VXN1
1.6 x 1.2mm Crystal
Standard Crystal Datasheet
Helping Customers Innovate, Improve & Grow
Table 1. Electrical Performance
Parameter
Nominal Frequency
Mode
Operating Temperature Range
Stability Over T
OP1
,
ordering option
Frequency Tolerance
2
Load Capacitance,
ordering option
Shunt Capacitance
Drive Level
T
OP
F
STAB
F
TOL
C
L
C
o
10
F
AGE
500
Description
T
STO
ESR
-40
90
Equivalent Series Resistance
Crystal Frequency
24.000MHz-37.399MHz
37.400MHz-54.000MHz
Ohm
100
80
6
±15
±10
Symbol
F
NOM
Min.
24.000
Fundamental, AT - Cut
0/70, -10/70, -20/70, -40/85
±100
±20
32
5
100
±5
°C
ppm
ppm
pF
pF
uW
ppm
MOhm
°C
Typ
Max
54.000
Units
MHz
VT-804
Aging / 1st year (at 25 °C)
Insulation Resistance
Storage Temperature
Features
Applications
Notes:
1. Referenced to the Frequency at 25 °C.
2. Frequency measured at 25 °C ± 3 °C.
Product is compliant to RoHS directive and fully compatible with lead free assembly.
Package Drawing
Table 2. Pinout
Pin
1
2
3
4
Function
Crystal
Connected to cover
(Connect to GND)
Crystal
Connect to GND
Botttom View
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Table 2. Environmental Compliance
Parameter
Mechanical Shock
Mechanical Vibration
Temperature Cycle
Solderability
Gross and Fine Leak
Altitude
Moisture Sensitivity Level
Contact Pads
Weight
Conditions
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
MIL-STD-883, Method 1010, Condition B
MIL-STD-202-210, Condition B
MIL-STD-883, Method 1014
MIL-STD-883, Method 1001, Condition B
MSL 1
Gold (0.2 um min) over Nickel
3.2 mg
Reliability & IR Compliance
Table 3: Reflow Profile
Parameter
PreHeat Time
Ts-min
Ts-max
Ramp Up
Time Above 217 °C
Time To Peak Temperature
Time at 260 °C
Ramp Down
Symbol
t
S
Value
60 sec Min, 260 sec Max
150°C
200°C
3 °C/sec Max
60 sec Min, 150 sec Max
480 sec Max
30 sec Max
6 °C/sec Max
R
UP
t
L
T
AMB-P
t
P
R
DN
Pads are Au over Ni and compatible with either SnPb or Pb free attachment.
MSL: 1
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Tape & Reel
Table 4. Tape and Reel Dimensions (mm)
Tape
A
1.85
B
1.45
C
8.0
D
3.5
E
1.75
F
4.0
G
4.0
H
2.0
J
0.5
K
1.55
L
0.25
M
0.45
Reel
A
180
B
60
C
21.0
D
13.0
E
2.0
W
9.0
T
2.0
3K pieces per reel
Ordering Information
VXN1 - XXX - XX- xxMxxxxxxxXX
Product
1.6 x 1.2mm, Crystal
Mode
1:
Fundamental
Temp Stability
D:
±15ppm
E:
±20ppm
F:
±25ppm
G:
±30ppm
H:
±35ppm
I:
±40ppm
J:
±45ppm
K:
±50ppm
S:
±100ppm
Packaging
TR:
Tape and Reel
blank: Cut Tape / non Tape and Reel quantities
_SNPB: Tin lead solder dipped
Frequency in MHz
Load Capacitance
00: Series Resonance
06-32pF
Operating Temperature
E:
-40 to 85 °C
J:
-20 to 70 °C
*Note: not all combination of options are available. Other specifications may be available upon request.
Example:
VXN1-1EE-12-25M0000000TR
VXN1-1EE-12-25M0000000
VXN1-1EE-12-25M0000000_SNPB
Tape and Reel
Cut Tape
Tin lead solder dipped
Page3
Revision History
Revision Date
August 23, 2016
August 10, 2018
June 07, 2019
April 30, 2020
Approved
RC
FB
FB
FB
Description
Initial datasheet for factory approval and release to customer.
Update logo and contact information, add “SNPBDIP” ordering option
Update logo and contact information, add Table 2 Environmental compliance,
change “SNPBDIP” to “SNPB”
Add tape and reel option ordering option
Contact Information
USA:
100 Watts Street
Mt Holly Springs, PA 17065
Tel: 1.717.486.3411
Fax: 1.717.486.5920
Europe:
For Additional Information, Please Contact
Landstrasse
74924 Neckarbischofsheim
Germany
Tel: +49 (0) 7268.801.0
Fax: +49 (0) 7268.801.281
Information contained in this publication regarding device applications and the like is provided only for your convenience and
may be superseded by updates. It is your reasonability to ensure that your application meets with your specifications. MICROCHIP
MAKES NO REPRESENTATION OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATU-
TORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING, BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFOR-
MANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use.
Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend,
indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses
are conveyed, implicitly, or otherwise, under any Microchip intellectual property rights unless otherwise stated.
Trademarks
The Microchip and Vectron names and logos are registered trademarks of Microchip Technology Incorporated in the U.S.A. and
other countries.
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