IC,LATCH,SINGLE,8-BIT,AC-CMOS,FP,20PIN,CERAMIC
| Parameter Name | Attribute value |
| Maker | National Semiconductor（TI ） |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDFP-F20 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | D LATCH |
| MaximumI(ol) | 0.024 A |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL20,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | 3.3/5 V |
| Certification status | Not Qualified |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| 54AC533FM | 54ACT533LM | 54AC533LM | 54AC533DM | 54ACT533DM | 54ACT533FM | |
|---|---|---|---|---|---|---|
| Description | IC,LATCH,SINGLE,8-BIT,AC-CMOS,FP,20PIN,CERAMIC | IC,LATCH,SINGLE,8-BIT,ACT-CMOS,LLCC,20PIN,CERAMIC | IC,LATCH,SINGLE,8-BIT,AC-CMOS,LLCC,20PIN,CERAMIC | IC,LATCH,SINGLE,8-BIT,AC-CMOS,DIP,20PIN,CERAMIC | IC,LATCH,SINGLE,8-BIT,ACT-CMOS,DIP,20PIN,CERAMIC | IC,LATCH,SINGLE,8-BIT,ACT-CMOS,FP,20PIN,CERAMIC |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDFP-F20 | S-XQCC-N20 | S-XQCC-N20 | R-XDIP-T20 | R-XDIP-T20 | R-XDFP-F20 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH |
| MaximumI(ol) | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
| Number of digits | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DFP | QCCN | QCCN | DIP | DIP | DFP |
| Encapsulate equivalent code | FL20,.3 | LCC20,.35SQ | LCC20,.35SQ | DIP20,.3 | DIP20,.3 | FL20,.3 |
| Package shape | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | FLATPACK |
| power supply | 3.3/5 V | 5 V | 3.3/5 V | 3.3/5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | YES | YES | NO | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | FLAT | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | QUAD | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| Maker | National Semiconductor（TI ） | National Semiconductor（TI ） | - | - | National Semiconductor（TI ） | National Semiconductor（TI ） |
京公网安备 11010802033920号
EEWORLD
