Standard SRAM, 2MX18, 2.8ns, CMOS, PBGA165
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Objectid | 1155503132 |
| package instruction | BGA, BGA165,11X15,40 |
| Reach Compliance Code | unknown |
| ECCN code | 3A991.B.2.A |
| Maximum access time | 2.8 ns |
| Maximum clock frequency (fCLK) | 227 MHz |
| I/O type | COMMON |
| JESD-30 code | R-PBGA-B165 |
| JESD-609 code | e0 |
| memory density | 37748736 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 18 |
| Humidity sensitivity level | 3 |
| Number of terminals | 165 |
| word count | 2097152 words |
| character code | 2000000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 2MX18 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | BGA |
| Encapsulate equivalent code | BGA165,11X15,40 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY |
| Parallel/Serial | PARALLEL |
| power supply | 2.5/3.3,3.3 V |
| Certification status | Not Qualified |
| Minimum standby current | 3.14 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN LEAD |
| Terminal form | BALL |
| Terminal pitch | 1 mm |
| Terminal location | BOTTOM |
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