SnPb end metallization option available upon request
(5% Pb minimum)
Applications
Typical applications include military, space quality and high reliability electronics.
Packaging C-Spec Ordering Options Table (100% Matte Sn and SnPb Terminations)
Packaging Type
1
Bulk Bag/Unmarked
7" Reel/Unmarked
13" Reel/Unmarked
7" Reel/Unmarked/2 mm pitch
2
13" Reel/Unmarked/2 mm pitch
2
1
1
Packaging/Grade
Ordering Code (C-Spec)
Not required (Blank)
TU
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
7081
7082
Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging.
The terms “Marked” and “Unmarked” pertain to laser marking option of capacitors. All packaging options labeled as “Unmarked” will contain
capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information see “Capacitor Marking”.
2
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.
Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging.
“Bulk Bag” packaging option is not available for Gold (Au) termination finish options and case sizes larger than 2225 (5664 Metric).
2
“Waffle Tray” packaging option is not available for case sizes larger than 2225 (5664 Metric).
3
The terms “Marked” and “Unmarked” pertain to laser marking option of components. All packaging options labeled as “Unmarked” will contain
capacitors that have not been laser marked. The option to laser mark is not available on these devices.
3
Reeling quantities are dependent upon chip size and thickness dimension. When ordering using the “T1K0” packaging option, 1812 through 2225 case
size devices with chip thickness of ≥ 1.9 mm (nominal) may be shipped on multiple 7” reels or a single 13” reel. Additional reeling or packaging options
may be available. Contact KEMET for details.
4
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.
5
Additional reeling or packaging options may be available. Contact KEMET for details.
I developed the SM50 wireless module using ADF7021. The 10mW transmission power can penetrate 7-story houses and 1200 meters in an open area. It has strong anti-interference. There are 116 channels th...
This paper discusses the experimental assembly and principle of the input and non-gate of the C4093 series of single-chip microcomputers. This series of single-chip microcomputers is very small in app...
CCS3.3 (3.2) Installation Problems and Solutions & Installation Directory Description [align=left][align=left][font=宋体][size=9pt]I have recently started to learn DSP. First, I have practiced with TI's...
Regarding the connection problem between USB and ActiveSync under WINCE, I used the YLE2440 core board, which was modeled after the baseboard drawing, but some modules were removed. The USB part is ex...
[i=s] This post was last edited by MOAI on 2014-7-20 15:05 [/i] ADCReferenceSet(ADC1_BASE, ADC_REF_INT); After configuration is completed, register GRP(ADC1).REG(ADC_CTL).BFLD(ADC_CTL_VREF) Readable,W...
This program is written to simulate the serial port hardware mechanism. When used, a timed interrupt can be set with a time interval of 1/4 baud rate. The receiving function is called once for ea...[Details]
1 Introduction
The high temperature tester is mainly used for temperature tracking measurement and data acquisition during the heating process. By systematically analyzing the test data, the...[Details]
At present, the traffic congestion in cities is quite serious. According to relevant news reports: In China, the traffic congestion has expanded from megacities such as Beijing, Shanghai, and Guang...[Details]
Microcontrollers (MCUs), which are widely used in automotive electronics, are rapidly facing time and cost pressures. The main advantage of using MCUs has always been to create high-level system in...[Details]
1. Introduction
Since the 1980s, with the continuous development of automotive electronic technology, there are more and more electronic control units in automobiles, such as electronic fuel i...[Details]
The Mobile Industry Processor Interface (MIPI) Alliance is an organization responsible for promoting the standardization of software and hardware in mobile devices. It has released the D-PHY specif...[Details]
System design is a complex process. It is not enough to just use ICs. There are many details to consider. This article uses a high-fidelity music playback system as an example to introduce how to s...[Details]
DSP (digital signal processor) is used more and more frequently in today's engineering applications. There are three main reasons for this: first, it has powerful computing power and is capable of ...[Details]
With the continuous improvement of the requirements of intelligent building security systems and the continuous improvement of people's safety awareness, indoor anti-theft has gradually attracted peop...[Details]
1 Introduction
Ultrasonic waves have strong directivity, slow energy consumption, and can propagate over long distances in a medium, so they are used for distance measurement. Ultrasonic detec...[Details]
Since the No. 4 blast furnace of Handan Iron and Steel was put into operation in 1993, its external equipment has been seriously aged, and the original PLC control system TDC3000 of the hot blast furn...[Details]
Experimental tasks
A DS18B20 is used to form a temperature measurement system. The temperature measurement accuracy reaches 0.1 degrees. The temperature range is between -20 degrees and +50 de...[Details]
Continuity test
A variety of devices need to be checked for continuity, including cable assemblies, printed circuit boards, and connectors to ensure that these components have the expected contin...[Details]
In 2012, more than half of the cars in the European, Japanese and American car markets will be equipped with color displays, navigation systems, satellite communications and other in-vehicle infota...[Details]
RF/Wirelessly
京公网安备 11010802033920号
EEWORLD
