5962-8868105XX datasheet, PDF - EEWORLD Datasheet

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5962-8868105XX: DescriptionStandard SRAM, 64KX4, 25ns, CMOS, CQCC28; Categorystorage storage; File Size637KB，8 Pages; ManufacturerLOGIC Devices; Websitehttp://www.logicdevices.com/

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5962-8868105XX Overview

Standard SRAM, 64KX4, 25ns, CMOS, CQCC28

5962-8868105XX Parametric

Parameter Name	Attribute value
package instruction	QCCN,
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	25 ns
Other features	TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP; LOW POWER STANDBY
JESD-30 code	R-CQCC-N28
length	13.97 mm
memory density	262144 bit
Memory IC Type	STANDARD SRAM
memory width	4
Number of functions	1
Number of terminals	28
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	64KX4
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	3.048 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
width	8.89 mm
Base Number Matches	1

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5962-8868105XX Related Products

	5962-8868105XX	5962-8868101LA	5962-8868101XX	5962-8952406XA	5962-8868106XX	5962-8868101XC	5962-8952404XA
Description	Standard SRAM, 64KX4, 25ns, CMOS, CQCC28	Standard SRAM, 64KX4, 35ns, CMOS, CDIP24, CERAMIC, DIP-24	Standard SRAM, 64KX4, 35ns, CMOS, CQCC28, CERAMIC, LCC-28	Standard SRAM, 64KX4, 20ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24	Standard SRAM, 64KX4, 20ns, CMOS, CQCC28	Standard SRAM, 64KX4, 35ns, CMOS, CQCC28, CERAMIC, LCC-28	Standard SRAM, 64KX4, 35ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24
package instruction	QCCN,	DIP,	QCCN,	DIP, DIP28,.3	QCCN,	QCCN, LCC28,.35X.55	DIP, DIP28,.3
Reach Compliance Code	unknown	unknow	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	25 ns	35 ns	35 ns	20 ns	20 ns	35 ns	35 ns
JESD-30 code	R-CQCC-N28	R-GDIP-T24	R-CQCC-N28	R-GDIP-T24	R-CQCC-N28	R-CQCC-N28	R-GDIP-T24
memory density	262144 bit	262144 bi	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1
Number of terminals	28	24	28	24	28	28	24
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	64KX4	64KX4	64KX4	64KX4	64KX4	64KX4	64KX4
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED
encapsulated code	QCCN	DIP	QCCN	DIP	QCCN	QCCN	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	CHIP CARRIER	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	NO	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	NO LEAD	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	NO LEAD	NO LEAD	THROUGH-HOLE
Terminal location	QUAD	DUAL	QUAD	DUAL	QUAD	QUAD	DUAL
Base Number Matches	1	1	1	1	1	1	1
Other features	TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP; LOW POWER STANDBY	AUTOMATIC POWER-DOWN	-	-	TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP; LOW POWER STANDBY	AUTOMATIC POWER-DOWN	-
length	13.97 mm	31.75 mm	-	31.75 mm	13.97 mm	13.97 mm	31.75 mm
Maximum seat height	3.048 mm	5.08 mm	-	5.08 mm	3.048 mm	2.03 mm	5.08 mm
Terminal pitch	1.27 mm	2.54 mm	-	2.54 mm	1.27 mm	1.27 mm	2.54 mm
width	8.89 mm	7.62 mm	-	7.62 mm	8.89 mm	8.89 mm	7.62 mm
Parts packaging code	-	DIP	QLCC	DIP	-	DIP	DIP
Contacts	-	24	28	24	-	24	24
JESD-609 code	-	e0	-	e0	-	e4	e0
Number of ports	-	1	-	1	-	1	1
Output characteristics	-	3-STATE	-	3-STATE	-	3-STATE	3-STATE
Exportable	-	NO	-	YES	-	NO	YES
Filter level	-	MIL-STD-883	-	38535Q/M;38534H;883B	-	38535Q/M;38534H;883B	38535Q/M;38534H;883B
Minimum standby current	-	2 V	-	2 V	-	2 V	2 V
Terminal surface	-	TIN LEAD	-	Tin/Lead (Sn/Pb) - hot dipped	-	Gold (Au)	Tin/Lead (Sn/Pb) - hot dipped
Maker	-	-	-	LOGIC Devices	LOGIC Devices	LOGIC Devices	LOGIC Devices

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