1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 Vrms, 0.0 Adc, +25 ºC
2. I
rms
: DC current for an approximate temperature rise of 30 ºC without core loss. Derating is necessary for AC currents.
PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the
temperature rise. It is recommended that the temperature of the part not exceed 125 ºC under worst case operating
conditions verified in the end application.
3. I
sat
: Peak current for approximately 35% rolloff @ +25 ºC
4. K-factor: K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L *
ΔI.
Bp-p: (mT), K:
(K-factor from table), L: (Inductance in μH),
ΔI
(Peak to peak ripple current in Amps)..
5. Part Number Definition: DR1040-xxx-R
DR1040 = Product code and size
-xxx= inductance value in μH, R= decimal point,
If no R is present then last character equals number of zeros
-R suffix = RoHS compliant
Dimensions (mm)
Part marking: inductance value in uH. R = decimal point. If no R is present then last character equals number of zeroes.
wwlly = date code, R = revision level
Do not route traces or vias underneath the inductor
2
www.eaton.com/elx
DR1040
Shielded power inductors
Packaging information (mm)
Supplied in tape and reel packaging , 850 parts per 13” diameter reel
Technical Data
4147
Effective April 2016
Temperature rise vs. total loss
120
Temperature Rise ( )
100
80
60
40
20
0
0
0.2
0.4
0.6
0.8
1
1.2
Total Loss (W)
www.eaton.com/elx
3
Technical Data
4147
Effective April 2016
DR1040
Shielded power inductors
Core loss vs. Bp-p
1 MHz
500 kHz
300 kHz
200 kHz
100 kHz
1
10
Core Loss (W)
0.1
0.01
0.001
1
10
B
p-p
(mT)
100
1000
Inductance characteristics
120%
%OCL vs. I
sat
100%
80%
% of OCL
60%
40%
20%
-40 °C
+25 °C
+85 °C
0%
0%
20%
40%
60%
80%
100%
120%
140%
160%
% of I
sat
4
www.eaton.com/elx
DR1040
Shielded power inductors
Solder reflow profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
Technical Data
4147
Effective April 2016
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm)
≥2.5mm
T
smax
235°C
220°C
220°C
220°C
Temperature
Table 2 - Lead (Pb) Free Solder (Tc)
T
smin
t
s
Package
Thickness
Volume
mm
3
<350
Volume
mm
3
350 - 2000
Volume
mm
3
>2000
<1.6mm
1.6 – 2.5mm
>2.5mm
25°C
Time 25°C to Peak
260°C
260°C
250°C
260°C
250°C
245°C
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Standard SnPb Solder
Lead (Pb) Free Solder
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
100°C
150°C
60-120 Seconds
3°C/ Second Max.
183°C
60-150 Seconds
Table 1
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
150°C
200°C
60-120 Seconds
3°C/ Second Max.
217°C
60-150 Seconds
Table 2
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
l
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
I copied the .out file generated in the project, the hex500 conversion tool and the .cmd file I wrote to the same folder, and executed HEX500.EXE, but there was no response?What should I do? Or what c...
[i=s] This post was last edited by a media student on 2019-4-21 15:01 [/i] [align=center][align=center][size=4][b]【RT-Thread Reading Notes】 1. First Reading of RT-Thread RTOS [/b][/size][/align][/alig...
Could any brother help to interpret the following LOG information, thank you! State Dump for Thread Id 0xe8c eax=00000000 ebx=033f5400 ecx=14f50038 edx=01875700 esi=07e2f2a4 edi=15753c38 eip=00f3018d ...
I have a touch screen with WINCE 6.0 installed. I want to add a serial port and use a USB-to-serial converter, but I don't know how to install the driver. The converter driver only has one DLL file an...
According to foreign media reports, Ford Motor has applied to the U.S. Patent and Social Security Administration (USPTO) for a patent for a remote vehicle control system that may be used in future ...[Details]
How do you know if a machine is operating properly? The answer: by leveraging deep learning to detect anomalies in routine vibration data from industrial machines. Anomaly detection has many uses, ...[Details]
Amidst the wave of intelligent automotive transformation, advanced driver assistance is gradually emerging from cutting-edge technology into the mainstream, becoming a new frontier of industry comp...[Details]
On August 18th, Galaxis, a specialist in integrated intelligent intralogistics robotics, officially unveiled its next-generation, ultra-narrow aisle forklift mobile robot, the "VFR Ultra-Narrow Ser...[Details]
Charging is a familiar process for new energy vehicles, and as a source of battery energy, charging piles are crucial. New energy vehicle charging can be divided into fast charging and slow chargin...[Details]
A half-bridge is an inverter topology for converting DC to AC. A typical half-bridge circuit consists of two controller switches, a three-wire DC power supply, two feedback diodes, and two capacito...[Details]
In the electronics manufacturing industry, surface mount technology (SMT) placement machines are core equipment for production lines. However, with many different models available on the market, ch...[Details]
During daily operation of an R-type power transformer, the voltage used varies as the equipment being used adjusts. This raises the question: can the transformer change voltage at this point? The a...[Details]
On August 21, according to a report by Korean media SEDaily yesterday, according to semiconductor industry sources, the HBM4 samples provided by Samsung to Nvidia last month have passed initial tes...[Details]
New version helps developers build secure and trustworthy embedded systems
Shanghai, China—August 21, 2025—
QNX, a division of BlackBerry Ltd., today announced the release of QNX...[Details]
When American cartoonist Chester Gould sketched the watch on Dick Tracy's wrist, he had no idea that science fiction would become reality 70 years later. As a comic strip artist, Gould imagined fut...[Details]
Qiangmao, your trusted semiconductor solutions partner, sincerely invites you to visit Electronics India 2025, South Asia's leading trade show for electronic components, systems, applications...[Details]
Compiled from semiengineering
The industry is increasingly concerned about power consumption in AI, but there are no simple solutions. This requires a deep understanding of software and ...[Details]
introduction
The widespread use of air conditioner communication circuits began with the rise of household inverter air conditioners. With China's energy conservation and emission reduction in...[Details]
Chip architecture licensing company ARM has hired Amazon's AI chip chief Rami Sinno to help advance its plan to develop its own complete chip, people familiar with the matter said, according to Reu...[Details]
Automotive Electronics
京公网安备 11010802033920号
EEWORLD
