Memory Circuit,
| Parameter Name | Attribute value |
| Objectid | 8005874886 |
| package instruction | DFP, |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.1.A |
| JESD-30 code | R-CDFP-F64 |
| length | 48.26 mm |
| memory density | 67108864 bit |
| Memory IC Type | MEMORY CIRCUIT |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 64 |
| word count | 8388608 words |
| character code | 8000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 105 °C |
| Minimum operating temperature | -40 °C |
| organize | 8MX8 |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DFP |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Certification status | Not Qualified |
| Filter level | MIL-PRF-38535 Class Q |
| Maximum seat height | 6.0452 mm |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| total dose | 1M Rad(Si) V |
| width | 24.13 mm |
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