EEWORLDEEWORLDEEWORLD

Part Number

Search

B0202GG-01-2433-B

Description
Fixed Resistor, Thin Film, 0.25W, 243000ohm, 100V, 0.1% +/-Tol, 100ppm/Cel, Surface Mount, 0202, CHIP
CategoryPassive components    The resistor   
File Size381KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

B0202GG-01-2433-B Overview

Fixed Resistor, Thin Film, 0.25W, 243000ohm, 100V, 0.1% +/-Tol, 100ppm/Cel, Surface Mount, 0202, CHIP

B0202GG-01-2433-B Parametric

Parameter NameAttribute value
Objectid1579396157
package instruction, 0202
Reach Compliance Codecompliant
ECCN codeEAR99
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTRAY
Rated power dissipation(P)0.25 W
Rated temperature70 °C
resistance243000 Ω
Resistor typeFIXED RESISTOR
size code0202
surface mountYES
technologyTHIN FILM
Temperature Coefficient100 ppm/°C
Terminal shapeONE SURFACE
Tolerance0.1%
Operating Voltage100 V
Wire Bondable
Chip Resistors
WBC Series
Discrete or tapped schematics
MIL inspection available
High resistor density
IRC’s WBC series wire bondable chip resistors are ideally suited for
the most demanding hybrid application. The WBC combines IRC’s
TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to produce an extremely small
footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
(0.508mm ±0.025)
0.020˝ ±0.001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
(0.508mm ±0.025)
0.020˝ ±0.001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
R0202 and
T0303
B0202
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
(0.762mm ±0.025)
0.030˝ ±0.001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
WBC Series Issue January 2009 Sheet 1 of 3
Request: Tool for browsing jpeg2000 images on wince or winmobile
RT. I haven't found it yet. Please let me know if you know it. Thank you....
huanglx Embedded System
I need help with the topic of wireless environment monitoring in 2009! ! ! thx~~~
[i=s] This post was last edited by paulhyde on 2014-9-15 09:03 [/i] In the 2009 wireless environment monitoring topic, I saw a previous paper that used two 1N4148s in reverse series and a 4.7mH induct...
ase841429627 Electronics Design Contest
Some minor issues in USB flash drive reading and writing for AT91 new chip development
I'm working on a project recently, using the at91sam7x256 chip to make a USB flash drive reading and writing program, developed on the IAR platform. There is an executable program, but there are some ...
hjj000 Embedded System
Image Processing Capability Assessment 2 - Creating the First Project File
[i=s]This post was last edited by ilovefengshulin on 2016-12-10 08:58[/i] [align=center][b][font=宋体][size=16.0pt]Image processing capability evaluation 2 - Creating the first project file[/size][/font...
ilovefengshulin stm32/stm8
Voltage Controlled Oscillator Problems
The attachment is a 10M Crabbe oscillator circuit. Can anyone help me change it to a 10M~100M voltage-controlled oscillator circuit? Thank you!...
QQWEB Analog electronics
Question about using NPN transistor as a switch. The title should be long.
[i=s]This post was last edited by muxingjun on 2016-4-8 10:34[/i] [size=5][color=#ff0000]Thanks to maychange and everyone for their answers. Actually, the diode is not important, so I deleted it. Actu...
muxingjun TI Technology Forum

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2825  1927  1978  886  1474  57  39  40  18  30 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号