Standard SRAM, 64KX4, 35ns, CMOS, CDIP24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Pyramid Semiconductor Corporation |
| package instruction | DIP, DIP24,.3 |
| Reach Compliance Code | unknown |
| Maximum access time | 35 ns |
| I/O type | COMMON |
| JESD-30 code | R-XDIP-T24 |
| JESD-609 code | e0 |
| memory density | 262144 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 4 |
| Number of terminals | 24 |
| word count | 65536 words |
| character code | 64000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 64KX4 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.0002 A |
| Minimum standby current | 2 V |
| Maximum slew rate | 0.11 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
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