MKE06Z128VQH4 datasheet, PDF - EEWORLD Datasheet

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MKE06Z128VQH4: Descriptionarm microcontrollers - mcu kinetis E 32-bit mcu, arm cortex-M0+ cor; Categorysemiconductor Other integrated circuit (IC); File Size1MB，38 Pages; ManufacturerFREESCALE (NXP); Environmental Compliance

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MKE06Z128VQH4 Overview

arm microcontrollers - mcu kinetis E 32-bit mcu, arm cortex-M0+ cor

MKE06Z128VQH4 Parametric

Parameter Name	Attribute value
Manufacture	Freescale Semiconduc
Product Category	ARM Microcontrollers - MCU
RoHS	Yes
Core	ARM Cortex M0
Data Bus Width	32 bi
Maximum Clock Frequency	48 MHz
Program Memory Size	128 kB
Data RAM Size	16 kB
On-Chip ADC	Yes
Operating Supply Voltage	2.7 V to 5.5 V
Maximum Operating Temperature	+ 105 C
Package / Case	QFP-64
Mounting Style	SMD/SMT
A/D Bit Size	12 bi
A/D Channels Available	16
Data RAM Type	RAM
Interface Type	I2C, SPI, UART
Minimum Operating Temperature	- 40 C
Number of Programmable I/Os	71
Number of Timers	6
On-Chip DAC	N
Program Memory Type	Flash
Factory Pack Quantity	84
Unit Weigh	1 g

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Freescale Semiconductor

Data Sheet: Technical Data

Document Number MKE06P80M48SF0

Rev 3, 5/2014

KE06 Sub-Family Data Sheet

Supports the following:

MKE06Z64VLD4(R),

MKE06Z128VLD4(R),

MKE06Z64VQH4(R),

MKE06Z128VQH4(R),

MKE06Z64VLH4(R),

MKE06Z128VLH4(R),

MKE06Z64VLK4(R), and

MKE06Z128VLK4(R)

MKE06P80M48SF0

Key features

• Operating characteristics

– Voltage range: 2.7 to 5.5 V

– Flash write voltage range: 2.7 to 5.5 V

– Temperature range (ambient): -40 to 105°C

• Performance

– Up to 48 MHz ARM® Cortex-M0+ core

– Single cycle 32-bit x 32-bit multiplier

– Single cycle I/O access port

• Memories and memory interfaces

– Up to 128 KB flash

– Up to 16 KB RAM

• Clocks

– Oscillator (OSC) - supports 32.768 kHz crystal

or 4 MHz to 24 MHz crystal or ceramic

resonator; choice of low power or high gain

oscillators

– Internal clock source (ICS) - internal FLL with

internal or external reference, 37.5 kHz pre-

trimmed internal reference for 48 MHz system

clock

– Internal 1 kHz low-power oscillator (LPO)

• System peripherals

– Power management module (PMC) with three

power modes: Run, Wait, Stop

– Low-voltage detection (LVD) with reset or

interrupt, selectable trip points

– Watchdog with independent clock source

(WDOG)

– Programmable cyclic redundancy check module

(CRC)

– Serial wire debug interface (SWD)

– Aliased SRAM bitband region (BIT-BAND)

– Bit manipulation engine (BME)

• Security and integrity modules

– 80-bit unique identification (ID) number per chip

• Human-machine interface

– Up to 71 general-purpose input/output (GPIO)

– Two 32-bit keyboard interrupt modules (KBI)

– External interrupt (IRQ)

• Analog modules

– One up to 16-channel 12-bit SAR ADC,

operation in Stop mode, optional hardware

trigger (ADC)

– Two analog comparators containing a 6-bit

DAC and programmable reference input

(ACMP)

• Timers

– One 6-channel FlexTimer/PWM (FTM)

– Two 2-channel FlexTimer/PWM (FTM)

– One 2-channel periodic interrupt timer (PIT)

– One pulse width timer (PWT)

– One real-time clock (RTC)

Freescale reserves the right to change the detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

1 Ordering parts...........................................................................4

1.1 Determining valid orderable parts......................................4

2 Part identification......................................................................4

2.1 Description.........................................................................4

2.2 Format...............................................................................4

2.3 Fields.................................................................................4

2.4 Example............................................................................5

3 Parameter classification............................................................5

4 Ratings......................................................................................6

4.1 Thermal handling ratings...................................................6

4.2 Moisture handling ratings..................................................6

4.3 ESD handling ratings.........................................................6

4.4 Voltage and current operating ratings...............................7

5 General.....................................................................................7

5.1 Nonswitching electrical specifications...............................7

5.1.1

5.1.2

5.1.3

DC characteristics.................................................7

Supply current characteristics...............................14

EMC performance.................................................15

5.2.2

FTM module timing...............................................17

5.3 Thermal specifications.......................................................18

5.3.1

Thermal characteristics.........................................18

6 Peripheral operating requirements and behaviors....................20

6.1 Core modules....................................................................20

6.1.1

SWD electricals ....................................................20

6.2 External oscillator (OSC) and ICS characteristics.............21

6.3 NVM specifications............................................................23

6.4 Analog...............................................................................24

6.4.1

6.4.2

ADC characteristics...............................................24

Analog comparator (ACMP) electricals.................26

6.5 Communication interfaces.................................................27

6.5.1

6.5.2

SPI switching specifications..................................27

MSCAN.................................................................30

7 Dimensions...............................................................................30

7.1 Obtaining package dimensions.........................................30

8 Pinout........................................................................................31

8.1 Signal multiplexing and pin assignments...........................31

8.2 Device pin assignment......................................................33

9 Revision history.........................................................................36

5.2 Switching specifications.....................................................16

5.2.1

Control timing........................................................16

KE06 Sub-Family Data Sheet, Rev3, 5/2014.

Freescale Semiconductor, Inc.

MKE06Z128VQH4 Related Products

	MKE06Z128VQH4	MKE06Z128VLD4	MKE06Z128VLH4	MKE06Z128VLK4	MKE06Z64VLK4	MKE06Z64VLD4	MKE06Z64VLH4	MKE06Z64VQH4
Description	arm microcontrollers - mcu kinetis E 32-bit mcu, arm cortex-M0+ cor	arm microcontrollers - mcu kinetis E 32-bit mcu, arm cortex-M0+ cor	arm microcontrollers - mcu kinetis E 32-bit mcu, arm cortex-M0+ cor	arm microcontrollers - mcu kinetis E 32-bit mcu, arm cortex-M0+ cor	IC mcu 32bit 64kb flash 80qfp	IC mcu 32bit 64kb flash 44qfp	IC mcu 32bit 64kb flash 64qfp	IC mcu 32bit 64kb flash 64qfp
Program Memory Size	128 kB	128 kB	128 kB	128 kB	64KB (64K x 8)	64KB (64K x 8)	64KB (64K x 8)	-
Package / Case	QFP-64	LQFP-44	LQFP-64	LQFP-80	80-LQFP	44-LQFP	64-LQFP	-
Program Memory Type	Flash	Flash	Flash	Flash	FLASH	FLASH	FLASH	-

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