Qualpack TSC87251G2D
1. General Information........................................................................................................................... 3
1.1 Product Description............................................................................................................................ 3
2. Technology Information..................................................................................................................... 4
2.1 Wafer Process Technology ................................................................................................................. 4
2.1.1 SCMOS3 0.5um ROM Process ................................................................................................... 4
2.1.2 SCMOS3 NV 0.5um EPROM Process ......................................................................................... 6
2.2 Product Design .................................................................................................................................. 6
2.3 Package Technology .......................................................................................................................... 6
2.3.1 Package description ................................................................................................................... 6
2.3.2 Other available packages ............................................................................................................ 7
2.4 Test .................................................................................................................................................. 7
2.5 Device Cross Section ......................................................................................................................... 8
2.6 Wafer Process Control........................................................................................................................ 9
3. Qualification .................................................................................................................................... 10
3.1 Change Procedure ........................................................................................................................... 11
3.2 Qualification Flow............................................................................................................................. 12
3.3 Wafer Process Qualification.............................................................................................................. 13
3.3.1 Process Module Reliability ........................................................................................................ 13
3.3.1.1 Hot carrier qualification.............................................................................................................................................. 13
3.3.1.2 Electromigration.......................................................................................................................................................... 15
3.3.1.3 Time Dependent Dielectric Breakdown .................................................................................................................. 16
3.3.2 Z92 Wafer Process Qualification Results ................................................................................... 18
3.3.3 Z94 Wafer Process Qualification Results ................................................................................... 19
3.4 Package Qualification....................................................................................................................... 20
3.5 Device Qualification.......................................................................................................................... 20
3.5.1 Failure Mechanisms and Corrective Actions ............................................................................... 21
3.5.2 Qualification status ................................................................................................................... 21
3.6 Outgoing Quality and Reliability ........................................................................................................ 22
3.6.1 AOQ (Average Outgoing Quality)............................................................................................... 22
3.6.2 EFR (Early Failure Rate) ........................................................................................................... 22
3.6.3 LFR (Latent Failure Rate).......................................................................................................... 23
4. User Information .............................................................................................................................. 24
4.1 Soldering Recommendations ............................................................................................................ 24
4.2 DRY PACK Ordering rules ................................................................................................................ 24
4.3 ESD caution..................................................................................................................................... 24
5. Environmental Information .............................................................................................................. 25
6. Other Data........................................................................................................................................ 26
6.1 ISO9001 Approval Certificate............................................................................................................ 26
6.2 Databook Reference ........................................................................................................................ 27
6.3 Address Reference........................................................................................................................... 27
7. Revision History............................................................................................................................... 28
2
Rev 0 – October 1999
Qualpack TSC87251G2D
1. General Information
1.1 Product Description
Product Name:
Function:
TSC87251G2D / TSC83251G2D
8/16-bit Microcontrollers
32K EPROM / 32K ROM
Z94 (SCMOS 3 NV) / Z92 (SCMOS 3)
Wide range of packages including PLCC44,
PDIP40, PQFP44, TQFP44, VQFP44
Multiple Hermetic Packages, Die, Wafer
Wafer process:
Available plastic package types:
Other forms
Locations:
Process, product development
Wafer plant
QC responsibility
Assembly
Probe test
Final test
Shipment control
Quality Assurance
Reliability testing
Failure analysis
TEMIC Semiconductors Nantes, France
TEMIC Semiconductors Nantes, France
TEMIC Semiconductors Nantes, France
GATEWAY, Philippines - ASE, Taiwan
CHINTEIK, Thailand - ANAM, Korea and Philippines
CHIPPAC, China
TEMIC Semiconductors Nantes, France
GATEWAY, Philippines - ASE, Taiwan
ANAM, Korea and Philippines
GLOBAL LOGISTICS CENTER, Philippines
TEMIC Semiconductors Nantes, France
TEMIC Semiconductors Nantes, France
TEMIC Semiconductors Nantes, France
Product Quality Management Nantes
Signed :
Pascal LECUYER
Rev. 0 – October 1999
3
ARM Technology
京公网安备 11010802033920号
EEWORLD
