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935196020118

Description
IC DATACOM, INTERFACE CIRCUIT, PDSO8, 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8, Network Interface
CategoryWireless rf/communication    Telecom circuit   
File Size125KB,22 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

935196020118 Overview

IC DATACOM, INTERFACE CIRCUIT, PDSO8, 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8, Network Interface

935196020118 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSOIC
package instructionSOP,
Contacts8
Reach Compliance Codeunknow
JESD-30 codeR-PDSO-G8
length4.9 mm
Number of functions1
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height1.75 mm
Nominal supply voltage5 V
surface mountYES
Telecom integrated circuit typesINTERFACE CIRCUIT
Temperature levelAUTOMOTIVE
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width3.9 mm
Base Number Matches1
INTEGRATED CIRCUITS
DATA SHEET
PCA82C251
CAN transceiver for 24 V systems
Product specification
Supersedes data of 1997 Mar 14
File under Integrated Circuits, IC18
2000 Jan 13

935196020118 Related Products

935196020118 935196020112 935216230112 PCA82C251U PCA82C251/N3
Description IC DATACOM, INTERFACE CIRCUIT, PDSO8, 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8, Network Interface IC DATACOM, INTERFACE CIRCUIT, PDSO8, 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8, Network Interface IC DATACOM, INTERFACE CIRCUIT, PDIP8, 0.300 INCH, PLASTIC, MO-001, SOT97-1, DIP-8, Network Interface IC DATACOM, INTERFACE CIRCUIT, UUC8, DIE-8, Network Interface IC DATACOM, INTERFACE CIRCUIT, PDIP8, 0.300 INCH, ROHS COMPLIANT, PLASTIC, MO-001, SOT97-1, DIP-8, Network Interface
Parts packaging code SOIC SOIC MO-001 DIE MO-001
package instruction SOP, SOP, 0.300 INCH, PLASTIC, MO-001, SOT97-1, DIP-8 DIE, DIP,
Contacts 8 8 8 8 8
Reach Compliance Code unknow unknow unknown unknown compliant
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDIP-T8 R-XUUC-N8 R-PDIP-T8
Number of functions 1 1 1 1 1
Number of terminals 8 8 8 8 8
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY
encapsulated code SOP SOP DIP DIE DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE IN-LINE UNCASED CHIP IN-LINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V
surface mount YES YES NO YES NO
Telecom integrated circuit types INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal form GULL WING GULL WING THROUGH-HOLE NO LEAD THROUGH-HOLE
Terminal location DUAL DUAL DUAL UPPER DUAL
Is it Rohs certified? conform to conform to conform to - conform to
Maker NXP NXP NXP - NXP
length 4.9 mm 4.9 mm 9.5 mm - 9.5 mm
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED
Maximum seat height 1.75 mm 1.75 mm 4.2 mm - 4.2 mm
Terminal pitch 1.27 mm 1.27 mm 2.54 mm - 2.54 mm
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED
width 3.9 mm 3.9 mm 7.62 mm - 7.62 mm
Base Number Matches 1 1 1 1 -
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