Design utilizes high temperature powder iron alloy material
with a non-organic binder to eliminate thermal aging
7.25x6.7x3.0mm Surface mount package
Magnetically shielded, low EMI
Current rating up to 34.7Adc (Higher peak currents may be
attained with a greater rolloff, see rolloff curve)
Frequency range up to 2MHz
Environmental Data
• Storage temperature range (component): -40°C to +155°C
• Operating ambient temperature range: -40°C to +155°C
(ambient plus self temperature rise)
• Solder reflow temperature: J-STD-020D
Packaging
• Supplied in tape-and reel packaging, 1700 parts per
13” diameter reel
Product Specifications
Part
Number
(6)
FP3-R10-R
FP3-R20-R
FP3-R47-R
FP3-R68-R
FP3-1R0-R
FP3-1R5-R
FP3-2R0-R
FP3-3R3-R
FP3-4R7-R
FP3-8R2-R
FP3-100-R
FP3-150-R
OCL
µH ± 15%
0.10
0.22
0.44
0.72
1.10
1.50
2.00
3.20
4.70
8.5
10.9
14.9
(1)
I
rms
Amps
19.0
15.3
10.9
9.72
6.26
5.78
5.40
3.63
3.23
2.91
2.30
2.22
(2)
I
sat
1
Amps
10%
27
16
11.6
9.0
7.4
6.2
5.4
4.3
3.5
2.6
2.3
2.0
(3)
I
sat
2
Amps
15%
34.7
20.8
14.9
11.6
9.5
8.0
6.9
5.5
4.2
3.4
3.0
2.5
(4)
DCR
mOhms @ 20°C
Typ.
1.00
1.54
3.05
3.85
9.40
10.0
11.5
24.5
34.9
61.6
84.2
106.0
DCR
mOhms @ 20°C
Max.
1.21
1.88
3.67
4.63
11.2
13.1
15.0
30.0
40.0
74.0
101
127
K-factor (5)
803
482
344
268
219
185
161
127
105
78
69
59
1) OCL (Open Circuit Inductance) Test parameters: 100kHz, 0.1V
rms
, 0.0Adc
2) I
rms
DC current for an approximate ∆T of 40°C without core loss. Derating is
necessary for AC currents. PCB layout, trace thickness and width, air-flow, and
proximity of other heat generating components will affect the temperature rise.
It is recommended that the temperature of the part not exceed 155°C under
worst case operating conditions verified in the end application.
3) I
sat
Amps Peak for approximately 10% rolloff @ 20°C
4) I
sat
Amps Peak for approximately 15% rolloff @ 20°C
1
2
5) K-factor: Used to determine B
p-p
for core loss (see graph). B
p-p
=K*L*∆I B
p-
p
:(Gauss), K: (K factor from table), L: (Inductance in µH), ∆I (Peak to peak ripple
current in Amps).
6) Part number definition:
FP3 = product code and size
xxx = inductance value in µH
R = decimal point (if no “R” is present, the 3rd digit equals the number of zeros)
“-R” suffix = RoHS complaint
0413
BU-SB13475
Page 1 of 4
Data Sheet: PM-4118
Dimensions - mm
FRONT VIEW
(2x)
TOP VIEW
2.80.25
SIDE VIEW
1.0 min.
(2x)
7.25
Max
RECOMMENDED PAD LAYOUT
SCHEMATIC
1
3.00 Max
FP3
XXX
YWWL
2
6.70
Max
1
7.50
2.50 (2x)
2.80.25
(2x)
2
4.50 (2x)
Part Marking:
• FP3 (Product code and size)
• xxx = (Inductance=(Inductance value in µH)
• R = decimal point (if no “R” is present, the 3rd digit equals
the number of zeros)
• YWW = Date code
• L = Location code
Packaging Information - mm
1.5 Dia
1.5 Dia
4.0
2.0
A
1
1.75
7.5
7.5
FP3
XXX
YWWL
16.0
+/-0.3
2
6.9
3.2
SECTION A-A
Supplied in tape and reel packaging, 1700 parts on a 13” diameter reel.
A
12.0
Direction of Feed
0413
BU-SB13475
Page 2 of 4
Data Sheet: PM-4118
Inductance Characteristics
OCL vs. Isat
100
90
80
% of OCL
70
60
50
40
30
20
10
0
0
20
40
60
80
100
120
140
160
180
200
% of Isat
Core Loss
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00
250
Frequency (kHz)
200
300
400
500
600
700
800
900
Core Loss (W)
500
750
1000 1250 1500 1750 2000 2250
B p-p (Gauss)
1000
Temperature Rise vs. Watt Loss
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
Temperature Rise (°C)
0.12
0.24
0.36
0.48
0.61
0.73
0.85
0.97
1.09
1.21
1.33
1.45
1.57
Total Loss (W)
0413
BU-SB13475
Page 3 of 4
Data Sheet: PM-4118
Solder Reflow Profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
Table 1 - Standard SnPb Solder (T c)
Package
Thickness
<2.5mm
_
>2.5mm
Volume
mm
3
<350
235°C
220°C
Volume
mm
3
_
>350
220°C
220°C
Temperature
T
smax
Table 2 - Lead (Pb) Free Solder (Tc)
T
smin
t
s
Volume
Package
mm
3
Thickness
<350
<1.6mm
260°C
1.6 – 2.5mm 260°C
>2.5mm
250°C
Time
Volume
mm
3
350 - 2000
260°C
250°C
245°C
Volume
mm
3
>2000
260°C
245°C
245°C
25°C
Time 25°C to Peak
Reference JDEC J-STD-020D
Profile Feature
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
L
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Standard SnPb Solder
100°C
150°C
60-120 Seconds
3°C/ Second Max.
183°C
60-150 Seconds
Table 1
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
Lead (Pb) Free Solder
150°C
200°C
60-120 Seconds
3°C/ Second Max.
217°C
60-150 Seconds
Table 2
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
North America
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Cooper Bussmann
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Europe
Cooper Electronic Technologies
Cooper (UK) Limited
Burton-on-the-Wolds
Leicestershire • LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Fax: +34 937 362 719
Asia Pacific
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Tel: +65 278 6151
Fax: +65 270 4160
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document
are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user
with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit
distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once
a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in
accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
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