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74AUP2G17GM,132

Description
buffers & line drivers 1.8V dual schmitt
Categorylogic    logic   
File Size211KB,21 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74AUP2G17GM,132 Overview

buffers & line drivers 1.8V dual schmitt

74AUP2G17GM,132 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconduc
Is it Rohs certified?conform to
Parts packaging codeSON
package instruction1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6
Contacts6
Manufacturer packaging codeSOT886
Reach Compliance Codecompli
seriesAUP/ULP/V
JESD-30 codeR-PDSO-N6
JESD-609 codee3
length1.45 mm
Load capacitance (CL)30 pF
Logic integrated circuit typeBUFFER
MaximumI(ol)0.0017 A
Humidity sensitivity level1
Number of functions2
Number of entries1
Number of terminals6
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeVSON
Encapsulate equivalent codeSOLCC6,.04,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, VERY THIN PROFILE
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
power supply1.2/3.3 V
Prop。Delay @ Nom-Su20.1 ns
propagation delay (tpd)20.1 ns
Certification statusNot Qualified
Schmitt triggerYES
Maximum seat height0.5 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)0.8 V
Nominal supply voltage (Vsup)1.1 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceTin (Sn)
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width1 mm
Base Number Matches1
74AUP2G17
Low-power dual Schmitt trigger
Rev. 6 — 4 December 2012
Product data sheet
1. General description
The 74AUP2G17 provides two Schmitt trigger buffers. It is capable of transforming slowly
changing input signals into sharply defined, jitter-free output signals.
This device ensures a very low static and dynamic power consumption across the entire
V
CC
range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using I
OFF
.
The I
OFF
circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
The inputs switch at different points for positive and negative-going signals. The difference
between the positive voltage V
T+
and the negative voltage V
T
is defined as the input
hysteresis voltage V
H
.
2. Features and benefits
Wide supply voltage range from 0.8 V to 3.6 V
High noise immunity
ESD protection:
HBM JESD22-A114F Class 3A exceeds 5000 V
MM JESD22-A115-A exceeds 200 V
CDM JESD22-C101E exceeds 1000 V
Low static power consumption; I
CC
= 0.9
A
(maximum)
Latch-up performance exceeds 100 mA per JESD 78 Class II
Inputs accept voltages up to 3.6 V
Low noise overshoot and undershoot < 10 % of V
CC
I
OFF
circuitry provides partial Power-down mode operation
Multiple package options
Specified from
40 C
to +85
C
and
40 C
to +125
C

74AUP2G17GM,132 Related Products

74AUP2G17GM,132 74AUP2G17GM,115 74AUP2G17GF,132 74AUP2G17GW,125
Description buffers & line drivers 1.8V dual schmitt buffers & line drivers 1.8V dual schmitt buffers & line drivers schmitt trig buffer 2-CH non-invert cmos buffers & line drivers 1.8V dual schmitt
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc
Is it Rohs certified? conform to conform to conform to conform to
Parts packaging code SON SON SON TSSOP
package instruction 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6 1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, XSON-6 GREEN, PLASTIC, SC-88, SOT-363, SMT-6 PIN
Contacts 6 6 6 6
Manufacturer packaging code SOT886 SOT886 SOT891 SOT363
Reach Compliance Code compli compli compli compli
series AUP/ULP/V AUP/ULP/V AUP/ULP/V AUP/ULP/V
JESD-30 code R-PDSO-N6 R-PDSO-N6 S-PDSO-N6 R-PDSO-G6
JESD-609 code e3 e3 e3 e3
length 1.45 mm 1.45 mm 1 mm 2 mm
Load capacitance (CL) 30 pF 30 pF 30 pF 30 pF
Logic integrated circuit type BUFFER BUFFER BUFFER BUFFER
MaximumI(ol) 0.0017 A 0.0017 A 0.0017 A 0.0017 A
Humidity sensitivity level 1 1 1 1
Number of functions 2 2 2 2
Number of entries 1 1 1 1
Number of terminals 6 6 6 6
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VSON VSON VSON TSSOP
Encapsulate equivalent code SOLCC6,.04,20 SOLCC6,.04,20 SOLCC6,.04,14 TSSOP6,.08
Package shape RECTANGULAR RECTANGULAR SQUARE RECTANGULAR
Package form SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing TAPE AND REEL TAPE AND REEL TAPE AND REEL TAPE AND REEL
Peak Reflow Temperature (Celsius) 260 260 260 260
power supply 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V
Prop。Delay @ Nom-Su 20.1 ns 20.1 ns 20.1 ns 20.1 ns
propagation delay (tpd) 20.1 ns 20.1 ns 20.1 ns 20.1 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger YES YES YES YES
Maximum seat height 0.5 mm 0.5 mm 0.5 mm 1.1 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 0.8 V 0.8 V 0.8 V 0.8 V
Nominal supply voltage (Vsup) 1.1 V 1.1 V 1.1 V 1.2 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface Tin (Sn) Tin (Sn) Tin (Sn) Tin (Sn)
Terminal form NO LEAD NO LEAD NO LEAD GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.35 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30 30
width 1 mm 1 mm 1 mm 1.25 mm
Base Number Matches 1 1 1 1
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