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BECHS-0.5-230-S9-AF-REDC1

Description
standard card edge connectors HS bec conn, 230pin 0.50mm P, 30u Au
CategoryThe connector   
File Size350KB,2 Pages
ManufacturerAll Sensors
Download Datasheet Parametric View All

BECHS-0.5-230-S9-AF-REDC1 Overview

standard card edge connectors HS bec conn, 230pin 0.50mm P, 30u Au

BECHS-0.5-230-S9-AF-REDC1 Parametric

Parameter NameAttribute value
ManufactureYamaichi Electronics
Product CategoryStandard Card Edge Connectors
Number of Positions230
Mounting AngleRigh
Pitch0.5 mm
Housing MaterialLiquid Crystal Polymer (LCP)
Contact MaterialCopper Alloy
Contact PlatingGold
Current Rating0.5 A
Insulation Resistance250 MOhms
Number of Rows2
Temperature Range- 40 C to + 85 C
Termination StyleSMD
Voltage Rating50 V
serIes BeChs
Board edge ConneCtor 230 pIns hIgh speed VersIon (sMt)
part nuMBer
250MΩ at 500V DC
500V ACrms for 1 minute
40mΩ max.
0.5A
50V DC
–40°C to +85°C
30 times
speCIfICatIons
Insulation Resistance:
Withstanding Voltage:
Contact Resistance:
Current Rating:
Voltage Rating:
Operating Temp. Range:
Mating Cycles:
BeChs - 0.5 - 230 - s9 - *f - r - edC
Series
Pitch: 0.50mm
Pin Count: 230
Orientation: 90°
MaterIals and fInIsh
Insulator:
Contacts:
Contact Plating:
LCP (UL 94V-0)
High Performance Copper Alloy
Contact Area - Selective Gold Flash, 15µ" or 30µ"
Solder Area - Gold Flash
Underplate - Ni
Contact Area Plating
FF = Gold Flash
BF = 15µ" Au
AF = 30µ" Au
Tape and Reel (300pcs. per reel)
Design No. (internal)
features
Transferring High speed data rates to support USB3.0. HDMI, PCIe2.0 and SATA
Designed for use at Automotive and other rough applications
Reliable contact design
Additional fixation of the module with screws at the connector possible
230pins, 90°, 0.5mm pitch
Mating height 5mm
Production site TS16949 certified
For transferring of power we advise to use the Power connector (see next page)
E
MOTIV
AUTO IANT
L
COMP
outlIne dIMensIons
114
SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
Internal ConneCtors

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