74AUP2G17GM,115 datasheet, PDF

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74AUP2G17GM,115: Descriptionbuffers & line drivers 1.8V dual schmitt; Categorylogic logic; File Size211KB，21 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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74AUP2G17GM,115 Overview

buffers & line drivers 1.8V dual schmitt

74AUP2G17GM,115 Parametric

Parameter Name	Attribute value
Brand Name	NXP Semiconduc
Is it Rohs certified?	conform to
Parts packaging code	SON
package instruction	1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6
Contacts	6
Manufacturer packaging code	SOT886
Reach Compliance Code	compli
series	AUP/ULP/V
JESD-30 code	R-PDSO-N6
JESD-609 code	e3
length	1.45 mm
Load capacitance (CL)	30 pF
Logic integrated circuit type	BUFFER
MaximumI(ol)	0.0017 A
Humidity sensitivity level	1
Number of functions	2
Number of entries	1
Number of terminals	6
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	VSON
Encapsulate equivalent code	SOLCC6,.04,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE
method of packing	TAPE AND REEL
Peak Reflow Temperature (Celsius)	260
power supply	1.2/3.3 V
Prop。Delay @ Nom-Su	20.1 ns
propagation delay (tpd)	20.1 ns
Certification status	Not Qualified
Schmitt trigger	YES
Maximum seat height	0.5 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	0.8 V
Nominal supply voltage (Vsup)	1.1 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Tin (Sn)
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	1 mm
Base Number Matches	1

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74AUP2G17

Low-power dual Schmitt trigger

Rev. 6 — 4 December 2012

Product data sheet

1. General description

The 74AUP2G17 provides two Schmitt trigger buffers. It is capable of transforming slowly

changing input signals into sharply defined, jitter-free output signals.

This device ensures a very low static and dynamic power consumption across the entire

range from 0.8 V to 3.6 V.

This device is fully specified for partial power-down applications using I

OFF

The I

OFF

circuitry disables the output, preventing the damaging backflow current through

the device when it is powered down.

The inputs switch at different points for positive and negative-going signals. The difference

between the positive voltage V

T+

and the negative voltage V

T

is defined as the input

hysteresis voltage V

2. Features and benefits



Wide supply voltage range from 0.8 V to 3.6 V



High noise immunity



ESD protection:



HBM JESD22-A114F Class 3A exceeds 5000 V



MM JESD22-A115-A exceeds 200 V



CDM JESD22-C101E exceeds 1000 V



Low static power consumption; I

= 0.9

A

(maximum)



Latch-up performance exceeds 100 mA per JESD 78 Class II



Inputs accept voltages up to 3.6 V



Low noise overshoot and undershoot < 10 % of V



OFF

circuitry provides partial Power-down mode operation



Multiple package options



Specified from

40 C

to +85

C

and

40 C

to +125

C

74AUP2G17GM,115 Related Products

	74AUP2G17GM,115	74AUP2G17GM,132	74AUP2G17GF,132	74AUP2G17GW,125
Description	buffers & line drivers 1.8V dual schmitt	buffers & line drivers 1.8V dual schmitt	buffers & line drivers schmitt trig buffer 2-CH non-invert cmos	buffers & line drivers 1.8V dual schmitt
Brand Name	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc
Is it Rohs certified?	conform to	conform to	conform to	conform to
Parts packaging code	SON	SON	SON	TSSOP
package instruction	1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6	1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6	1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, XSON-6	GREEN, PLASTIC, SC-88, SOT-363, SMT-6 PIN
Contacts	6	6	6	6
Manufacturer packaging code	SOT886	SOT886	SOT891	SOT363
Reach Compliance Code	compli	compli	compli	compli
series	AUP/ULP/V	AUP/ULP/V	AUP/ULP/V	AUP/ULP/V
JESD-30 code	R-PDSO-N6	R-PDSO-N6	S-PDSO-N6	R-PDSO-G6
JESD-609 code	e3	e3	e3	e3
length	1.45 mm	1.45 mm	1 mm	2 mm
Load capacitance (CL)	30 pF	30 pF	30 pF	30 pF
Logic integrated circuit type	BUFFER	BUFFER	BUFFER	BUFFER
MaximumI(ol)	0.0017 A	0.0017 A	0.0017 A	0.0017 A
Humidity sensitivity level	1	1	1	1
Number of functions	2	2	2	2
Number of entries	1	1	1	1
Number of terminals	6	6	6	6
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VSON	VSON	VSON	TSSOP
Encapsulate equivalent code	SOLCC6,.04,20	SOLCC6,.04,20	SOLCC6,.04,14	TSSOP6,.08
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL
Peak Reflow Temperature (Celsius)	260	260	260	260
power supply	1.2/3.3 V	1.2/3.3 V	1.2/3.3 V	1.2/3.3 V
Prop。Delay @ Nom-Su	20.1 ns	20.1 ns	20.1 ns	20.1 ns
propagation delay (tpd)	20.1 ns	20.1 ns	20.1 ns	20.1 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	YES	YES	YES	YES
Maximum seat height	0.5 mm	0.5 mm	0.5 mm	1.1 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	0.8 V	0.8 V	0.8 V	0.8 V
Nominal supply voltage (Vsup)	1.1 V	1.1 V	1.1 V	1.2 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	Tin (Sn)	Tin (Sn)	Tin (Sn)	Tin (Sn)
Terminal form	NO LEAD	NO LEAD	NO LEAD	GULL WING
Terminal pitch	0.5 mm	0.5 mm	0.35 mm	0.65 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	30	30
width	1 mm	1 mm	1 mm	1.25 mm
Base Number Matches	1	1	1	1

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