EEWORLDEEWORLDEEWORLD

Part Number

Search

WBC-T0303AG-03-2152-CG

Description
Array/Network Resistor, Center Tap, Thin Film, 0.25W, 21500ohm, 100V, 0.25% +/-Tol, -25,25ppm/Cel, 0303,
CategoryPassive components    The resistor   
File Size376KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Environmental Compliance
Download Datasheet Parametric View All

WBC-T0303AG-03-2152-CG Overview

Array/Network Resistor, Center Tap, Thin Film, 0.25W, 21500ohm, 100V, 0.25% +/-Tol, -25,25ppm/Cel, 0303,

WBC-T0303AG-03-2152-CG Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid802611145
Reach Compliance Codecompliant
ECCN codeEAR99
structureChip
Network TypeCenter Tap
Number of terminals6
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package length0.762 mm
Package formSMT
Package width0.762 mm
method of packingTray
Rated power dissipation(P)0.25 W
resistance21500 Ω
Resistor typeARRAY/NETWORK RESISTOR
seriesWBC(TAPPED)
size code0303
technologyTHIN FILM
Temperature Coefficient25 ppm/°C
Tolerance0.25%
Operating Voltage100 V
Wire Bondable
Chip Resistors
WBC Series
Discrete or tapped schematics
MIL inspection available
High resistor density
IRC Advanced Film Division
IRC’s WBC series wire bondable chip resistors are ideally suited for
the most demanding hybrid application. The WBC combines IRC’s
TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to produce an extremely small
footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
(0.508mm ±0.025)
0.020˝ ±0.001
Electrical Data
Absolute Tolerance
Absolute TCR
R
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
R0202 and
T0303
B0202
Passivation
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Gold available)
Gold
3KÅ minimum
Silicon Dioxide or
Silicon Nitride
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
(0.508mm ±0.025)
0.020˝ ±0.001
R
Top contact
pad chamfered
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
(0.762mm ±0.025)
0.030˝ ±0.001
Backside
½R
½R
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com
A subsidiary of
TT electronics plc
WBC Series Issue April 2006
Selecting the Optimal LED Backlight Driver for Portable MFF Displays
Keywords: LED , WLED , white LED , CCFL , portable MFF display, TPS61195 , Texas Instruments, TISelecting the Optimal LED Backlight Driver for Portable MFF Displays By Jeff Falin , Factory Application...
德州仪器 Power technology
Are your earplugs comfortable to use? AMS conducted a special survey on earplugs
ams has published the results of its survey of more than 2,000 earbud consumers, which shows headphone brands that consumers who use earbuds multiple times a day want earbuds that are comfortable, sou...
soso Talking
SAM D21 development board trial experience + new firmware update
SAM D21 development board trial experience + new firmware update first use of high version [size=14px] [size=14px] [/size]...
蓝雨夜 MCU
Unable to download...
Can't download attachments, need a specific user? ? ? why...
heizai23 Suggestions & Announcements
Two questions
1. The Ndis library does not send irp to the interface function (such as initialization function, etc.) of the nids miniport driver. Where does the irp in the code come from? Is the ndis miniport driv...
madcow Embedded System
Comparison and selection of various embedded memory technologies
Memory is a key component of any microcontroller-based embedded system. For example, developers need enough RAM to store all volatile variables, create buffers, and manage various application stacks. ...
Jacktang Microcontroller MCU

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 463  514  2573  360  924  10  11  52  8  19 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号