REVISIONS
LTR
C
DESCRIPTION
Change minimum dimensions A, b, and E for case outline U. Add
CAGE 65786 as a source of supply. Editorial changes throughout. -
ksr
Change case outline 9, dimension A from .114 inches to .130 inches. -
glg
Added low-power devices 09 - 14 to drawing. Removed CAGE
0EU86 for devices 05 - 08. - glg
Changed minimum dimension b for package "U" from 0.015 inches to
0.012 inches. - glg
Changed minimum dimension b for package "M" from 0.019 inches to
0.012 inches. Updated boilerplate paragraphs. ksr
Table I; Changed the I
OL
from 8 mA to 6 mA V
OL
test. Added device
types 15 and 16. Editorial changes throughout. -sld
Add case outline 7. Add CAGE 0EU86 as source of supply for case
outline 7. Editorial changes throughout. tcr
Add device 17 and add case outline 6. Add CAGE 6S055 as source
of supply for case outline 6. Some editorial changes. ksr
Update drawing to meet current MIL-PRF-38535 requirements. - glg
DATE
97-10-24
APPROVED
Raymond Monnin
D
E
F
G
H
J
K
L
00-03-01
00-11-22
00-12-13
02-02-12
04-05-25
08-08-18
09-01-22
16-09-01
Raymond Monnin
Raymond Monnin
Raymond Monnin
Raymond Monnin
Raymond Monnin
Robert M. Heber
Robert M. Heber
Charles Saffle
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
L
15
L
16
L
17
L
18
REV
SHEET
PREPARED BY
Jeff Bowling
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21
L
1
L
22
L
2
L
23
L
3
L
24
L
4
L
25
L
5
L
26
L
6
L
27
L
7
L
28
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9
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31
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32
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L
14
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil/
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY All
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
CHECKED BY
Jeff Bowling
APPROVED BY
Michael. A. Frye
DRAWING APPROVAL DATE
96-03-05
REVISION LEVEL
L
MICROCIRCUITS, MEMORY, DIGITAL,
CMOS, 512K X 8 STATIC RANDOM
ACCESS MEMORY (SRAM),
MONOLITHIC SILICON
SIZE
A
SHEET
1 OF
32
5962-E505-16
CAGE CODE
67268
5962-95600
DSCC FORM 2233
APR 97
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in th e Part
or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
5962
-
95600
01
Q
X
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device types identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
17
Generic number 1/
Circuit function
512K X 8 CMOS SRAM
512K X 8 CMOS SRAM
512K X 8 CMOS SRAM
512K X 8 CMOS SRAM
512K X 8 CMOS SRAM
512K X 8 CMOS SRAM
512K X 8 CMOS SRAM
512K X 8 CMOS SRAM
512K X 8 CMOS Low Power SRAM
512K X 8 CMOS Low Power SRAM
512K X 8 CMOS Low Power SRAM
512K X 8 CMOS Low Power SRAM
512K X 8 CMOS Low Power SRAM
512K X 8 CMOS SRAM
512K X 8 CMOS SRAM
512K X 8 CMOS SRAM
512K X 8 CMOS SRAM
Data retention
No
No
No
No
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No
Yes
No
Yes
Access time
45 ns
35 ns
25 ns
20 ns
45 ns
35 ns
25 ns
20 ns
45 ns
35 ns
25 ns
20 ns
15 ns
15 ns
12 ns
12 ns
12 ns
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows:
Device class
M
Q or V
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document and
will also be listed in MIL-HDBK-103 and QML-38535, as applicable (see 6.6.1 and 6.6.2 herein).
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
L
5962-95600
SHEET
2
DSCC FORM 2234
APR 97
1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z
U
T
M
N
9
8
7
6
Descriptive designator
GDIP1-T32 or CDIP2-T32
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
Terminals
32
32
32
32
36
36
36
32
36
36
44
Package style
Dual-in-line
TSOP package
Leadless chip carrier
SOJ package
Flat pack
SOJ package
Leadless chip carrier
Flat pack
SOJ package
SOJ package
TSOP package
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix
A for device class M.
1.3 Absolute maximum ratings. 2/
Voltage on any input relative to V
SS
......................................
For device 17 only ..............................................................
Storage temperature range...................................................
Maximum power dissipation (P
D
) ..........................................
Lead temperature (soldering, 10 seconds) ...........................
Thermal resistance, junction-to-case (θ
JC
):
Case X ................................................................................
Case Y ................................................................................
Cases U, M, 8 and 7 ...........................................................
Case T ................................................................................
Cases Z and N....................................................................
Case 9 ................................................................................
Case 6 ................................................................................
Junction temperature (T
J
) .....................................................
For device type 17 .............................................................
Output current .......................................................................
1.4 Recommended operating conditions.
Supply voltage range (V
CC
) ...................................................
Supply voltage (V
SS
) .............................................................
Input high voltage range (V
IH
) Devices 01 - 08 .....................
Input high voltage range (V
IH
) Devices 09 - 16 .....................
Input high voltage range (V
IH
) Device 17 ..............................
Input low voltage range (V
IL
) .................................................
Case operating temperature range (T
C
) ................................
4.5 V dc to 5.5 V dc
0V
2.2 V dc to +6.0 V dc
2.2 V dc to V
CC
+ 0.3 V dc
2.0 V dc to V
CC
+ 0.5 V dc
-0.5 V dc to +0.8 V dc 3/
-55°C to +125°C
-0.5 V dc to +7.0 V dc
-0.5 V dc to +6.0 V dc
-65°C to +150°C
2.0 W
+260°C
See MIL-STD-1835
6°C/W
11°C/W
10°C/W
20°C/W
22°C/W
7 C/W
+150°C 2/
+140C 2/
40 mA
_____________
2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in
accordance with method 5004 of MIL-STD-883.
3/ V
IL
minimum = -3.0 V dc for pulse width less than 20 ns.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
L
5962-95600
SHEET
3
DSCC FORM 2234
APR 97
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://quicksearch.dla.mil
or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of the documents are the issues of the documents cited in the solicitation.
JEDEC –
SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC)
JESD 78
-
IC Latch-Up Test.
(Copies of these documents
are available online at
http://www.jedec.org
or from JEDEC – Solid State Technology
Association, 3103 North 10th Street, Suite 240-S, Arlington, VA 22201-2107.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-
38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in
the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device cla ss M
shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table. The truth table shall be as specified on figure 3.
3.2.4 Functional tests. Various functional tests used to test this device are contained in the appendix. If the test patterns
cannot be implemented due to test equipment limitations, alternate test patterns to accomplish the same results shall be
allowed. For device class M, alternate test patterns shall be maintained under document revision level control by the
manufacturer and shall be made available to the preparing or acquiring activity upon request. For device classes Q and V
alternate test patterns shall be under the control of the device manufacturer's Technology Review Board (TRB) in accordance
with MIL-PRF-38535 and shall be made available to the preparing or acquiring activity upon request.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
L
5962-95600
SHEET
4
DSCC FORM 2234
APR 97
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of
supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-
PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in
MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to
this drawing.
3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of
product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime's agent,
and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Of fshore
documentation shall be made available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 41 (see MIL-PRF-38535, appendix A).
4. VERIFICATION
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in
accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a. Delete the sequence specified as initial (preburn-in) electrical parameters through interim (postburn-in) electrical
parameters of method 5004 and substitute lines 1 through 6 of table IIA herein.
b. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made
available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases,
and power dissipation, as applicable, in accordance with the intent specified in method 1015.
(1) Dynamic burn-in (method 1015 of MIL-STD-883, test condition D; for circuit, see 4.2.1b herein).
c. Interim and final electrical parameters shall be as specified in table IIA herein.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
L
5962-95600
SHEET
5
DSCC FORM 2234
APR 97
Embedded System
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