73K224L-32IH datasheet, PDF - EEWORLD Datasheet

73K224L-32IH: Description2.4kbps DATA, MODEM, PQCC32, PLASTIC, LCC-32; CategoryWireless rf/communication Telecom circuit; File Size1MB，31 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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73K224L-32IH Overview

2.4kbps DATA, MODEM, PQCC32, PLASTIC, LCC-32

Parameter Name	Attribute value
Parts packaging code	QFJ
package instruction	QCCJ,
Contacts	32
Reach Compliance Code	unknow
Other features	FULL DUPLEX
data rate	2.4 Mbps
JESD-30 code	R-PQCC-J32
length	13.995 mm
Number of functions	1
Number of terminals	32
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Certification status	Not Qualified
Maximum seat height	3.56 mm
Nominal supply voltage	5 V
surface mount	YES
Telecom integrated circuit types	MODEM
Temperature level	INDUSTRIAL
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
width	11.455 mm
Base Number Matches	1

	73K224L-32IH	73K224L-IG	73K224LS-IP
Description	2.4kbps DATA, MODEM, PQCC32, PLASTIC, LCC-32	IC 2.4 kbps DATA, MODEM, PQFP52, QFP-52, Modem	2.4kbps DATA, MODEM, PDIP22, 0.400 INCH, PLASTIC, DIP-22
Parts packaging code	QFJ	QFP	DIP
package instruction	QCCJ,	QFP,	DIP,
Contacts	32	52	22
Reach Compliance Code	unknow	unknown	unknown
Other features	FULL DUPLEX	FULL DUPLEX	FULL DUPLEX
data rate	2.4 Mbps	2.4 Mbps	2.4 Mbps
JESD-30 code	R-PQCC-J32	S-PQFP-G52	R-PDIP-T22
length	13.995 mm	10 mm	27.686 mm
Number of functions	1	1	1
Number of terminals	32	52	22
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	QFP	DIP
Package shape	RECTANGULAR	SQUARE	RECTANGULAR
Package form	CHIP CARRIER	FLATPACK	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.56 mm	2.43 mm	5.08 mm
Nominal supply voltage	5 V	5 V	5 V
surface mount	YES	YES	NO
Telecom integrated circuit types	MODEM	MODEM	MODEM
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	J BEND	GULL WING	THROUGH-HOLE
Terminal pitch	1.27 mm	0.65 mm	2.54 mm
Terminal location	QUAD	QUAD	DUAL
width	11.455 mm	10 mm	10.16 mm
Base Number Matches	1	1	1
Maker	-	Texas Instruments	Texas Instruments

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