WBDDQSC-B-03-9760-D-C datasheet, PDF

WBDDQSC-B-03-9760-D-C: DescriptionArray/Network Resistor, Bussed, 0.05W, 976ohm, 100V, 0.5% +/-Tol, -25,25ppm/Cel, 1109,; CategoryPassive components The resistor; File Size273KB，4 Pages; ManufacturerTT Electronics plc; Websitehttp://www.ttelectronics.com/

Download Datasheet Parametric View All

WBDDQSC-B-03-9760-D-C Overview

Array/Network Resistor, Bussed, 0.05W, 976ohm, 100V, 0.5% +/-Tol, -25,25ppm/Cel, 1109,

Parameter Name	Attribute value
Objectid	803144005
Reach Compliance Code	compliant
ECCN code	EAR99
structure	Chip
Network Type	Bussed
Number of terminals	24
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Package height	0.406 mm
Package length	2.921 mm
Package form	SMT
Package width	2.184 mm
method of packing	Tray
Rated power dissipation(P)	0.05 W
resistance	976 Ω
Resistor type	ARRAY/NETWORK RESISTOR
series	WBC-NETWORK
size code	1109
Temperature Coefficient	25 ppm/°C
Tolerance	0.5%
Operating Voltage	100 V

Wire Bondable

Resistor Network Arrays

Chip Network Array Series

Absolute tolerances to ±0.1%

Tight TCR tracking to ±5ppm/°C

Ratio match tolerances to ±0.05%

Ultra-stable tantalum nitride resistors

IRC’s TaNSil

network array resistors are ideally suited for applications that demand a small footprint. The small wire

bondable chip package provides higher component density, lower resistor cost and high reliability.

The tantalum nitride film system on silicon provides precision tolerance, exceptional TCR tracking and low cost.

Excellent performance in harsh, humid environments is a trademark of IRC’s self-passivating TaNSil

resistor film.

For applications requiring high performance resistor networks in a low cost, wire bondable package, specify IRC

network array die.





General Note

TT electronics reserves the right to make changes in product specification without notice or liability.

All information is subject to TT electronics’ own data and is considered accurate at time of going to print.

www.bitechnologies.com www.irctt.com www.welwyn-tt.com

10. 11

Embedded development novice help!: The teacher left an embedded homework. Choose one of the following: Experiment 14 LCD driver experiment Experiment 15 Touch screen driver experiment Experiment 16 IDE_CF card module reading and writin...; liujincai1230 Embedded System

About 51.AVR.PIC.Renesas instruction processing time: About 51.AVR.PIC.Renesas instruction processing time...; chenwenjun123 Renesas Electronics MCUs

Can OutputDebugString() be used in release mode?: Can I use OutputDebugString() to print output under ce release? If not, what function should I use?...; mayi_huan Embedded System

Urgent question: Cannot read serial port using GPRS serial modem under WinCE: I bought a serial port SIM300GPRS module and want to use it for dial-up Internet access on WinCE. When I connect the module to COM1 on the PC, send "AT/r" and receive: at OK. But on the development bo...; 2008pcu Embedded System

What is the prospect of software development for POS machines?: I am working on a bank POS system in my company, developed using C language. I don't know what the future holds. Could you please give me some professional advice?...; fs3328787 Embedded System

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components