EEWORLDEEWORLDEEWORLD

Part Number

Search

4310S-101-1200FAB

Description
Array/Network Resistor, Bussed, Thin Film, 0.12W, 120ohm, 50V, 1% +/-Tol, -100,100ppm/Cel, 9808,
CategoryPassive components    The resistor   
File Size198KB,2 Pages
ManufacturerBourns
Websitehttp://www.bourns.com
Download Datasheet Parametric View All

4310S-101-1200FAB Overview

Array/Network Resistor, Bussed, Thin Film, 0.12W, 120ohm, 50V, 1% +/-Tol, -100,100ppm/Cel, 9808,

4310S-101-1200FAB Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid770486018
Reach Compliance Codenot_compliant
ECCN codeEAR99
structureMolded
JESD-609 codee0
Lead length3.43 mm
lead spacing2.54 mm
Network TypeBussed
Number of terminals10
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package height4.95 mm
Package length24.99 mm
Package formSIP
Package width2.16 mm
Rated power dissipation(P)0.12 W
resistance120 Ω
Resistor typeARRAY/NETWORK RESISTOR
series4300S
size code9808
technologyTHIN FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceTin/Lead (Sn/Pb)
Tolerance1%
Operating Voltage50 V
oH
VE S CO
AV R M
AI SIO PL
LA N IA
BL S NT
E
Features
RoHS compliant* (see How to Order
“Termination” option)
Low profile provides compatibility with
DIPs
Also available in medium profile (4300S -
.250 ”) and high profile (4300K - .350 ”)
Marking on contrasting background
Custom circuits available per factory
*R
4300T, S, K Series - Thin Film Molded SIP
Product Characteristics
Resistance Range
Bussed ...................49.9 to 100K ohms
Isolated ......................20 to 200K ohms
Series.........................20 to 100K ohms
Resistance Tolerance
.........................±0.1 %, ±0.5 %, ±1 %
Temperature Coefficient
..................±100 ppm/°C, ±50 ppm/°C,
±25 ppm/°C
Temperature Range ....-55 °C to +125 °C
Insulation Resistance
..................10,000 megohms minimum
TCR Tracking .........................±5 ppm/°C
Maximum Operating Voltage............50 V
Environmental Characteristics
Thermal Shock and
Power Conditioning ...................... 0.1 %
Short Time Overload ..................... 0.1 %
Terminal Strength ........................ 0.25 %
Resistance to Soldering Heat ....... 0.1 %
Moisture Resistance ..................... 0.1 %
Life .............................................. 0.50 %
Physical Characteristics
Body Material Flammability
...........................Conforms to UL94V-0
Lead Frame Material
..........................Copper, solder coated
Body Material ..................Novolac epoxy
How To Order
Package Power Temp. Derating Curve
(Low Profile, 4300T)
(
)
1.75
1.50
4311T
WATTS
1.25
1.00
.75
.50
.25
4310T
4309T
4308T
4306T
Product Dimensions
27.53
MAX.
(1.084)
22.45
MAX.
(.884)
14.83 MAX.
(.584)
24.99
MAX.
(.984)
19.92
MAX.
(.784)
PIN #1 REF.
4.95
(.195)
MAX.
.381 + .127/ - .000
(.015 + .005/ - 000)
2.54
±
.07
(.100
±
.003*)
TYP.
NON-ACCUM.
3.43 + .38/ - .25
(.135 + .015/ - .010)
1.02
±
.12
(.040
±
.005)
.483
±
.050
TYP.
(.020
±
.002)
2.16
±
.10
(.085
±
.004)
25
70
150
125
AMBIENT TEMPERATURE (
°
C )
0
Package Power Ratings at 70°C
T
S
K
4304 .......... ............ 0.60...... 0.80 watts
4306 ...... 0.75.......... 0.90...... 1.20 watts
4308 ...... 1.00.......... 1.20...... 1.60 watts
4309 ...... 1.13 ................................watts
4310 ...... 1.25.......... 1.50...... 2.00 watts
4311 ...... 1.38 ................................watts
1.02
±
.05
(.0425
±
.002)
.254
±
.050
(.010
±
.002)
Governing dimensions are in metric. Dimensions in parentheses
are inches and are approximate.
*Terminal centerline to centerline measurements made at point of
emergence of the lead from the body.
43 11 T - 101 - 2222 F A B __
Model
(43 = Molded SIP)
Number of Pins
Physical Config.
•T = Low Profile Thin Film
•S = Med. Profile Thin Film
•K = High Profile Thin Film
Electrical Configuration
•101 = Bussed
•102 = Isolated
•106 = Series
Resistance Code
•First 3 digits are significant
•Fourth digit represents the
number of zeros to follow.
Absolute Tolerance Code
•B = ±0.1%
•F = ±1%
•D = ±0.5%
Temperature Coefficient Code
•A = ±100ppm/°C •C = ±25ppm/°C
•B = ±50ppm/°C
Ratio Tolerance (Optional)
•A = ±0.05% to R1 •D = ±0.5% to R1
•B = ±0.1% to R1
Terminations
• L = Tin-plated (RoHS compliant version)
• Blank = Tin/Lead-plated
Consult factory for other available options.
Typical Part Marking
Represents total content. Layout may vary.
PART
NUMBER
4311T-101-
1003BB
YYWW
CIRCUIT
RESISTANCE
CODE
DATE CODE
PIN ONE
INDICATOR
MANUFACTURER'S
TRADEMARK
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
【NXP Rapid IoT Review】Hello Touch
In the previous article, I used the four user buttons on the kit to change the display color of the RGB LED. In addition to the four user buttons, there are four capacitive touch buttons on the kit:I ...
slotg RF/Wirelessly
Still about Filedisk
The partition virtualized by Filedisk cannot be seen in Explorer when the VISTA UAC mechanism is turned on. You can see it by turning off UAC or running Explorer with administrator privileges. Someone...
rebor03 Embedded System
Debate - Is Maradona a good coach?
During the World Cup qualifiers, Maradona took over midway and led Argentina to a thrilling World Cup qualification. Many people say that Maradona is not suitable to be a coach.In this World Cup, Arge...
tiankai001 Talking
Problems with image transmission using twisted pair cables
Problems with using twisted pair cables to transmit images. Images were originally transmitted unbalanced using video cables because they require broadband transmission. Unbalanced transmission has lo...
jek9528 Industrial Control Electronics
Huawei ranks third in global smartphone shipments, while ZTE and Lenovo rank in the top ten
[i=s]This post was last edited by jameswangsynnex on 2015-3-3 19:59[/i] [p=25, null, left][color=rgb(51, 51, 51)][b]Q3 global smartphone shipment TOP10, Huawei ranked third, ZTE and Lenovo entered the...
wstt Mobile and portable
Beginner's guide to FPGA: Modify configured pins in FPGA
Record the small mistakes I encountered when I first learned FPGA: 1 You can use quartus to open the qsf file and modify it. Do not write anything in the unused area. Save and close it and compile it....
zl_felix FPGA/CPLD

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 577  141  2658  201  795  12  3  54  5  17 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号