73K224L-IG datasheet, PDF - EEWORLD Datasheet

73K224L-IG: DescriptionIC 2.4 kbps DATA, MODEM, PQFP52, QFP-52, Modem; CategoryWireless rf/communication Telecom circuit; File Size1MB，31 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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73K224L-IG Overview

IC 2.4 kbps DATA, MODEM, PQFP52, QFP-52, Modem

Parameter Name	Attribute value
Maker	Texas Instruments
Parts packaging code	QFP
package instruction	QFP,
Contacts	52
Reach Compliance Code	unknown
Other features	FULL DUPLEX
data rate	2.4 Mbps
JESD-30 code	S-PQFP-G52
length	10 mm
Number of functions	1
Number of terminals	52
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Package shape	SQUARE
Package form	FLATPACK
Certification status	Not Qualified
Maximum seat height	2.43 mm
Nominal supply voltage	5 V
surface mount	YES
Telecom integrated circuit types	MODEM
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
width	10 mm
Base Number Matches	1

	73K224L-IG	73K224L-32IH	73K224LS-IP
Description	IC 2.4 kbps DATA, MODEM, PQFP52, QFP-52, Modem	2.4kbps DATA, MODEM, PQCC32, PLASTIC, LCC-32	2.4kbps DATA, MODEM, PDIP22, 0.400 INCH, PLASTIC, DIP-22
Parts packaging code	QFP	QFJ	DIP
package instruction	QFP,	QCCJ,	DIP,
Contacts	52	32	22
Reach Compliance Code	unknown	unknow	unknown
Other features	FULL DUPLEX	FULL DUPLEX	FULL DUPLEX
data rate	2.4 Mbps	2.4 Mbps	2.4 Mbps
JESD-30 code	S-PQFP-G52	R-PQCC-J32	R-PDIP-T22
length	10 mm	13.995 mm	27.686 mm
Number of functions	1	1	1
Number of terminals	52	32	22
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QFP	QCCJ	DIP
Package shape	SQUARE	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	CHIP CARRIER	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.43 mm	3.56 mm	5.08 mm
Nominal supply voltage	5 V	5 V	5 V
surface mount	YES	YES	NO
Telecom integrated circuit types	MODEM	MODEM	MODEM
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	J BEND	THROUGH-HOLE
Terminal pitch	0.65 mm	1.27 mm	2.54 mm
Terminal location	QUAD	QUAD	DUAL
width	10 mm	11.455 mm	10.16 mm
Base Number Matches	1	1	1
Maker	Texas Instruments	-	Texas Instruments

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