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AM28F010A-95JC

Description
Flash, 128KX8, 90ns, PQCC32, PLASTIC, LCC-32
Categorystorage    storage   
File Size185KB,34 Pages
ManufacturerAMD
Websitehttp://www.amd.com
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AM28F010A-95JC Overview

Flash, 128KX8, 90ns, PQCC32, PLASTIC, LCC-32

AM28F010A-95JC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeQFJ
package instructionQCCJ, LDCC32,.5X.6
Contacts32
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time90 ns
Other features100K WRITE/ERASE CYCLES MIN
command user interfaceYES
Data pollingYES
JESD-30 codeR-PQCC-J32
JESD-609 codee0
length13.97 mm
memory density1048576 bi
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC32,.5X.6
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage12 V
Certification statusNot Qualified
Maximum seat height3.556 mm
Maximum standby current0.0001 A
Maximum slew rate0.03 mA
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
typeNOR TYPE
width11.43 mm
Base Number Matches1
FINAL
Am28F010A
1 Megabit (131,072 x 8-Bit) CMOS 12.0 Volt, Bulk Erase
Flash Memory with Embedded Algorithms
DISTINCTIVE CHARACTERISTICS
s
High performance
— 90 ns maximum access time
s
CMOS low power consumption
— 30 mA maximum active current
— 100
µA
maximum standby current
— No data retention power consumption
s
Compatible with JEDEC-standard byte-wide
32-Pin EPROM pinouts
— 32-pin PDIP
— 32-pin PLCC
— 32-pin TSOP
s
100,000 write/erase cycles minimum
s
Write and erase voltage 12.0 V
±5%
s
Latch-up protected to 100 mA from –1 V to
V
CC
+1 V
Advanced
Micro
Devices
s
Embedded Erase Electrical Bulk Chip-Erase
— Three seconds typical chip-erase including
pre-programming
s
Embedded Program
— 14
µs
typical byte-program including time-out
— Two seconds typical chip program
s
Command register architecture for
microprocessor/microcontroller compatible
write interface
s
On-chip address and data latches
s
Advanced CMOS flash memory technology
— Low cost single transistor memory cell
s
Embedded algorithms for completely
self-timed write/erase operations
GENERAL DESCRIPTION
The Am28F010A is a 1 Megabit Flash memory organ-
ized as 128K bytes of 8 bits each. AMD’s Flash
memories offer the most cost-effective and reliable
read/write non- volatile random access memory. The
Am28F010A is packaged in 32-pin PDIP, PLCC, and
TSOP versions. It is designed to be reprogrammed
and erased in-system or in standard EPROM program-
mers. The Am28F010A is erased when shipped from
the factory.
The standard Am28F010A offers access times as fast
as 90 ns, allowing operation of high-speed microproces-
sors without wait states. To eliminate bus contention,
the Am28F010A has separate chip enable (CE) and out-
put enable (OE) controls.
AMD’s Flash memories augment EPROM functionality
with in-circuit electrical erasure and programming. The
Am28F010A uses a command register to manage this
functionality, while maintaining a standard JEDEC
Flash standard 32-pin pinout. The command register al-
lows for 100% TTL level control inputs and fixed power
supply levels during erase and programming, while
maintaining maximum EPROM compatibility.
AMD’s Flash technology reliably stores memory con-
tents even after 100,000 erase and program cycles. The
AMD cell is designed to optimize the erase and pro-
2-164
gramming mechanisms. In addition, the combination of
advanced tunnel oxide processing and low internal
electric fields for erase and programming operations
produces reliable cycling. The Am28F010A uses a
12.0 V
±
5% V
PP
high voltage input to perform the erase
and programming functions.
The highest degree of latch-up protection is achieved
with AMD’s proprietary non-epi process. Latch-up pro-
tection is provided for stresses up to 100 milliamps on
address and data pins from –1 V to V
CC
+1 V.
Embedded Program
The Am28F010A is byte programmable using the Em-
bedded Programming algorithm. The Embedded Pro-
gramming algorithm does not require the system to
time-out or verify the data programmed. The typical
room temperature programming time of the
Am28F010A is two seconds.
Embedded Erase
The entire chip is bulk erased using the Embedded
Erase algorithm. The Embedded Erase algorithm auto-
matically programs the entire array prior to electrical
erase. The timing and verification of electrical erase are
controlled internal to the device. Typical erasure at room
Publication#
16778
Rev.
C
Amendment
/0
Issue Date:
November 1995

AM28F010A-95JC Related Products

AM28F010A-95JC AM28F010A-95FC AM28F010A-95PC AM28F010A-95EC
Description Flash, 128KX8, 90ns, PQCC32, PLASTIC, LCC-32 Flash, 128KX8, 90ns, PDSO32, REVERSE, TSOP-32 Flash, 128KX8, 90ns, PDIP32, PLASTIC, DIP-32 Flash, 128KX8, 90ns, PDSO32, TSOP-32
Is it lead-free? Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible
Parts packaging code QFJ TSOP DIP TSOP
package instruction QCCJ, LDCC32,.5X.6 TSOP1-R, TSSOP32,.8,20 PLASTIC, DIP-32 TSOP1, TSSOP32,.8,20
Contacts 32 32 32 32
Reach Compliance Code unknow unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99
Maximum access time 90 ns 90 ns 90 ns 90 ns
Other features 100K WRITE/ERASE CYCLES MIN 100K WRITE/ERASE CYCLES MIN 100K WRITE/ERASE CYCLES MIN 100K WRITE/ERASE CYCLES MIN
command user interface YES YES YES YES
Data polling YES YES YES YES
JESD-30 code R-PQCC-J32 R-PDSO-G32 R-PDIP-T32 R-PDSO-G32
JESD-609 code e0 e0 e0 e0
length 13.97 mm 18.4 mm 42.164 mm 18.4 mm
memory density 1048576 bi 1048576 bit 1048576 bit 1048576 bit
Memory IC Type FLASH FLASH FLASH FLASH
memory width 8 8 8 8
Number of functions 1 1 1 1
Number of terminals 32 32 32 32
word count 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
organize 128KX8 128KX8 128KX8 128KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ TSOP1-R DIP TSOP1
Encapsulate equivalent code LDCC32,.5X.6 TSSOP32,.8,20 DIP32,.6 TSSOP32,.8,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER SMALL OUTLINE, THIN PROFILE IN-LINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V
Programming voltage 12 V 12 V 12 V 12 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.556 mm 1.2 mm 5.715 mm 1.2 mm
Maximum standby current 0.0001 A 0.0001 A 0.0001 A 0.0001 A
Maximum slew rate 0.03 mA 0.03 mA 0.03 mA 0.03 mA
Maximum supply voltage (Vsup) 5.25 V 5.25 V 5.25 V 5.25 V
Minimum supply voltage (Vsup) 4.75 V 4.75 V 4.75 V 4.75 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount YES YES NO YES
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form J BEND GULL WING THROUGH-HOLE GULL WING
Terminal pitch 1.27 mm 0.5 mm 2.54 mm 0.5 mm
Terminal location QUAD DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
switch bit YES YES YES YES
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 11.43 mm 8 mm 15.24 mm 8 mm
Maker - AMD AMD AMD

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