2.0 mm x 2.5 mm Ceramic Package SMD TCXO
I583/I783 Series
Product Features:
Low Current Consumption
Ultra Miniature Package
RoHS Compliant
Compatible with Leadfree Processing
Applications:
Server & Storage
CDMA/WCDMA
802.11 / Wifi
T1/E1, T3/E3
2.0+/-0.2
1
2
2.50+/- 0.2
4
3
Frequency
Output Level
Clipped Sinewave
Output Load
Clipped Sinewave
Frequency Stability
Vs Temperature
Vs Voltage
Vs Load(5%)
Frequency Tolerance @ 25
C
Aging
Supply Voltage
Current
Voltage Control (I783)
(Contact Sales Channel for other available frequencies)
0.8 V p-p Min.
1.1 Max.
10K Ohms / 10 pF
1
0.10
2
0.6
See Frequency Stability Table
0.2 ppm Max.
.0.2
ppm Max.
2
.0 ppm (After 2 Reflow)
1 ppm / Year Max.
See Supply Voltage Table , tolerance
5%
2.0 mA Max.
1.5 VDC
1.0 VDC,
5.0 ppm Min. (Custom Available)
Units with Vcc less than + 3.0 VDC, Vnom = 50% of Vcc
with ±5 ppm change from 0.0 VDC to Vcc.
See Operating Temperature Table
-40
C to +85
C
-8.0 dBc Max.
-130 dBc/Hz @ 1KHz
2.3
nd
4
3
0.10
0.5
Recommended Pad Layout
2.80
4
3
0.6
1
2
1.4
No pattern area
Operating
Storage
Harmonics
Phase Noise
Pin
1
2
3
4
Connection
Vcontrol / N.C.
GND
Output
Vcc
Dimension Units: mm
Package
Part Number Guide
Operating Temperature
7 = 0 C to +50 C
1 = 0 C to +70 C
3 = -20 C to +70 C
5 = -30 C to +85 C
Sample Part Number: I583-5P8-26.000 Mhz
FrequencyStability vs Temperature
Supply Voltage
P =
2.0
ppm
Q =
2.5
ppm
R =
3.0
ppm
J =
5.0
ppm
3 = 3.3 V
7 = 3.0 V
8 = 2.8 V
2 = 2.7 V
1 = 1.8 V
Frequency
I583 (Clipped Sinewave TCXO)
I783 (Clipped Sinewave TCVCXO)
- 26.000 MHz
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise.
** Not available for all temperature ranges.
ILSI America Phone 775-851-8880
●
Fax 775-851-8882
●email:
e-mail@ilsiamerica.com
●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 12/02/15_E
Page 1 of 2
2.0 mm x 2.5 mm Ceramic Package SMD TCXO
Pb Free Solder Reflow Profile:
Typical Application:
I583/I783 Series
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions).
Termination = e4 (Au over Ni over W base metalization).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
3000
8 +/-.3
4 +/-.2
3.5 +/-.2
9 +/-1 or 12 +/-3
60 / 80
180
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: I-Date Code (yww)
Line 2: Frequency
PROPRIETARY AND CONFIDENTIAL
THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION, AND SUCH INFORMATION MAY NOT BE DISCLOSED TO OTHERS FOR ANY
PURPOSE NOR USED FOR MANUFACTURING PURPOSES WITHOUT WRITTEN PERMISSION FROM ILSI America.
ILSI America Phone 775-851-8880
●
Fax 775-851-8882
●email:
e-mail@ilsiamerica.com
●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 12/02/15_E
Page 2 of 2