Automotive SM Crystal (AEC-Q200)
Specifications
2011/65/EU
GRX-210
Parameters
Product
GRX-210
26.0 ~ 40.0MHz
±10ppm
±15ppm
±20ppm
Other values
±15ppm
±20ppm
±50ppm
Other values
M
A
B
D
specify
F
1
P
2
specify
P
2
5
specify
4
A
specify
Option
Codes
Frequency range:
Calibration tolerance:
Temperature stability:
1.60
±0.10
1.20
±0.10
0.45 (max)
Operating temperature range:
-40 to +85°C
-40 to +125°C
Other values
SOLDER PAD LAYOUT
0.30
0.20
Storage temperature range:
-40 to +125°C
Circuit condition:
8pF
10pF
12pF
16pF
Other values
Fundamental
5pF max
1
4
0.50
(typ)
2
3
0.30
(typ)
0.52
0.52
0.67
PAD
1
2
3
4
CONNECTION
Crystal
Ground & lid
Crystal
Ground
0.67
Oscillation mode:
Static capacitance (C
0
):
Equivalent series resistance (max):
100Ω (26.0 ~ 29.99MHz)
80Ω (30.0 ~ 40.0MHz)
Ageing:
±3ppm max first year
Features
Test drive level:
10μW typ, 100μW max
Soldering condition:
260°C, 10 sec x2 max
AEC-Q200 qualified for automotive apps
Seam sealed for excellent long-term stability
High reliability at low cost
Metal lid can be grounded to minimise EMI
Miniature for maximum space/weight saving
Standard.
Optional - Please specify required code(s) when ordering
Ordering Information
Product name + option codes + frequency
eg:
GRX-210/P24MF 32.0MHz
15/20/-40+85/8-F
GRX-210/25ABF 27.0MHz
20/50/-40+125/12-F
Option code X (eg GRX-210/X) denotes a custom specification.
Example Applications
Vehicle telematics
Connected car
Remote Keyless Entry (RKE)
Audio - DAB / Bluetooth
Camera
Tel:
+44 1460 256 100
08 Oct 2015
Fax:
+44 1460 256 101
E-mail:
sales@golledge.com
Web:
www.golledge.com
Product Information
Construction
GRX-210
Ceramic body with gold-plated pads
Metal lid, seam sealed
Composition
This product is lead-free, and is fully compliant with
the RoHS directive 2011/65/EU
2011/65/EU
Pb
LeadFree
Packaging & Handling
Production quantities supplied on T&R, 3k pcs per reel.
Small quantities may be supplied on tape (no reel), or in bulk.
Soldering Profile
°C
10s max
Marking
FREQUENCY
S DC
Marking type: Laser
DC = Date code in YM, eg
“EJ”
= Sep 2015
260
200
A
B
C
D
E
F
G H
J
K
L M
Y
1
2
3
4
5
6
7
8
9
0
M Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
100
5°C/s max
5°C/s max
Tape & Reel Specification
2.0 2.0
0.25
±0.02
0.5Ø 1.55Ø
1.75
0
Preheat
140~160°C
60~90s max
Heat
> 200°C
50~60s max
Slow
cooldown
Time
Maximum solder resistance: 260
°
C x 10 secs x 2.
5°
±0.05
MARK
3.5
1.85
8.0
±0.2
0.45
1.45
9.0
FEED
±0.5
2.0
120°
2.00
±0.5
21.0Ø
±0.8
13Ø
180Ø
+0.0
-3.0
60Ø
Not to scale. Dimensional tolerances ±0.1mm unless otherwise stated.
Tel:
+44 1460 256 100
08 Oct 2015
Fax:
+44 1460 256 101
E-mail:
sales@golledge.com
Web:
www.golledge.com
Microcontroller MCU
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