IDT70V27L20BFGI datasheet, PDF

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IDT70V27L20BFGI: DescriptionDual-Port SRAM, 32KX16, 20ns, CMOS, PBGA144, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, FBGA-144; Categorystorage storage; File Size173KB，21 Pages; ManufacturerIDT (Integrated Device Technology); Environmental Compliance

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IDT70V27L20BFGI Overview

Dual-Port SRAM, 32KX16, 20ns, CMOS, PBGA144, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, FBGA-144

IDT70V27L20BFGI Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	IDT (Integrated Device Technology)
Parts packaging code	BGA
package instruction	LFBGA,
Contacts	144
Reach Compliance Code	compliant
ECCN code	3A991.B.2.B
Maximum access time	20 ns
JESD-30 code	S-PBGA-B144
JESD-609 code	e3
length	12 mm
memory density	524288 bit
Memory IC Type	DUAL-PORT SRAM
memory width	16
Number of functions	1
Number of terminals	144
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	32KX16
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1.5 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	12 mm
Base Number Matches	1

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HIGH-SPEED 3.3V

32K x 16 DUAL-PORT

STATIC RAM

Features:

◆

IDT70V27S/L

◆

True Dual-Ported memory cells which allow simultaneous

access of the same memory location

High-speed access

– Commercial: 15/20/25/35/55ns (max.)

– Industrial: 20/35ns (max.)

Low-power operation

– IDT70V27S

Active: 500mW (typ.)

Standby: 3.3mW (typ.)

– IDT70V27L

Active: 500mW (typ.)

Standby: 660

W (typ.)

Separate upper-byte and lower-byte control for bus

matching capability

Dual chip enables allow for depth expansion without

external logic

◆

IDT70V27 easily expands data bus width to 32 bits or more

using the Master/Slave select when cascading more than

one device

M/S = V

for

BUSY

output flag on Master,

M/S = V

for

BUSY

input on Slave

Busy and Interrupt Flags

On-chip port arbitration logic

Full on-chip hardware support of semaphore signaling

between ports

Fully asynchronous operation from either port

LVTTL-compatible, single 3.3V (±0.3V) power supply

Available in 100-pin Thin Quad Flatpack (TQFP), and 144-

pin Fine Pitch BGA (fpBGA)

Industrial temperature range (-40°C to +85°C) is available

for selected speeds

Green parts available, see ordering information

Functional Block Diagram

R/W

I/O

8-15L

I/O

0-7L

BUSY

(1,2)

I/O

8-15R

I/O

Control

I/O

Control

I/O

0-7R

BUSY

(1,2)

14L

Address

Decoder

14L

32Kx16

MEMORY

ARRAY

70V27

Address

Decoder

14R

ARBITRATION

INTERRUPT

SEMAPHORE

LOGIC

14R

SEM

INT

(2)

SEM

(2)

INT

3603 drw 01

NOTES:

BUSY

is an input as a Slave (M/S=V

) and an output as a Master (M/S=V

BUSY

and

INT

are non-tri-state totem-pole outputs (push-pull).

JANUARY 2006

6.01

DSC 3603/9

IDT70V27L20BFGI Related Products

	IDT70V27L20BFGI	IDT70V27S35PFGI	IDT70V27S35BFGI	IDT70V27S20BFGI	IDT70V27S20PFGI	IDT70V27L35BFGI
Description	Dual-Port SRAM, 32KX16, 20ns, CMOS, PBGA144, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, FBGA-144	Dual-Port SRAM, 32KX16, 35ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-100	Dual-Port SRAM, 32KX16, 35ns, CMOS, PBGA144, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, FBGA-144	Dual-Port SRAM, 32KX16, 20ns, CMOS, PBGA144, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, FBGA-144	Dual-Port SRAM, 32KX16, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-100	Dual-Port SRAM, 32KX16, 35ns, CMOS, PBGA144, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, FBGA-144
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Parts packaging code	BGA	QFP	BGA	BGA	QFP	BGA
package instruction	LFBGA,	LFQFP,	LFBGA,	LFBGA,	LFQFP,	LFBGA,
Contacts	144	100	144	144	100	144
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	3A991.B.2.B	EAR99	EAR99	3A991.B.2.B	3A991.B.2.B	EAR99
Maximum access time	20 ns	35 ns	35 ns	20 ns	20 ns	35 ns
JESD-30 code	S-PBGA-B144	S-PQFP-G100	S-PBGA-B144	S-PBGA-B144	S-PQFP-G100	S-PBGA-B144
JESD-609 code	e3	e3	e3	e3	e3	e3
length	12 mm	14 mm	12 mm	12 mm	14 mm	12 mm
memory density	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit
Memory IC Type	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM
memory width	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1
Number of terminals	144	100	144	144	100	144
word count	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words
character code	32000	32000	32000	32000	32000	32000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	32KX16	32KX16	32KX16	32KX16	32KX16	32KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFQFP	LFBGA	LFBGA	LFQFP	LFBGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.5 mm	1.6 mm	1.5 mm	1.5 mm	1.6 mm	1.5 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Matte Tin (Sn)	MATTE TIN	Matte Tin (Sn)	Matte Tin (Sn)	MATTE TIN	Matte Tin (Sn)
Terminal form	BALL	GULL WING	BALL	BALL	GULL WING	BALL
Terminal pitch	0.8 mm	0.5 mm	0.8 mm	0.8 mm	0.5 mm	0.8 mm
Terminal location	BOTTOM	QUAD	BOTTOM	BOTTOM	QUAD	BOTTOM
Maximum time at peak reflow temperature	30	30	30	30	30	30
width	12 mm	14 mm	12 mm	12 mm	14 mm	12 mm
Base Number Matches	1	1	1	1	1	-

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