5962-8868101LA datasheet, PDF - EEWORLD Datasheet

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5962-8868101LA: DescriptionStandard SRAM, 64KX4, 35ns, CMOS, CDIP24, CERAMIC, DIP-24; Categorystorage storage; File Size637KB，8 Pages; ManufacturerLOGIC Devices; Websitehttp://www.logicdevices.com/

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5962-8868101LA Overview

Standard SRAM, 64KX4, 35ns, CMOS, CDIP24, CERAMIC, DIP-24

5962-8868101LA Parametric

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	DIP,
Contacts	24
Reach Compliance Code	unknow
ECCN code	3A001.A.2.C
Maximum access time	35 ns
Other features	AUTOMATIC POWER-DOWN
JESD-30 code	R-GDIP-T24
JESD-609 code	e0
length	31.75 mm
memory density	262144 bi
Memory IC Type	STANDARD SRAM
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	24
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	64KX4
Output characteristics	3-STATE
Exportable	NO
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	5.08 mm
Minimum standby current	2 V
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
Base Number Matches	1

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	5962-8868101LA	5962-8868105XX	5962-8868101XX	5962-8952406XA	5962-8868106XX	5962-8868101XC	5962-8952404XA
Description	Standard SRAM, 64KX4, 35ns, CMOS, CDIP24, CERAMIC, DIP-24	Standard SRAM, 64KX4, 25ns, CMOS, CQCC28	Standard SRAM, 64KX4, 35ns, CMOS, CQCC28, CERAMIC, LCC-28	Standard SRAM, 64KX4, 20ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24	Standard SRAM, 64KX4, 20ns, CMOS, CQCC28	Standard SRAM, 64KX4, 35ns, CMOS, CQCC28, CERAMIC, LCC-28	Standard SRAM, 64KX4, 35ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24
package instruction	DIP,	QCCN,	QCCN,	DIP, DIP28,.3	QCCN,	QCCN, LCC28,.35X.55	DIP, DIP28,.3
Reach Compliance Code	unknow	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	35 ns	25 ns	35 ns	20 ns	20 ns	35 ns	35 ns
JESD-30 code	R-GDIP-T24	R-CQCC-N28	R-CQCC-N28	R-GDIP-T24	R-CQCC-N28	R-CQCC-N28	R-GDIP-T24
memory density	262144 bi	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1
Number of terminals	24	28	28	24	28	28	24
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	64KX4	64KX4	64KX4	64KX4	64KX4	64KX4	64KX4
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	QCCN	QCCN	DIP	QCCN	QCCN	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	NO	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	NO LEAD	NO LEAD	THROUGH-HOLE	NO LEAD	NO LEAD	THROUGH-HOLE
Terminal location	DUAL	QUAD	QUAD	DUAL	QUAD	QUAD	DUAL
Base Number Matches	1	1	1	1	1	1	1
Parts packaging code	DIP	-	QLCC	DIP	-	DIP	DIP
Contacts	24	-	28	24	-	24	24
Other features	AUTOMATIC POWER-DOWN	TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP; LOW POWER STANDBY	-	-	TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP; LOW POWER STANDBY	AUTOMATIC POWER-DOWN	-
JESD-609 code	e0	-	-	e0	-	e4	e0
length	31.75 mm	13.97 mm	-	31.75 mm	13.97 mm	13.97 mm	31.75 mm
Number of ports	1	-	-	1	-	1	1
Output characteristics	3-STATE	-	-	3-STATE	-	3-STATE	3-STATE
Exportable	NO	-	-	YES	-	NO	YES
Filter level	MIL-STD-883	-	-	38535Q/M;38534H;883B	-	38535Q/M;38534H;883B	38535Q/M;38534H;883B
Maximum seat height	5.08 mm	3.048 mm	-	5.08 mm	3.048 mm	2.03 mm	5.08 mm
Minimum standby current	2 V	-	-	2 V	-	2 V	2 V
Terminal surface	TIN LEAD	-	-	Tin/Lead (Sn/Pb) - hot dipped	-	Gold (Au)	Tin/Lead (Sn/Pb) - hot dipped
Terminal pitch	2.54 mm	1.27 mm	-	2.54 mm	1.27 mm	1.27 mm	2.54 mm
width	7.62 mm	8.89 mm	-	7.62 mm	8.89 mm	8.89 mm	7.62 mm
Maker	-	-	-	LOGIC Devices	LOGIC Devices	LOGIC Devices	LOGIC Devices

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