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PPC1/2251471B13

Description
RESISTOR, METAL GLAZE/THICK FILM, 0.5W, 0.1%, 25ppm, 1470ohm, SURFACE MOUNT, 2008, MELF
CategoryPassive components    The resistor   
File Size178KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

PPC1/2251471B13 Overview

RESISTOR, METAL GLAZE/THICK FILM, 0.5W, 0.1%, 25ppm, 1470ohm, SURFACE MOUNT, 2008, MELF

PPC1/2251471B13 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Objectid1981549393
package instructionMELF
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresPRECISION
JESD-609 codee0
Manufacturer's serial numberPPC
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Package shapeCYLINDRICAL PACKAGE
method of packingTR, 13 INCH
Rated power dissipation(P)0.5 W
Rated temperature70 °C
resistance1470 Ω
Resistor typeFIXED RESISTOR
size code2008
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient25 ppm/°C
Terminal surfaceTin/Lead (Sn/Pb)
Terminal shapeWRAPAROUND
Tolerance0.1%
Operating Voltage300 V
Metal Glaze
Surface Mount
Precision Power Chip
PPC Series
Surge tolerant
Up to 1000 volts
Tight TCR - 25 ppm/°C
Tolerance down to ±0.1%
Solder over nickel
barrier
High
temperature
dielectric
coating
Metal Glaze™ thick
film element fired
at 1000°C to solid
ceramic substrate
Electrical Data
Size
Code
B
D
F
H
Industry
Footprint
1206
2010
2512
3610
IRC
Type
PPC1/8
PPC1/2
PPC1
PPC2
Power
Rating at
70°C (W)
1/8 W
1/2 W
1W
2W 1.33W
Working
Voltage
200
300
350
500
Resistance
Range
(ohms)
100 - 10K
100 - 10K
100 - 10K
100 - 10K
0.1% (B)
0.25% (C)
0.5% (D)
Tolerance
(±%)
Qty /
Reel (7")
2500
1500
N/A
N/A
Qty /
Reel (13")
10000
5000
5000
1500
Environmental Data
Characteristics
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Exposure
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Maximum Change
As specified
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
±0.5% + 0.01 ohm
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
95% minimum coverage
±0.5% + 0.01 ohm
±0.5% + 0.01 ohm
±1% + 0.01 ohm
±1% + 0.01 ohm
no mechanical damage
Test Method
MIL-R-55342E Par 4.7.9 (-55°C + 125°C)
MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5 2.5 x
for 5 seconds
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C
for 10 seconds)
MIL-STD-202, Method 208 (245°C for 5 seconds)
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
MIL-R-55342E Par 4.7.10 (2000 hours at 70°C intermittent)
1200 gram push from underside of mounted chip for 60
seconds
Chip mounted in center of 90mm long board, deflected 1mm
so as to exert pull on chip contacts for 5 seconds
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
PPC Series Issue November 2008 Sheet 1 of 3
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