUAL
DDR SDRAM 256Mb F-die (x8, x16)
DDR SDRAM
256Mb F-die DDR SDRAM Specification
66 TSOP-II
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL
INFORMATION IN THIS DOCUMENT IS PROVIDED
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office.
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar
applications where Product failure could result in loss of life or personal or physical harm, or any military or
defense application, or any governmental procurement to which special terms or provisions may apply.
3. Any system or application incorporating Samsung Memory Product(s) shall be designed to use or access the
memory addresses in a balanced and proportionate manner. Disproportionate, excessive and/or repeated
access to a particular address may result in reduction of product life.
* Samsung Electronics reserves the right to change products or specification without notice.
Rev. 1.4 July. 2005
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