L17EF2512102 datasheet, PDF - EEWORLD Datasheet

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L17EF2512102: DescriptionD Type Connector, 25 Contact(s), Male, 0.108 inch Pitch, Press Fit Terminal, #4-40, Plug; CategoryThe connector The connector; File Size1MB，3 Pages; ManufacturerAmphenol; Websitehttp://www.amphenol.com/

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L17EF2512102 Overview

D Type Connector, 25 Contact(s), Male, 0.108 inch Pitch, Press Fit Terminal, #4-40, Plug

L17EF2512102 Parametric

Parameter Name	Attribute value
Objectid	316212863
Reach Compliance Code	unknown
ECCN code	EAR99

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D-Sub connectors - Stamped and Formed Contacts

PRESS FIT

RIGHT ANGLE PCB TERMINATION

The Amphenol “EF“ series

features eye of needle formed

contacts, and insulator with

closed entry contacts cavities.

This series gives you

Amphenol's high standards of

quality and reliability to meet

all your technical requirements.

CHARACTERISTICS

Shells

Insulator

Pin contact

Socket contact

Rear insert

Boardlock

Screwlock

Steel, tin plated

Glass-filled thermoplastic, UL 94V-0

Brass, selected gold in mating area;

2.54µm (100µ") min. tin

on termination area over

1.27µm (50µ") min.nickel

Phosphor bronze, selected gold in

mating area; 2.54µm (100µ") min.

tin on termination area over;

1.27µm(50µ") min. nickel

Brass, 2.54µm (100µ") min. nickel plated

Brass, 2.54µm (100µ") min. tin over 1.27µm (50µ”)

min.nickel plated

Brass, 2.54µm (100µ") min. nickel plated

DESCRIPTION

APPLICATIONS

Materials and Platings

Electrical Data

Current rating

Voltage rating

Withstanding voltage

Insulation resistance

Contact resistance

300V AC

1000V AC/rms 60Hz for one minute

1000MΩ

25mΩ

max

Climatic Data

Operating temperature

-55°C to +125°C

Salt spray

24 hours

Solderless

right angle PCB

mount

connectors

•

Industrial

Mechanical Data

Single contact insertion force

Single contact withdrawal force

Single contact insertion on board

Single contact withdrawal from board

Standard plating thickness

≤ 3.60 N

≥ 0.2 N

≤ 100 N

≥ 20 N

Gold flash

0.4µm (15µ") gold

0.76µm (30µ") gold

•

Telecom

•

Any backplane

application

Terminal

Specification

Finished Hole

1 (+0.09 -0.06)

> 25 µm

< 15 µm

Boardlock

Specification

3.1 +/- 0.05 mm

Min 25 µm

5-15 µm

EF / E9

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