BUZ 22
SIPMOS
®
Power Transistor
• N channel
• Enhancement mode
• Avalanche-rated
Pin 1
G
Pin 2
D
Pin 3
S
Type
BUZ 22
V
DS
100 V
I
D
34 A
R
DS(on)
0.055
Ω
Package
TO-220 AB
Ordering Code
C67078-S1333-A2
Maximum Ratings
Parameter
Continuous drain current
Symbol
Values
34
Unit
A
I
D
I
Dpuls
136
T
C
= 27 °C
Pulsed drain current
T
C
= 25 °C
Avalanche current,limited by
T
jmax
Avalanche energy,periodic limited by
T
jmax
Avalanche energy, single pulse
I
AR
E
AR
E
AS
34
15
mJ
I
D
= 34 A,
V
DD
= 25 V,
R
GS
= 25
Ω
L
= 285.5 µH,
T
j
= 25 °C
Gate source voltage
Power dissipation
220
V
GS
P
tot
±
20
125
V
W
T
C
= 25 °C
Operating temperature
Storage temperature
Thermal resistance, chip case
Thermal resistance, chip to ambient
DIN humidity category, DIN 40 040
IEC climatic category, DIN IEC 68-1
Semiconductor Group
T
j
T
stg
R
thJC
R
thJA
-55 ... + 150
-55 ... + 150
≤
1
75
E
55 / 150 / 56
°C
K/W
1
07/96
BUZ 22
Electrical Characteristics,
at
T
j
= 25°C, unless otherwise specified
Parameter
Symbol
min.
Static Characteristics
Drain- source breakdown voltage
Values
typ.
max.
Unit
V
(BR)DSS
100
-
3
0.1
10
10
0.05
-
4
V
V
GS
= 0 V,
I
D
= 0.25 mA,
T
j
= 25 °C
Gate threshold voltage
V
GS(th)
2.1
V
GS=
V
DS,
I
D
= 1 mA
Zero gate voltage drain current
I
DSS
-
-
1
100
µA
V
DS
= 100 V,
V
GS
= 0 V,
T
j
= 25 °C
V
DS
= 100 V,
V
GS
= 0 V,
T
j
= 125 °C
Gate-source leakage current
I
GSS
-
100
nA
Ω
-
0.055
V
GS
= 20 V,
V
DS
= 0 V
Drain-Source on-resistance
R
DS(on)
V
GS
= 10 V,
I
D
= 22 A
Semiconductor Group
2
07/96
BUZ 22
Electrical Characteristics,
at
T
j
= 25°C, unless otherwise specified
Parameter
Symbol
min.
Dynamic Characteristics
Transconductance
Values
typ.
max.
Unit
g
fs
10
17.5
1400
450
230
-
S
pF
-
1850
700
370
ns
-
20
30
V
DS
≥
2
*
I
D *
R
DS(on)max,
I
D
= 22 A
Input capacitance
C
iss
C
oss
-
V
GS
= 0 V,
V
DS
= 25 V,
f
= 1 MHz
Output capacitance
V
GS
= 0 V,
V
DS
= 25 V,
f
= 1 MHz
Reverse transfer capacitance
C
rss
-
V
GS
= 0 V,
V
DS
= 25 V,
f
= 1 MHz
Turn-on delay time
t
d(on)
V
DD
= 30 V,
V
GS
= 10 V,
I
D
= 3 A
R
GS
= 50
Ω
Rise time
t
r
-
80
120
V
DD
= 30 V,
V
GS
= 10 V,
I
D
= 3 A
R
GS
= 50
Ω
Turn-off delay time
t
d(off)
-
230
300
V
DD
= 30 V,
V
GS
= 10 V,
I
D
= 3 A
R
GS
= 50
Ω
Fall time
t
f
-
120
160
V
DD
= 30 V,
V
GS
= 10 V,
I
D
= 3 A
R
GS
= 50
Ω
Semiconductor Group
3
07/96
BUZ 22
Electrical Characteristics,
at
T
j
= 25°C, unless otherwise specified
Parameter
Symbol
min.
Reverse Diode
Inverse diode continuous forward current
I
S
T
C
= 25 °C
Inverse diode direct current,pulsed
A
-
-
-
-
1.4
130
0.7
34
136
V
-
1.8
ns
-
-
µC
-
-
Values
typ.
max.
Unit
I
SM
V
SD
t
rr
Q
rr
T
C
= 25 °C
Inverse diode forward voltage
V
GS
= 0 V,
I
F
= 68 A
Reverse recovery time
V
R
= 30 V,
I
F=
l
S,
di
F
/dt = 100 A/µs
Reverse recovery charge
V
R
= 30 V,
I
F=
l
S,
di
F
/dt = 100 A/µs
Semiconductor Group
4
07/96
BUZ 22
Power dissipation
P
tot
=
ƒ
(T
C
)
Drain current
I
D
=
ƒ
(T
C
)
parameter:
V
GS
≥
10 V
36
A
130
W
110
P
tot
100
90
80
70
60
50
I
D
28
24
20
16
12
40
30
20
4
10
0
0
0
20
40
60
80
100
120
°C
160
0
20
40
60
80
100
120
°C
160
8
T
C
T
C
Safe operating area
I
D
=
ƒ
(V
DS
)
parameter:
D
= 0.01,
T
C
= 25°C
10
3
Transient thermal impedance
Z
th JC
=
ƒ
(t
p
)
parameter:
D = t
p
/
T
10
1
K/W
A
10
0
t
= 23.0µs
p
I
D
10
2
DS
Z
thJC
10
-1
/
I
D
DS
(o
n)
=
V
100 µs
10
-2
D = 0.50
1 ms
R
0.20
10
1
10 ms
10
-3
0.10
0.05
10
-4
single pulse
0.02
0.01
10
0
0
10
10
1
DC
2
V 10
10
-5
-7
10
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
s 10
0
V
DS
t
p
Semiconductor Group
5
07/96
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