M55342H08B324AC-TR datasheet, PDF

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M55342H08B324AC-TR: DescriptionFixed Resistor, Thin Film, 0.8W, 324ohm, 150V, 0.1% +/-Tol, 50ppm/Cel, Surface Mount, 2010, CHIP; CategoryPassive components The resistor; File Size106KB，1 Pages; ManufacturerState of the Art Inc.

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M55342H08B324AC-TR Overview

Fixed Resistor, Thin Film, 0.8W, 324ohm, 150V, 0.1% +/-Tol, 50ppm/Cel, Surface Mount, 2010, CHIP

M55342H08B324AC-TR Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Objectid	2069988048
package instruction	CHIP
Reach Compliance Code	not_compliant
Country Of Origin	USA
ECCN code	EAR99
YTEOL	5.7
Other features	PRECISION
structure	Chip
JESD-609 code	e0
Manufacturer's serial number	M55342/08
Installation features	SURFACE MOUNT
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Package height	0.64 mm
Package length	5.13 mm
Package shape	RECTANGULAR PACKAGE
Package form	SMT
Package width	2.38 mm
method of packing	TR
Rated power dissipation(P)	0.8 W
Rated temperature	70 °C
Guideline	MIL-PRF-55342
resistance	324 Ω
Resistor type	FIXED RESISTOR
series	M55342/08-THIN FILM
size code	2010
surface mount	YES
technology	THIN FILM
Temperature Coefficient	50 ppm/°C
Terminal surface	Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Terminal shape	WRAPAROUND
Tolerance	0.1%
Operating Voltage	150 V

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State of the Art, Inc.

Thin Film Chip Resistor

M55342/08 RM2010

PROTECTIVE

ENCAPSULANT

PRECISION

THIN FILM

RESISTOR

99.6% ALUMINA CHIP

WRAPAROUND

TERMINATIONS

PRETINNED

PERFORMANCE

TEMPERATURE RISE (°C)

Resistance Range

Tolerances

Maximum Power

Maximum Voltage

100

- 1M

0.1%, 1%, 2%, 5%

800 mW

150 Volts

CURRENT NOISE

POWER DISSIPATION

fiber epoxy board

ceramic board

TESTS

TCR (-55 to +125

C) in ppm/

Thermal Shock

Low Temperature Operation

Short-time Overload

Resistance to Soldering Heat

Moisture Resistance

Life, 2,000 Hours

High Temperature Exposure

CHARACTERISTICS*

±25

±0.1%

±0.2%

±0.5%

±0.1%

±50

±0.25%

±0.1%

±0.25%

±0.4%

±0.5%

±0.2%

POWER DISSIPATION (WATTS)

LIFE TEST

POWER DERATING

*Maximum allowable change per MIL-PRF-55342,

typical change is 10% of these values.

PART NUMBERING

M55342 H 08 B 100D R - TR

PACKAGING CODE: TR = Tape & Reel W= Waffle Pack

PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% T: Space Level C: Non - ER

RESISTANCE AND TOLERANCE CODE:

Three significant digits, with a letter indicating the

decimal location, the tolerance, and the value range.

TERMINATION MATERIALS:

SIZE CODE: /08 = RM2010

TEMPERATURE CHARACTERISTIC: E: ± 25ppm H: ± 50ppm

PERFORMANCE SPECIFICATION MIL-PRF-55342

B: Solderable wraparound

A: 0.1%

D: 1%

G: 2%

J: 5%

B: 0.1% K

E: 1% K

H: 2% K

K: 5% K

C: 0.1% M

F: 1% M

T: 2% M

L: 5% M

W: Gold wire bondable

MECHANICAL

INCHES

MILLIMETERS

.252

MINIMUM

RECOMMENDED

MOUNTING

PADS

(INCHES)

Length

Width

Thickness

Top Term

Bottom Term

Gap

Approx. Weight

.202 (.191 - .218)

.094 (.093 - .103)

.025 (.015 - .033)

.020 (.015 - .025)

.019 (.015 - .025)

.164 (.160 - .168)

.0323 grams

5.13

2.38

0.64

0.51

0.48

4.17

(4.85 - 5.54)

(2.36 - 2.62)

(0.38 - 0.84)

(0.38 - 0.64)

(4.06 - 4.27)

.100

.154

.049

2470 Fox Hill Road, State College, PA 16803-1797

Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401

“Specifications subject to change without notice.”

www.resistor.com

04/09/08

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