MKL16Z64VFT4 datasheet, PDF - EEWORLD Datasheet

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MKL16Z64VFT4: Descriptionarm microcontrollers - mcu cortex M0+ 64k flash; Categorysemiconductor Other integrated circuit (IC); File Size987KB，59 Pages; ManufacturerFREESCALE (NXP); Environmental Compliance

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arm microcontrollers - mcu cortex M0+ 64k flash

MKL16Z64VFT4 Parametric

Parameter Name	Attribute value
Manufacture	Freescale Semiconduc
Product Category	ARM Microcontrollers - MCU
RoHS	Yes
Core	ARM Cortex M0+
Data Bus Width	32 bi
Maximum Clock Frequency	48 MHz
Program Memory Size	64 kB
Data RAM Size	8 kB
On-Chip ADC	Yes
Maximum Operating Temperature	+ 125 C
Package / Case	QFN-48
Mounting Style	SMD/SMT
A/D Bit Size	16 bi
A/D Channels Available	1
Data RAM Type	RAM
Interface Type	I2C, SPI, UART
Minimum Operating Temperature	- 40 C
Number of Timers	3
On-Chip DAC	Yes
Packaging	Tray
Processor Series	KL1x
Program Memory Type	Flash
Factory Pack Quantity	260
Unit Weigh	138.700 mg

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Freescale Semiconductor, Inc.

Data Sheet: Technical Data

KL16P64M48SF5

Rev 3 03/2014

Kinetis KL16 Sub-Family

48 MHz Cortex-M0+ Based Microcontroller

Designed with efficiency in mind. Compatible with all other

Kinetis L families as well as Kinetis K1x family. General purpose

MCU featuring market leading ultra low-power to provide

developers an appropriate entry-level 32-bit solution.

This product offers:

• Run power consumption down to 40 μA/MHz in very low

power run mode

• Static power consumption down to 2 μA with full state

retention and 4.5 μs wakeup

• Ultra-efficient Cortex-M0+ processor running up to 48 MHz

with industry leading throughput

• Memory option is up to 128 KB flash and 16 KB RAM

• Energy-saving architecture is optimized for low power with

90nm TFS technology, clock and power gating techniques,

and zero wait state flash memory controller

MKL16ZxxxVFM4

MKL16ZxxxVFT4

MKL16ZxxxVLH4

32-pin QFN (FM)

48-pin QFN (FT)

5 x 5 x 1 Pitch 0.5 mm 7 x 7 x 1 Pitch 0.5 mm

64-pin LQFP (LH)

10 x 10 x 1.4 Pitch 0.5 mm

Performance

• 48 MHz ARM

Cortex

-M0+ core

Memories and memory interfaces

• Up to 128 KB program flash memory

• Up to 16 KB SRAM

Human-machine interface

• Low-power hardware touch sensor interface (TSI)

• Up to 54 general-purpose input/output (GPIO)

Communication interfaces

• Two 16-bit SPI modules

• I2S (SAI) module

• One low power UART module

• Two UART modules

• Two I2C module

System peripherals

• Nine low-power modes to provide power optimization

based on application requirements

• COP Software watchdog

• 4-channel DMA controller, supporting up to 63 request

Analog Modules

sources

• 16-bit SAR ADC

• Low-leakage wakeup unit

• 12-bit DAC

• SWD debug interface and Micro Trace Buffer

• Analog comparator (CMP) containing a 6-bit DAC

• Bit Manipulation Engine

and programmable reference input

Clocks

Timers

• 32 kHz to 40 kHz or 3 MHz to 32 MHz crystal oscillator

• Six channel Timer/PWM (TPM)

• Multi-purpose clock source

• Two 2-channel Timer/PWM modules

• Periodic interrupt timers

Operating Characteristics

• 16-bit low-power timer (LPTMR)

• Voltage range: 1.71 to 3.6 V

• Real time clock

• Flash write voltage range: 1.71 to 3.6 V

• Temperature range (ambient): -40 to 105°C

Security and integrity modules

• 80-bit unique identification number per chip

Freescale reserves the right to change the detail specifications as may be required to

Table of Contents

1 Ratings..................................................................................4

1.1 Thermal handling ratings...............................................4

1.2 Moisture handling ratings...............................................4

1.3 ESD handling ratings.....................................................4

1.4 Voltage and current operating ratings............................4

2 General.................................................................................5

2.1 AC electrical characteristics...........................................5

2.2 Nonswitching electrical specifications............................5

2.2.1 Voltage and current operating requirements......5

2.2.2 LVD and POR operating requirements..............6

2.2.3 Voltage and current operating behaviors...........7

2.2.4 Power mode transition operating behaviors.......8

2.2.5 Power consumption operating behaviors...........9

2.2.6 EMC radiated emissions operating behaviors. . .15

2.2.7 Designing with radiated emissions in mind........16

2.2.8 Capacitance attributes.......................................16

2.3 Switching specifications.................................................16

2.3.1 Device clock specifications................................16

2.3.2 General switching specifications........................17

2.4 Thermal specifications...................................................17

2.4.1 Thermal operating requirements........................17

2.4.2 Thermal attributes..............................................18

3 Peripheral operating requirements and behaviors................18

3.1 Core modules................................................................18

3.1.1 SWD electricals .................................................18

3.2 System modules............................................................20

3.3 Clock modules...............................................................20

3.3.1 MCG specifications............................................20

3.3.2 Oscillator electrical specifications......................22

3.4 Memories and memory interfaces.................................24

3.4.1 Flash electrical specifications............................24

3.5 Security and integrity modules.......................................25

3.6 Analog............................................................................25

3.6.1

ADC electrical specifications..............................25

3.6.2 CMP and 6-bit DAC electrical specifications......30

3.6.3 12-bit DAC electrical characteristics..................32

3.7 Timers............................................................................35

3.8 Communication interfaces.............................................35

3.8.1 SPI switching specifications...............................35

3.8.2 Inter-Integrated Circuit Interface (I2C) timing.....40

3.8.3 UART.................................................................41

3.8.4 I2S/SAI switching specifications........................41

3.9 Human-machine interfaces (HMI)..................................45

3.9.1 TSI electrical specifications................................45

Dimensions...........................................................................46

4.1 Obtaining package dimensions......................................46

Pinout....................................................................................46

5.1 KL16 Signal Multiplexing and Pin Assignments.............46

5.2 KL16 pinouts..................................................................49

Ordering parts.......................................................................52

6.1 Determining valid orderable parts..................................52

Part identification...................................................................52

7.1 Description.....................................................................53

7.2 Format...........................................................................53

7.3 Fields.............................................................................53

7.4 Example.........................................................................53

Terminology and guidelines..................................................54

8.1 Definition: Operating requirement..................................54

8.2 Definition: Operating behavior.......................................54

8.3 Definition: Attribute........................................................54

8.4 Definition: Rating...........................................................55

8.5 Result of exceeding a rating..........................................55

8.6 Relationship between ratings and operating

requirements..................................................................56

8.7 Guidelines for ratings and operating requirements........56

8.8 Definition: Typical value.................................................57

8.9 Typical value conditions.................................................58

9 Revision history.....................................................................58

Kinetis KL16 Sub-Family, Rev3 03/2014.

Freescale Semiconductor, Inc.

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Manufacture	Freescale Semiconduc	Freescale Semiconduc	Freescale Semiconduc	Freescale Semiconduc	Freescale Semiconduc	Freescale Semiconduc	Freescale Semiconduc	Freescale Semiconduc	Freescale Semiconduc	-
Product Category	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	-
RoHS	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	-
Core	ARM Cortex M0+	ARM Cortex M0+	ARM Cortex M0+	ARM Cortex M0+	ARM Cortex M0+	ARM Cortex M4	ARM Cortex M0+	ARM Cortex M0+	ARM Cortex M0+	-
Data Bus Width	32 bi	32 bi	32 bi	32 bi	32 bi	32 bi	32 bi	32 bi	32 bi	-
Maximum Clock Frequency	48 MHz	48 MHz	48 MHz	48 MHz	48 MHz	48 MHz	48 MHz	48 MHz	48 MHz	-
Program Memory Size	64 kB	32 kB	128 kB	64 kB	128 kB	32 kB	32 kB	64 kB	128 kB	-
Data RAM Size	8 kB	4 kB	16 kB	8 kB	16 kB	4 kB	4 kB	8 kB	16 kB	-
On-Chip ADC	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	-
Maximum Operating Temperature	+ 125 C	+ 125 C	+ 125 C	+ 125 C	- 40 C to + 105 C	+ 105 C	+ 125 C	+ 125 C	+ 105 C	-
Package / Case	QFN-48	QFN-32	QFN-48	QFN-32	LQFP-64	LQFP-64	QFN-48	LQFP-64	LQFP-64	-
Mounting Style	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT	-
A/D Bit Size	16 bi	16 bi	16 bi	16 bi	12 bi	16 bi	16 bi	16 bi	16 bi	-
A/D Channels Available	1	1	1	1	-	1	1	1	1	-
Data RAM Type	RAM	RAM	RAM	RAM	Flash	RAM	RAM	RAM	RAM	-
Interface Type	I2C, SPI, UART	I2C, SPI, UART	I2C, SPI, UART	I2C, SPI, UART	I2C, I2S, UART, SPI	I2C, I2S, SPI, UART	I2C, SPI, UART	I2C, SPI, UART	I2C, I2S, SPI, UART	-
Minimum Operating Temperature	- 40 C	- 40 C	- 40 C	- 40 C	- 40 C	- 40 C	- 40 C	- 40 C	- 40 C	-
Number of Timers	3	3	3	3	2	3	3	3	3	-
On-Chip DAC	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	-
Packaging	Tray	Tray	Tray	Tray	Reel	-	Tray	Tray	-	-
Processor Series	KL1x	KL1x	KL1x	KL1x	ARM	KL1	KL1x	KL1x	KL1	-
Program Memory Type	Flash	Flash	Flash	Flash	Flash	Flash	Flash	Flash	Flash	-
Factory Pack Quantity	260	490	260	490	1500	160	260	160	160	-
Unit Weigh	138.700 mg	62.300 mg	138.700 mg	62.300 mg	346.750 mg	346.750 mg	138.700 mg	346.750 mg	346.750 mg	-

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