D12/CRCW0805-P10014R30.5%ET1E3 datasheet, PDF

Datasheet> All Categories > Passive components> The resistor> D12/CRCW0805-P10014R30.5%ET1E3

D12/CRCW0805-P10014R30.5%ET1E3: DescriptionFixed Resistor, Metal Glaze/thick Film, 0.125W, 14.3ohm, 150V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP, HALOGEN FREE AND ROHS COMPLIANT; CategoryPassive components The resistor; File Size101KB，6 Pages; ManufacturerVishay; Websitehttp://www.vishay.com; Environmental Compliance

Download Datasheet Parametric View All

D12/CRCW0805-P10014R30.5%ET1E3 Overview

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 14.3ohm, 150V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP, HALOGEN FREE AND ROHS COMPLIANT

D12/CRCW0805-P10014R30.5%ET1E3 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Objectid	8071815098
package instruction	CHIP, HALOGEN FREE AND ROHS COMPLIANT
Reach Compliance Code	compliant
Country Of Origin	Israel
ECCN code	EAR99
YTEOL	.46
Other features	RATED AC VOLTAGE (V): 150, SEMI-PRECISION
structure	Chip
JESD-609 code	e3
Manufacturer's serial number	D/CRCW-PE3
Installation features	SURFACE MOUNT
Number of terminals	2
Maximum operating temperature	155 °C
Minimum operating temperature	-55 °C
Package height	0.45 mm
Package length	2 mm
Package shape	RECTANGULAR PACKAGE
Package form	SMT
Package width	1.25 mm
method of packing	TR, PAPER, 7 INCH
Rated power dissipation(P)	0.125 W
Rated temperature	70 °C
Guideline	AEC-Q200
resistance	14.3 Ω
Resistor type	FIXED RESISTOR
series	D/CRCW-P E3
size code	0805
surface mount	YES
technology	METAL GLAZE/THICK FILM
Temperature Coefficient	100 ppm/°C
Terminal surface	Tin (Sn) - with Nickel (Ni) barrier
Terminal shape	WRAPAROUND
Tolerance	0.5%
Operating Voltage	150 V

D12/CRCW0805-P10014R30.5%ET1E3 Preview

D/CRCW-P e3

www.vishay.com

Vishay

Lead (Pb)-Free Thick Film, Rectangular,

Semi-Precision Chip Resistors

FEATURES

• Low temperature coefficient (50 ppm/K) and

tight tolerances (± 0.25 %)

• Pure tin plating provides compatibility with

lead (Pb)-free and lead containing soldering

processing

• Metal glaze on high quality ceramic

• AEC-Q200 qualified

• Material categorization: For definitions of compliance

please see

www.vishay.com/doc?99912

STANDARD ELECTRICAL SPECIFICATIONS

CASE

SIZE

INCH

CASE

SIZE

METRIC

POWER

RATING

LIMITING

ELEMENT

VOLTAGE

max.

RMS

/DC

TEMPERATURE

COEFFICIENT

ppm/K

± 100

± 50

± 100

D11/CRCW0603-P

0603

1608

0.1

± 50

± 100

D12/CRCW0805-P

0805

2012

0.125

150

± 50

± 100

D25/CRCW1206-P

1206

3216

0.25

200

± 50

± 100

± 50

± 100

± 50

± 100

± 50

± 100

± 50

TOLERANCE

RESISTANCE

RANGE



1R to 1M1

100R to 1M

1R to 10M

100R to 1M

100R to 10M

10R to 10M

100R to 1M

100R to 10M

10R to 10M

100R to 1M

100R to 10M

100R to 1M

100R to 2M2

10R to 10M

100R to 10M

10R to 10M

100R to 10M

E24; E96

MODEL

SERIES

D10/CRCW0402-P

0402

1005

0.063

± 0.5

± 0.25, ± 0.5, ± 1

± 0.5, ± 0.25

± 0.25

± 0.5, ± 1

± 0.5

± 0.25

± 0.5, ± 1

± 0.5

± 0.25

± 0.5, ± 1

± 0.5

± 0.5, ± 1

± 0.5

± 0.5, ± 1

± 0.5

± 0.5, ± 1

± 0.5

± 0.5, ± 1

E24; E96

CRCW1210-P

CRCW1218-P

CRCW2010-P

CRCW2512-P

1210

1218

2010

2512

3225

3246

5025

6332

0.5

1.0

0.75

1.0

200

400

500

Notes

• These resistors do not feature a limited lifetime when operated within the limits of rated dissipation, permissible operating voltage and

permissible film temperature. However, the resistance typically increase due to the resistor’s film temperature over operating time generally

known as drift. The drift may exceed the stability requirements of an individual application circuit and thereby limits the functional time.

• Marking and packaging: See datasheet “Surface Mount Resistor Marking” (www.vishay.com/doc?20020).

• Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.

Revision: 07-Apr-14

Document Number: 20036

For technical questions, contact:

thickfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

D/CRCW-P e3

www.vishay.com

Vishay

TECHNICAL SPECIFICATIONS

PARAMETER

Rated Dissipation at

70 (1)

Operating Voltage

max.

RMS

/DC

Insulation Voltage

ins

(1 min)

Insulation Resistance

Operating Temperature Range

Failure Rate

Weight

UNIT



°C

-1

0.65

5.5

D10/

D11/

D12/

D25/

CRCW1210-P CRCW1218-P CRCW2010-P CRCW2512-P

CRCW0402-P CRCW0603-P CRCW0805-P CRCW1206-P

0.063

0.1

100

0.125

150

200

0.25

200

300

> 10

- 55 to + 155

< 0.1 x 10

-9

29.5

25.5

40.5

0.5

200

300

1.0

200

300

0.75

400

300

1.0

500

300

Note

(1)

The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the

printed-ciruit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.

PART NUMBER AND PRODUCT DESCRIPTION

PART NUMBER: CRCW040275R0DKEDP

MODEL

CRCW0402

CRCW0603

CRCW0805

CRCW1206

CRCW1210

CRCW1218

CRCW2010

CRCW2512

RESISTANCE

= Decimal

= Thousand

= Million

TOLERANCE

= ± 0.25 %

= ± 0.5 %

= ± 1.0 %

TCR

= ± 50 ppm/K

= ± 100 ppm/K

PACKAGING

EA, EB,

EC, ED,

EE, EF,

EG, EH,

EI, EL

SPECIAL

Semi-Precision

PRODUCT DESCRIPTION: D10/CRCW0402-P 100 75R 0.5 % ET7 e3

D10/CRCW0402-P

MODEL

D10/CRCW0402-P

D11/CRCW0603-P

D12/CRCW0805-P

D25/CRCW1206-P

CRCW1210-P

CRCW1218-P

CRCW2010-P

CRCW2512-P

100

TCR

± 50

ppm/K

± 100

ppm/K

75R

RESISTANCE

49K9

= 49.9 k

5R1

= 5.1



0.5 %

TOLERANCE

± 0.25 %

± 0.5 %

±1%

ET7

PACKAGING

ET1, ET2,

ET3, ET4,

ET5, ET6,

ET7, ET8,

ET9, EF4,

E02, E67,

E82

LEAD (Pb)-FREE

= Pure tin

termination

finish

Revision: 07-Apr-14

Document Number: 20036

For technical questions, contact:

thickfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

D/CRCW-P e3

www.vishay.com

Vishay

QUANTITY

10 000

50 000

5000

10 000

20 000

50 000

5000

10 000

20 000

5000

10 000

20 000

5000

10 000

20 000

5000

10 000

20 000

4000

2000

4000

Blister tape acc. to

IEC 60068-3

Type II

12 mm

4 mm

8 mm

4 mm

12 mm

4 mm

8 mm

4 mm

Paper tape acc. to

IEC 60068-3

Type I

8 mm

4 mm

8 mm

4 mm

8 mm

2 mm

CARRIER TAPE

WIDTH

8 mm

PITCH

2 mm

REEL DIAMETER

180 mm/7"

330 mm/13"

180 mm/7"

285 mm/11.25"

330 mm/13"

180 mm/7"

285 mm/11.25"

330 mm/13"

180 mm/7"

285 mm/11.25"

330 mm/13"

180 mm/7"

285 mm/11.25"

330 mm/13"

180 mm/7"

285 mm/11.25"

330 mm/13"

180 mm/7"

PACKAGING

MODEL

D10/CRCW0402-P

CODE

ED = ET7

EE = EF4

EI = ET2

ED = ET3

EL = ET4

D11/CRCW0603-P

EE = ET8

EA = ET1

EB = ET5

EC = ET6

EA = ET1

D12/CRCW0805-P

EB = ET5

EC = ET6

EA = ET1

D25/CRCW1206-P

EB = ET5

EC = ET6

EA = ET1

CRCW1210-P

CRCW1218-P

CRCW2010-P

CRCW2512-P

EB = ET5

EC = ET6

EK = ET9

EF = E02

EG = E67

EH = E82

DIMENSIONS

in millimeters

SIZE

INCH METRIC

0402

0603

0805

1206

1210

1218

2010

2512

1005

1608

2012

3216

3225

3246

5025

6332

1.0 ± 0.05

1.55

2.0

3.2

+ 0.10

- 0.05

+ 0.20

- 0.10

+ 0.10

- 0.20

DIMENSIONS

0.5 ± 0.05

0.85 ± 0.1

0.2 ± 0.1

0.3 ± 0.2

0.4 ± 0.2

0.6 ± 0.2

SOLDER PAD DIMENSIONS

REFLOW SOLDERING

0.4

0.5

0.7

0.9

1.05

1.0

0.6

0.9

1.3

1.7

2.5

4.9

2.5

3.2

0.5

1.0

1.2

2.0

1.9

3.9

5.2

0.9

1.1

1.25

1.2

0.9

1.3

1.7

2.5

4.8

2.5

3.2

1.0

1.3

2.3

2.2

1.9

3.9

5.2

WAVE SOLDERING

0.35 ± 0.05 0.25 ± 0.05

0.45 ± 0.05

0.3 ± 0.2

0.3

+ 0.20

- 0.10

1.25 ± 0.15 0.45 ± 0.05

1.6 ± 0.15

2.5 ± 0.2

4.6 ± 0.15

2.5 ± 0.15

3.15 ± 0.15

0.55 ± 0.05

0.6 ± 0.1

0.45 ± 0.2

0.6 ± 0.2

3.2 ± 0.2

3.2

+ 0.10

- 0.20

5.0 ± 0.15

6.3 ± 0.2

Revision: 07-Apr-14

Document Number: 20036

For technical questions, contact:

thickfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

D/CRCW-P e3

www.vishay.com

FUNCTIONAL PERFORMANCE

Fraction of Rated Dissipation

Vishay

100

- 50

100

°C

150

Ambient Temperature in

amb

TEST PROCEDURES AND REQUIREMENTS

IEC

EN 60115-1 60068-2

CLAUSE

TEST

METHOD

TEST

PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE (R)

STABILITY CLASS 1 OR BETTER

1 to 10 M

± 0.25 %; ± 0.5 %; ± 1 %

No flashover or breakdown

± (0.25 %

+ 0.05

)

Stability for product types:

D/CRCW-P e3

4.5

4.7

4.13

Resistance

Voltage proof

Short time overload

= 1.4 x

ins

; 60 s

= 2.5 x



2 x

max.;

duration acc. to style

Solder bath method;

Sn60Pb40

non-activated flux;

(235 ± 5) °C

(2 ± 0.2) s

4.17.2

58 (Td)

Solderability

Solder bath method;

Sn96.5Ag3Cu0.5

non-activated flux;

(245 ± 5) °C

(3 ± 0.3) s

4.8.4.2

4.32

4.33

21 (Uu

)

21 (Uu

)

Temperature

coefficient

Shear

(adhesion)

Substrate bending

(20/- 55/20) °C and

(20/125/20) °C

RR 1608 and smaller: 9 N

RR 2012 and larger: 45 N

Depth 2 mm;

3 times

30 min at - 55 °C;

30 min at 125 °C

5 cycles

1000 cycles

Good tinning ( 95 % covered)

no visible damage

Good tinning ( 95 % covered)

no visible damage

± 50 ppm/K; ± 100 ppm/K

No visible damage

No visible damage, no open circuit in bent position

± (0.25 %

+ 0.05

)

4.19

14 (Na)

Rapid change of

temperature

± (0.25 %

+ 0.05

)

± (1 %

+ 0.05

)

Revision: 07-Apr-14

Document Number: 20036

For technical questions, contact:

thickfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

D/CRCW-P e3

www.vishay.com

Vishay

TEST PROCEDURES AND REQUIREMENTS

IEC

EN 60115-1 60068-2

CLAUSE

TEST

METHOD

TEST

PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE (R)

STABILITY CLASS 1 OR BETTER

1 to 10 M

Stability for product types:

D/CRCW-P e3

4.23

4.23.2

4.23.3

4.23.4

4.23.5

4.23.6

4.23.7

2 (Ba)

30 (Db)

1 (Aa)

13 (M)

30 (Db)

Climatic sequence:

Dry heat

Damp heat, cyclic

Cold

Low air pressure

Damp heat, cyclic

DC load

125 °C; 16 h

55 °C;



90 % RH;

24 h; 1 cycle

- 55 °C; 2 h

1 kPa; (25 ± 10) °C; 1 h

55 °C;



90 % RH;

24 h; 5 cycles



max.;

1.5 h on; 0.5 h off;

4.25.1

Endurance at 70 °C

70 °C; 1000 h

70 °C; 8000 h

4.18.2

58 (Td)

Resistance to

soldering heat

Flamability,

needle flame test

Damp heat,

steady state

Endurance at

upper category

temperature

Electrostatic

discharge

(human body model)

Component solvent

resistance

Solvent resistance

of marking

Vibration, endurance

by sweeping

Solder bath method

(260 ± 5) °C;

(10 ± 1) s

IEC 60695-11-5;

10 s

(40 ± 2) °C;

(93 ± 3) % RH;

56 days

155 °C, 1000 h

IEC 61340-3-1;

3 pos. + 3 neg. discharges;

ESD voltage acc. to size

Isopropyl alcohol;

50 °C; method 2

Isopropyl alcohol;

50 °C; method 1,

toothbrush

f = 10 Hz to 2000 Hz;

x, y, z



1.5 mm;



200 m/s

;

10 sweeps per axis

4.37

Periodic electric

overload

Single pulse high

voltage overload,

10 μs/700 μs

15 x



2 x

max.;

0.1 s on; 2.5 s off;

1000 cycles

± (1 %

+ 0.05

)

± (1 %

+ 0.05

)

± (2 %

+ 0.05

)

± (0.25 %

+ 0.05

)

4.35

No burning after 30 s

± (1 %

+ 0.05

)

4.24

78 (Cab)

4.25.3

± (1 %

+ 0.05

)

4.40

4.29

4.30

45 (XA)

± (1 %

+ 0.05

)

No visible damage

Marking legible,

no visible damage

4.22

6 (Fc)

± (0.25 %

+ 0.05

)

± (1 %

+ 0.05

)

4.27

= 10 x



2 x

max.;

10 pulses

± (1 %

+ 0.05

)

All tests are carried out in accordance with the following specifications:

• EN 60115-1, generic specification

• EN 140400, sectional specification

• EN 140401-802, detail specification

• IEC 60068-2-x, variety of environmental test procedures

Packaging of components is done in paper or blister tapes according to IEC 60286-3.

Revision: 07-Apr-14

Document Number: 20036

For technical questions, contact:

thickfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

More (Only the first 5 pages are displayed. Please Download Datasheet to view the full content.) >

Recommended Resources

6B595 driven LED display circuit design (common cathode)

Thermostat control circuit using 555 time base integrated circuit 4

solid state relay circuit

Voltage reversal and double voltage circuit diagram

Parallel voltage stabilizing circuit

810 computer motherboard circuit diagram_10

How to get RSSI of CC2530?: I'm learning zigbee indoor positioning recently, but now I can't get the rssi value from afIncomingMSGPacket_t? The code I wrote is always wrong. I wonder if anyone can provide some code for reference...; 718322959 RF/Wirelessly

TIVA C launchpad trial experience 3.-SP interface read and write w25x80Flash: _CSIO_Init(void) { // // Enable Peripheral Clocks // MAP_SysCtlPeripheralEnable(SYSCTL_PERIPH_GPIOC); MAP_SysCtlPeripheralEnable(SYSCTL_PERIPH_GPIOD); // // Enable port PC5 for GPIOOutput // MAP_GPIOP...; shower.xu Microcontroller MCU

How can I use the ADC in M3 to realize data acquisition and touch screen control at the same time?: Background: There are many routines that implement ADC data acquisition. TI also provides a touch screen driver based on the M3 on-chip ADC, but there are no routines that implement both data acquisit...; ooakk Microcontroller MCU

Research on human feature recognition method based on iris: Human feature recognition method, also known as biometric recognition method, refers to the technical means of identity authentication that uses the unique physiological and behavioral characteristics...; dtcxn Medical Electronics

Various painful problems with Keil 5: I don't know if anyone has used the latest version of keil 5. The device now has been changed to download device packages, but there are only a few devices in the device package. After installing it, ...; 白丁 ARM Technology

About infrared interruption problem: I'm working on an infrared controlled clock and I'm stuck. I've been debugging it for a long time but I can't get it done. Has anyone done it before and can send me the program? Thank you. Since I am ...; ysq123001 MCU

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components