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IDT70V27L35BFGI

Description
Dual-Port SRAM, 32KX16, 35ns, CMOS, PBGA144, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, FBGA-144
Categorystorage    storage   
File Size173KB,21 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance  
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IDT70V27L35BFGI Overview

Dual-Port SRAM, 32KX16, 35ns, CMOS, PBGA144, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, FBGA-144

IDT70V27L35BFGI Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instructionLFBGA,
Contacts144
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time35 ns
JESD-30 codeS-PBGA-B144
JESD-609 codee3
length12 mm
memory density524288 bit
Memory IC TypeDUAL-PORT SRAM
memory width16
Number of functions1
Number of terminals144
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize32KX16
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.5 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width12 mm
HIGH-SPEED 3.3V
32K x 16 DUAL-PORT
STATIC RAM
Features:
IDT70V27S/L
True Dual-Ported memory cells which allow simultaneous
access of the same memory location
High-speed access
– Commercial: 15/20/25/35/55ns (max.)
– Industrial: 20/35ns (max.)
Low-power operation
– IDT70V27S
Active: 500mW (typ.)
Standby: 3.3mW (typ.)
– IDT70V27L
Active: 500mW (typ.)
Standby: 660
µ
W (typ.)
Separate upper-byte and lower-byte control for bus
matching capability
Dual chip enables allow for depth expansion without
external logic
IDT70V27 easily expands data bus width to 32 bits or more
using the Master/Slave select when cascading more than
one device
M/S = V
IH
for
BUSY
output flag on Master,
M/S = V
IL
for
BUSY
input on Slave
Busy and Interrupt Flags
On-chip port arbitration logic
Full on-chip hardware support of semaphore signaling
between ports
Fully asynchronous operation from either port
LVTTL-compatible, single 3.3V (±0.3V) power supply
Available in 100-pin Thin Quad Flatpack (TQFP), and 144-
pin Fine Pitch BGA (fpBGA)
Industrial temperature range (-40°C to +85°C) is available
for selected speeds
Green parts available, see ordering information
Functional Block Diagram
R/
W
L
UB
L
CE
0L
R/W
R
UB
R
CE
0R
CE
1L
OE
L
LB
L
CE
1R
OE
R
LB
R
I/O
8-15L
I/O
0-7L
BUSY
L
(1,2)
I/O
8-15R
I/O
Control
I/O
Control
I/O
0-7R
BUSY
R
(1,2)
,
A
14L
A
0L
Address
Decoder
A
14L
A
0L
CE
0L
32Kx16
MEMORY
ARRAY
70V27
Address
Decoder
A
14R
A
0R
CE
1L
OE
L
ARBITRATION
INTERRUPT
SEMAPHORE
LOGIC
A
14R
A
0R
CE
0R
CE
1R
OE
R
R/
W
L
SEM
L
INT
L
(2)
(2)
R/
W
R
SEM
R
(2)
INT
R
3603 drw 01
M/
S
NOTES:
1)
BUSY
is an input as a Slave (M/S=V
IL
) and an output as a Master (M/S=V
IH
).
2)
BUSY
and
INT
are non-tri-state totem-pole outputs (push-pull).
JANUARY 2006
6.01
1
©2006 Integrated Device Technology, Inc.
DSC 3603/9

IDT70V27L35BFGI Related Products

IDT70V27L35BFGI IDT70V27L20BFGI IDT70V27S35PFGI IDT70V27S35BFGI IDT70V27S20BFGI IDT70V27S20PFGI
Description Dual-Port SRAM, 32KX16, 35ns, CMOS, PBGA144, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, FBGA-144 Dual-Port SRAM, 32KX16, 20ns, CMOS, PBGA144, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, FBGA-144 Dual-Port SRAM, 32KX16, 35ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-100 Dual-Port SRAM, 32KX16, 35ns, CMOS, PBGA144, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, FBGA-144 Dual-Port SRAM, 32KX16, 20ns, CMOS, PBGA144, 12 X 12 MM, 1.40 MM HEIGHT, GREEN, FBGA-144 Dual-Port SRAM, 32KX16, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-100
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code BGA BGA QFP BGA BGA QFP
package instruction LFBGA, LFBGA, LFQFP, LFBGA, LFBGA, LFQFP,
Contacts 144 144 100 144 144 100
Reach Compliance Code compliant compliant compliant compliant compliant compliant
ECCN code EAR99 3A991.B.2.B EAR99 EAR99 3A991.B.2.B 3A991.B.2.B
Maximum access time 35 ns 20 ns 35 ns 35 ns 20 ns 20 ns
JESD-30 code S-PBGA-B144 S-PBGA-B144 S-PQFP-G100 S-PBGA-B144 S-PBGA-B144 S-PQFP-G100
JESD-609 code e3 e3 e3 e3 e3 e3
length 12 mm 12 mm 14 mm 12 mm 12 mm 14 mm
memory density 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit
Memory IC Type DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
memory width 16 16 16 16 16 16
Number of functions 1 1 1 1 1 1
Number of terminals 144 144 100 144 144 100
word count 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words
character code 32000 32000 32000 32000 32000 32000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 32KX16 32KX16 32KX16 32KX16 32KX16 32KX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA LFBGA LFQFP LFBGA LFBGA LFQFP
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.5 mm 1.5 mm 1.6 mm 1.5 mm 1.5 mm 1.6 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Matte Tin (Sn) Matte Tin (Sn) MATTE TIN Matte Tin (Sn) Matte Tin (Sn) MATTE TIN
Terminal form BALL BALL GULL WING BALL BALL GULL WING
Terminal pitch 0.8 mm 0.8 mm 0.5 mm 0.8 mm 0.8 mm 0.5 mm
Terminal location BOTTOM BOTTOM QUAD BOTTOM BOTTOM QUAD
Maximum time at peak reflow temperature 30 30 30 30 30 30
width 12 mm 12 mm 14 mm 12 mm 12 mm 14 mm
Base Number Matches - 1 1 1 1 1

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