TSC87251G2D datasheet, PDF - EEWORLD Datasheet

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TSC87251G2D: Description0.5 Um SCMOS3 Technology; File Size200KB，28 Pages; ManufacturerTEMIC; Websitehttp://www.temic.de/

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TSC87251G2D Overview

0.5 Um SCMOS3 Technology

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Qualpack TSC87251G2D

Qualification Package

TSC87251G2D / TSC83251G2D

0.5 µm SCMOS3 Technology

TSC87251G2D

0.5 µm SCMOS3

1999 October

TEMIC SEMICONDUCTORS IS AN ATMEL COMPANY

Rev. 0 – October 1999

Qualpack TSC87251G2D

1. General Information........................................................................................................................... 3

1.1 Product Description............................................................................................................................ 3

2. Technology Information..................................................................................................................... 4

2.1 Wafer Process Technology ................................................................................................................. 4

2.1.1 SCMOS3 0.5um ROM Process ................................................................................................... 4

2.1.2 SCMOS3 NV 0.5um EPROM Process ......................................................................................... 6

2.2 Product Design .................................................................................................................................. 6

2.3 Package Technology .......................................................................................................................... 6

2.3.1 Package description ................................................................................................................... 6

2.3.2 Other available packages ............................................................................................................ 7

2.4 Test .................................................................................................................................................. 7

2.5 Device Cross Section ......................................................................................................................... 8

2.6 Wafer Process Control........................................................................................................................ 9

3. Qualification .................................................................................................................................... 10

3.1 Change Procedure ........................................................................................................................... 11

3.2 Qualification Flow............................................................................................................................. 12

3.3 Wafer Process Qualification.............................................................................................................. 13

3.3.1 Process Module Reliability ........................................................................................................ 13

3.3.1.1 Hot carrier qualification.............................................................................................................................................. 13

3.3.1.2 Electromigration.......................................................................................................................................................... 15

3.3.1.3 Time Dependent Dielectric Breakdown .................................................................................................................. 16

3.3.2 Z92 Wafer Process Qualification Results ................................................................................... 18

3.3.3 Z94 Wafer Process Qualification Results ................................................................................... 19

3.4 Package Qualification....................................................................................................................... 20

3.5 Device Qualification.......................................................................................................................... 20

3.5.1 Failure Mechanisms and Corrective Actions ............................................................................... 21

3.5.2 Qualification status ................................................................................................................... 21

3.6 Outgoing Quality and Reliability ........................................................................................................ 22

3.6.1 AOQ (Average Outgoing Quality)............................................................................................... 22

3.6.2 EFR (Early Failure Rate) ........................................................................................................... 22

3.6.3 LFR (Latent Failure Rate).......................................................................................................... 23

4. User Information .............................................................................................................................. 24

4.1 Soldering Recommendations ............................................................................................................ 24

4.2 DRY PACK Ordering rules ................................................................................................................ 24

4.3 ESD caution..................................................................................................................................... 24

5. Environmental Information .............................................................................................................. 25

6. Other Data........................................................................................................................................ 26

6.1 ISO9001 Approval Certificate............................................................................................................ 26

6.2 Databook Reference ........................................................................................................................ 27

6.3 Address Reference........................................................................................................................... 27

7. Revision History............................................................................................................................... 28

Rev 0 – October 1999

TSC87251G2D Related Products

	TSC87251G2D	TSC83251G2D
Description	0.5 Um SCMOS3 Technology	0.5 Um SCMOS3 Technology

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